Fast and Accurate Fault Localization Through Effective Use of Design Schematics

2019 ◽  
Author(s):  
Ankush Oberai ◽  
Rupa Kamoji ◽  
Arpan Bhattacherjee
Keyword(s):  
Integrated Circuit ◽  
Computer Aided Design ◽  
Fault Localization ◽  
Ic Design ◽  
Design Data ◽  
Root Cause ◽  
Effective Use ◽  
Aided Design ◽  
Improved Accuracy ◽  
Physical Layout

Abstract In modern-day semiconductor failure analysis (FA), the need for computer-aided design (CAD) has extended beyond the sole physical layout to a much larger scope of integrated circuit (IC) design data, such as the source schematic and netlist. Due to the improved accuracy of predicted failures reported by test and diagnosis tools, it has become virtually mandatory to correlate the potential failing schematic features (e.g., nets and instances) to their corresponding location on the physical-CAD layout and actual device under test (DUT). This paper covers the latest advancements of utilizing IC design schematics for fast and accurate fault localization; along with some of the most-effective methodologies for efficient root-cause analysis.

scholarly journals Viability of the Digitalization of Dental Laboratory in Bacolod City

2020 ◽  
Vol 3 (2) ◽  
pp. 31-32
Author(s):  
Paul Brian S. Mendez ◽  
Rizalie N.E. Mibato
Keyword(s):  
Computer Aided Design ◽  
Data File ◽  
Dental Restoration ◽  
Design Data ◽  
Dental Patients ◽  
Computer Aided ◽  
Cad Cam ◽  
Aided Design ◽  
Improved Accuracy ◽  
The City

Dentistry has evolved from its origin to the present day, becoming almost entirely digitized and supervised. The digitalized dental laboratory saves time due to computer-aided design and computer-aided manufacture (CAD/CAM) technology, which will capture and display clients' tooth or teeth and gums on a 3D image on a computer screen sent to the lab.  It enables a dental lab technician to work faster and get the perfect design of the digital dental restoration. The main advantage of digitalization includes faster and improved efficiency on the turn-around time of devices, like crowns and bridges, and improved accuracy of procedures and manufactured gadgets. Digitalization Dental Laboratory (DDL) is the first to offer a digital dental lab in the city of Bacolod. The service allows laboratories to design the prosthesis digitally from in-house CAD software and email the design data provider or download the data file into a proprietary web host or server. The lab will cater to the digital needs of dental patients of the Multi-Specialty Dental Center (a sister company of DDL) and other dental clients.

Circuit Edit Geometric Trends

2013 ◽  
Author(s):  
Michael DiBattista ◽  
Martin Parley ◽  
Don Lyons ◽  
Roddy Cruz ◽  
Alan Wu ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Computer Aided Design ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Integrated Design ◽  
Advanced Technology ◽  
Ic Design ◽  
Deposited Metal ◽  
Aided Design ◽  
Technology Nodes

Abstract Focused ion beam (FIB) tools for backside circuit edit play a major role in the validation of integrated circuit (IC) design modifications. Process scaling is one of many significant challenges, because it reduces the accessible area to modify transistors and IC interconnects in the design. This paper examines the geometries available for FIB nanomachining, via milling/etching, and deposited metal jumpers by analyzing polygon data from computer aided design (CAD) virtual layers gathered across four process technologies, from 180nm down to 28nm. The results of this analysis demonstrate that the combination of silicon nanomachining box length and FIB via box length identifies the most challenging aspects of the FIB edit. The smallest geometries include a 300 nanometer silicon access area with a FIB milled 200 nanometer via inside it. More advanced technology nodes will require the ability to make smaller geometries without the help of integrated design features typically referred to as design for FIB/Debug.

Organizational Politics, Strategic Change and the Evaluation of CAD

1996 ◽  
Vol 11 (1) ◽  
pp. 51-58 ◽  
Author(s):  
Martin Harris
Keyword(s):  
Computer Aided Design ◽  
Strategic Change ◽  
Cost Benefit Analysis ◽  
Cost Benefit ◽  
Senior Management ◽  
Early Adoption ◽  
Long Run ◽  
Sector Analysis ◽  
Effective Use ◽  
Aided Design

This paper uses a ‘case in sector’ analysis to investigate the extent to which the success criteria imposed by cost accounting constrains the ability of engineers to acquire and make effective use of computer aided design (CAD). The paper examines two periods of CAD investment in a sample of UK manufacturers. In the first ‘early adoption’ period CAD proposals were made by junior engineers on a locally initiated ‘bottom up’ basis. Proposals were made according to the dictates of conventional cost benefit analysis, engineering and accounting priorities were separate, and senior management were not involved. In the second ‘general adoption’ period there was a general uptake of CAD throughout the sector. The paper demonstrates that the evaluation of CAD was influenced not just by the rival claims of accountants and engineers, but also by long run changes in the operating environment, and by the control devices employed by senior management. The findings bear out the view of technological change as a socially negotiated process. However, it would appear that the oranizational practices associated with CAD evaluation are continually re-negotiated in the light of dynamic organizational interests and changes in the broader sectoral context.

Microsensors for physical signals: Principles, device design, and fabrication technologies

1996 ◽  
Vol 74 (S1) ◽  
pp. 115-130 ◽  
Author(s):  
Arokia Nathan
Keyword(s):  
Integrated Circuit ◽  
Computer Aided Design ◽  
Electrical Signal ◽  
Single Chip ◽  
Research Activity ◽  
Rapid Pace ◽  
Silicon Based ◽  
Aided Design ◽  
New Generation ◽  
Physical And Chemical

Microsensors are miniaturized devices, fabricated using silicon-based and related technologies, that convert input physical and chemical signals into an output electrical signal. The key driving force in microsensor research has been the integrated circuit (IC) and micromachining technologies. The latter, in particular, is fueling tremendous activity in micro-electromechanical systems (MEMS). In terms of technology and design tools, MEMS is at a stage where microelectronics was 30 years ago and is expected to evolve at an equally rapid pace. The synergy between the IC, micromachining, and integrated photonics technologies can potentially spawn a new generation of microsystems that will feature a unique marriage of microsensor, signal-conditioning and -processing circuitry, micromechanics, and optomechanics possibly on a single chip. In this paper, the physical transduction principles, materials considerations, process-fabrication technologies, and computer-aided-design (CAD) tools will be reviewed along with pertinent examples drawn from our microsensor research activity at the Microelectronics Laboratory, University of Waterloo.

Up Close: The Interuniversity Microelectronics Center (IMEC), Leuven, Belgium

MRS Bulletin ◽  
1989 ◽  
Vol 14 (6) ◽  
pp. 35-38 ◽  
Author(s):  
Dirk Denoyelle
Keyword(s):  
Integrated Circuit ◽  
Computer Aided Design ◽  
Systems Design ◽  
System Level ◽  
Clean Room ◽  
Integrated Circuit Design ◽  
Processing Technologies ◽  
Wide Range ◽  
Application Specific Integrated Circuit ◽  
Aided Design

The Interuniversity Microelectronics Center, Leuven, Belgium (IMEC) is one of the world's largest independent research centers for microelectronics. It was established in 1984 by the Flemish government as a part of a comprehensive program to promote high technology in Flanders, Belgium. Benefiting from existing experience available mainly at the University of Leuven, IMEC moved into its present facilities in 1986 (Figure 1).The Center covers a wide range of research topics in the microelectronics domain—VLSI systems design methodologies, advanced semiconductor processing, materials, packaging, and more.About 50 people work on computer-aided design, developing a series of “true” silicon compilers: CATHEDRAL. With this software, ASIC (application specific integrated circuit) design becomes extremely attractive, since CATHEDRAL covers design from the high system level down to layout.INVOMEC, the training division of IMEC, supports universities in ASIC design. It trains people for both educational institutes and industry in chip design, makes available the necessary software, and has a well-established Multi Project Chip—Multi Project Wafer service.The Processing Technologies and Materials Divisions involve about 200 people and have a 3,600 m2 clean room at their disposal. The clean room consists of a 20% class 10 area with a fast-turnaround prototyping line and an 80% class 1000 area.IMEC's objectives are: to perform research in the microelectronics field, supporting both industry and universities, and to stimulate the microelectronics industry in Flanders.IMEC performs research on both silicon and III-V technologies.

Fault Localization by Finding Schematic of Devices Connecting All Emission Sites in Photon Emission Microscope Image

2017 ◽  
Author(s):  
Ankush Oberai ◽  
Jiann-Shiun Yuan
Keyword(s):  
Failure Analysis ◽  
Computer Aided Design ◽  
Critical Path ◽  
Photon Emission ◽  
Fault Localization ◽  
Microscope Image ◽  
Transmission Gates ◽  
The One ◽  
Switching Mode ◽  
Aided Design

Abstract The work presented here is related to the utilization of computer aided design (CAD) Navigation tools in combination with images from Emission Microscope (EMMI) to improve the accuracy and efficiency of Failure Analysis. The paper presents the flow to quickly identify the failing device by taking the photon emission microscope image and CAD data as input. EMMI is used extensively for detecting leakage current resulting from device defects, e.g., gate oxide defects/ leakage, latch-up, electrostatic discharge (ESD) failure, junction leakage, etc. This emitted light is captured as hotspots on the image. A typical photon emission microscope image has a series of photon emission spots initiated by one physical defect. Not all emission spots may be defects; for example, emissions are shown during normal saturation or switching mode of the transistor. This results in multiple connectivity path between these spots which failure analysis (FA) engineer may want to analyze. The FA engineer wants to detect the one failed device which causes multiple other devices to show false hotspots. The work presented in this paper involves identifying all the devices beneath the hotspot areas, processing the connectivity of the found devices and extracting the schematic for all the devices beneath these hotspots. The connectivity between the devices could be direct connections through nets or indirect through “transmission gates”. The extracted schematic helps the FA engineer focus the FA work on critical devices such as a driver and enables faster and more accurate fault localization. The work in the paper shows the extraction of critical path of devices and their connectivity.

Designing the Future DDG 51 Class Computer Aided Design

1993 ◽  
Author(s):  
Joanne J. Ouillette
Keyword(s):  
World War Ii ◽  
Computer Aided Design ◽  
Word Meaning ◽  
Numerical Control ◽  
Design Data ◽  
Support Tool ◽  
Ship Construction ◽  
Computer Aided ◽  
3D Database ◽  
Aided Design

Abstract The DDG 51 Class of AEGIS guided missile destroyers is the Navy’s premier surface combatant. Named for famed World War II hero. Admiral Arleigh Burke, these ships represent state-of-the-art technology. This 504 foot, 8,300 ton destroyer has been designed with improved seakeeping and survivability characteristics and carries the sophisticated AEGIS Weapon System. Derived from the Greek word meaning “shield”, AEGIS ships are the “shield of the fleet”. The Navy has commissioned the first two ships of the class. They have performed beyond expectation in rigorous at-sea trials designed to fully test combat capability. The DDG 51 Class ships are replacing retiring fleet assets. In a decreasing Department of Defense (DoD) budget environment, however, acquisition costs must be reduced to continue to build capable warships. The Navy’s Destroyer Program Office is pursuing the implementation of Computer Aided Design (CAD) and Computer Aided Manufacturing (CAM) technology to reduce costs without reducing ship’s capability. Under Navy direction, the ship construction yards, Bath Iron Works and Ingalls Shipbuilding, are aggressively pursuing the transition to CAD-based design, construction, and life cycle support This effort also involves General Electric, the Combat System Engineering Agent. Building a three dimensional (3D) computer model of the ship prior to construction will facilitate the identification and resolution of interferences and interface problems that would otherwise go undetected until actual ship construction. This 3D database contains geometry and design data to support system design. Accurate construction drawings, fabrication sketches, and Numerical Control (NC) data can be extracted directly from the database to support construction at each shipyard. At completion of construction, a model representing the “as built” configuration will be provided as a lifetime support tool for each ship’s projected 40 year life. The transition to CAD-based design and construction has applied fundamental concepts of the DoD’s Computer Aided Acquisition and Logistic Support (CALS) initiative. In addition to creating a 3D database representing ship design, the shipyards have developed a neutral file translator to exchange this data between Computervision and Calma CAD systems in operation at Bath Iron Works and Ingalls Shipbuilding respectively. This object oriented transfer capability ensures data is shared rather than duplicated. The CALS concepts of concurrent engineering and computer aided engineering analysis are being applied to design an upgrade to the ship that features the addition of a helicopter hanger. The CAD models are used as an electronic baseline from which to assess proposed modifications. Optimizing the design before the first piece of steel is cut will reduce construction costs and improve the quality of the ship.

Development of a Vehicle Modeling Function for Three-Dimensional Shape Optimization

2009 ◽  
Vol 131 (12) ◽  
Author(s):  
Joo-Hyun Rho ◽  
Yo-Cheon Ku ◽  
Jung-Do Kee ◽  
Dong-Ho Lee
Keyword(s):  
Computer Aided Design ◽  
Three Dimensional ◽  
Developmental Time ◽  
Design Data ◽  
Vehicle Modeling ◽  
Aerodynamic Shape ◽  
Design Variables ◽  
Ordinary Point ◽  
Vehicle Modeling Function ◽  
Aided Design

Representation of a complex three-dimensional (3D) shape requires extensive computer-aided design data consisting of millions (or tens of millions) of approximated discontinuous points. The quantity of data makes it difficult or impossible to efficiently optimize the entire shape. We present a vehicle-modeling function in the form of an exponential function to smoothly express the complex two-dimensional and 3D curved shapes of an automobile. This modeling function can modify and optimize the shape with fewer design variables compared with ordinary point-fitting methods. The subsectional parts of the vehicle-modeling function are defined as section functions by classifying each subsection of the automobile configuration as a section box model. The proposed approach is suitable for remodeling existing automobiles and for newly designed automobiles. The entire 3D aerodynamic shape of an automobile can be created using a set of the proposed modeling functions, which define a combination of section boxes. A 3D aerodynamic shape was developed to verify that the optimization of the shape was practical. This capability may help to reduce the developmental time or cost of automobiles and similarly complex systems. In addition, the proposed approach can be expanded to other fields of engineering.

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