scholarly journals Influence of annealing temperature on reversible resistive switching of WOx thin filmsdeposited on FTO substrate

2014 ◽  
Vol 17 (3) ◽  
pp. 12-18
Author(s):  
Tam Thi Bang Dao ◽  
Thang Bach Pham

In this work, we investigated effects of the annealing temperature on the crystalline, morphology of sputtered WOx thin films. The resutls show that as-deposited WOx thin films and annealed WOxthin films at 300oC, 600oC in the air are in monoclinic phase. As the annealing temperature increases, crystallinity of WOx thin films enhances with high(200) orientation. FESEM images showed larger grain size, and denser films at high annealing temperatures. The reversible resistance switching characteristics of the Ag/WOx/FTO structure follows bipolar type, the switching ratio decreases as the crystallinity of WOx thin films increases under an the annealing treatment.

2006 ◽  
Vol 118 ◽  
pp. 31-34 ◽  
Author(s):  
Won Jong Nam ◽  
Hyung Rak Song ◽  
Kyung Tae Park

The effects of annealing temperature and annealing time on mechanical properties of cold drawn pearlitic steel wires containing 0.84wt% of silicon were investigated. Annealing treatment was performed on cold drawn steel wires for the temperature range of 200°C to 450°C with the different annealing time of 30sec, 1min, 15min and 1hr. The increase of tensile strength at the low annealing temperatures would be related with strain ageing behavior, while the decrease of tensile strength at the high annealing temperature is due to the spheroidization of cementite plates and the occurrence of recovery of the lamellar ferrite in the pearlite.


2012 ◽  
Vol 482-484 ◽  
pp. 1105-1110
Author(s):  
Shu Juan Zhang ◽  
Ming Sheng Li ◽  
Zhi Qin Chen ◽  
Yong Zhong Fan

The N-doped TiO2thin films were deposited on medical glass slide by pulsed negative bias arc ion plating. The influence of pulsed negative bias, annealing temperature and time on films properties was investigated. Film structure, surface morphologies and optical properties were measured with XRD, SEM and UV-VIS transmittance spectroscope. Photo-catalytic performance of the films was evaluated by degrading methyl orange. The results show that the absorption edges of the as-deposited films increase with the rising of the pulse negative bias, and the maximum of 550 nm is achieved under -600V bias. The films absorption edges increase in different degree after annealing at 400°Cand 500°Cfor 2h, and the best extending can increase 22nm after annealing. The diffraction peak intensity and surface grain size increase with increasing the annealing temperature and time. The grain size of films after annealing at 400°C for 4h is largest of all the films. The pulsed negative bias and annealing treatment not only indecrease TiO2thin films the UV catalytic performance, but also extend the catalytic properties to the sunlight.


RSC Advances ◽  
2018 ◽  
Vol 8 (51) ◽  
pp. 29179-29188 ◽  
Author(s):  
Le Shi ◽  
Sifei Zhuo ◽  
Mutalifu Abulikemu ◽  
Gangaiah Mettela ◽  
Thangavelu Palaniselvam ◽  
...  

The effects of annealing treatment on crystallization behavior, grain size, electrochemical (EC) and photoelectrochemical (PEC) oxygen evolution reaction (OER) performances of bismuth vanadate (BiVO4) thin films are investigated in this work.


2012 ◽  
Vol 512-515 ◽  
pp. 1736-1739
Author(s):  
Li Li Zhang ◽  
Guo Qiang Tan ◽  
Meng Cheng ◽  
Hui Jun Ren ◽  
Ao Xia

Fe(NO3)3•9H2O and Bi(NO3)3•5H2O were used as raw materials. BiFeO3 thin films were prepared by sol-gel method. The effects of annealing temperatures on the morphology and dielectric property of the thin films were studied. XRD results show that the multi-crystal thin films with pure phase are obtained when annealed at 500°C and 550°C. But annealing at 580°C will lead to the appearance of Bi2.46Fe5O12 phase.AFM images show that as the increase of annealing temperatures the surface toughness of the thin film is decreased, but the surface undulation of the thin films is decreased gradually. Within the frequency range of 1KHz~1MHz, the dielectric constant of BiFeO3 thin films is kept over 125 and it does not change very much from 500°C to 580°C. Annealed at 550°C, the BiFeO3 thin films with the lower loss are obtained. At 1MHz, the dielectric loss is 0.12.


2001 ◽  
Vol 685 ◽  
Author(s):  
Won-Jae Lee ◽  
Chang-Ho Shin ◽  
In-Kyu You ◽  
Il-Suk Yang ◽  
Sang-Ouk Ryu ◽  
...  

AbstractThe SrTa2O6 (STO) thin films were prepared by plasma enhanced atomic layer deposition (PEALD) with alternating supply of reactant sources, Sr[Ta(C2H5O)5(C4H10NO)]2 {Strontium bis-[tantalum penta-ethoxide dimethyllaminoethoxide]; Sr(Ta(OEt)5▪dmae)2} and O2plasma. It was observed that the uniform and conformal STO thin films were successfully deposited using PEALD and the film thickness per cycle was saturated at about 0.8 nm at 300°C. Electrical properties of SrTa2O6 (STO) thin films prepared on Pt/SiO2/Si substrates with annealing temperatures have been investigated. While the grain size and dielectric constant of STO films increased with increasing annealing temperature, the leakage current characteristics of STO films slightly deteriorated. The leakage current density of a 40nm-STO film was about 5×10−8A/cm2 at 3V.


1982 ◽  
Vol 18 ◽  
Author(s):  
L. Krusin-Elbaum ◽  
M. Wittmer ◽  
C.-Y. Ting ◽  
J. J. Cuomo

We have studied reactively sputtered ZrN, the most thermally stable of the refractory metal nitrides, for its diffusion barrier properties in aluminum metallization schemes with Rutherford backscattering spectroscopy and transmission electron microscopy (TEM). We find this compound to be very effective against aluminum diffusion up to 500 °C, independently of substrate temperature during sputtering. The useful temperature range can be extended by 50 °C with proper preannealing prior to aluminum deposition. The TEM study of the ZrN grain size as a function of annealing temperature revealed that the grain size does not change significantly upon annealing and that the grains are relatively small even at the highest annealing temperatures (about 300 Å at 900 °C). In addition, for annealing temperatures of and below 500 °C large portions of ZrN films were found to be of either amorphous or extremely fine–grain material, thus inhibiting the diffusion along grain boundaries. The presence of Zr3Al4Si5 ternary compound in samples annealed at 600 °C, as determined by X-ray analysis, may suggest that the ZrN barrier fails by decomposition of the film by aluminum.


2019 ◽  
Vol 14 (1) ◽  
pp. 53-63 ◽  
Author(s):  
M. S. Bashar ◽  
Rummana Matin ◽  
Munira Sultana ◽  
Ayesha Siddika ◽  
M. Rahaman ◽  
...  

AbstractThe ZnS thin films have been deposited by radio frequency magnetron sputtering at room temperature. Post-deposition rapid thermal annealing treatment was done for the films deposited at different powers ranging from 70 to 100 W. One peak is observed for as-deposited and annealed thin films at around 28.48° corresponding to the (111) reflection plane indicating a zincblende structure. The overall intensity of the peaks and the FWHM values of as-deposited films increased after annealing corresponding to the increase in crystallinity. The optical energy bandgap is found in the range of 3.24–3.32 eV. With increasing annealing temperature, the decrease in the Urbach energy values indicating a decrease in localized states which is in good agreement with the XRD results where the crystallinity increased. The surface morphology of the films seems to be composed of Nano-granules with a compact arrangement. Apparently, the grain size increases in the deposited films as annealing temperature increases. The compositional ratio attained close to the stoichiometric ratio of 1:1 after annealing. From the Hall effect measurement, the carrier concentration and mobility are found to increase after annealing. The high carrier concentration and mobility also comply with structural and optical analysis. Best results are found for the film annealed at 400 °C deposited at 90 W.


2019 ◽  
Vol 2019 ◽  
pp. 1-10
Author(s):  
Faheem Amin ◽  
Syedah Afsheen Zahra ◽  
Muhammad Sultan ◽  
Sajjad Hussain Mirza ◽  
Fahad Azad

Bilayer thin films of Ge/CdS have been deposited on a glass substrate through thermal evaporation method. The obtained Ge/CdS samples were annealed at temperatures up to 400°C to observe the resulting effect on the structural changes in the film. The bandgap of the annealed films was found to increase with increasing annealing temperature which can be attributed to the increased interlayer diffusion. The interlayer diffusion was found to take effect above a temperature of 300°C which was confirmed by the Rutherford backscattering technique. Complementary XPS was done to investigate the surface stoichiometry of the bilayers.


2008 ◽  
Vol 368-372 ◽  
pp. 1814-1816
Author(s):  
Dan Xie ◽  
Zhi Gang Zhang ◽  
Tian Ling Ren ◽  
Li Tian Liu

{0.75SrBi2Ta2O9-0.25Bi3TiTaO9}(SBT-BTT) thin films were prepared by the modified metalorganic solution deposition (MOSD) technique. The microstructure and ferroelectric properties of SBTBTT thin films were studied. The SBT-BTT thin films were produced at 750°C. The grain size and surface roughness of SBT-BTT films showed significant enhancement with an increase in annealing temperatures. It is found that SBT-BTT thin films have good ferroelectric properties. The measured remanent polarization values for SBT-BTT, SBT and BTT capacitors were 15, 7.5 and 4.8μC/cm2, respectively. The coercive field for SBT-BTT capacitors was 50kV/cm. More importantly, the polarization of SBT-BTT capacitors only decreased 5% after 1011 switching cycles at a frequency of 1MHz.


2011 ◽  
Vol 328-330 ◽  
pp. 1153-1156 ◽  
Author(s):  
Kun Zhong ◽  
Yan Dong Xia ◽  
Ju Hong Miao ◽  
Jiang Fu

Si and Ge ions are implanted into SiO2thin films, subsequently the annealing treatment are carried out. The samples exhibit photoluminescence (PL) peaks at 400, 470, 550 and 780 nm. With the annealing temperature increasing, the intensity of 400-470 nm PL band increases remarkably. After oxidation annealing treatment, the intensity of 400-470 nm PL band decreases, and that of 550 nm and 780 nm PL peaks rises. Combing with the results of X-ray photoelectron spectroscopy(XPS), X-ray diffraction (XRD) and PL measurement, we propose that the PL peaks at 400 nm, 470 nm, 550 nm and 780 nm originate from ≡Ge−Si≡ center, ≡Si−Si≡ center, SPR center and GeO center, respectively.


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