scholarly journals High Refractive Index Electromagnetic Devices in Printed Technology Based on Glide-Symmetric Periodic Structures

2020 ◽  
Vol 10 (9) ◽  
pp. 3216 ◽  
Author(s):  
Philip Arnberg ◽  
Oscar Barreira Petersson ◽  
Oskar Zetterstrom ◽  
Fatemeh Ghasemifard ◽  
Oscar Quevedo-Teruel
Keyword(s):  
Refractive Index ◽  
Printed Circuit Board ◽  
Periodic Structures ◽  
High Refractive Index ◽  
Circuit Board ◽  
Beneficial Effects ◽  
Electromagnetic Devices ◽  
Symmetric Structure ◽  
Peak Transmission ◽  
5 Ghz

We demonstrate the beneficial effects of introducing glide symmetry in a two-dimensional periodic structure. Specifically, we investigate dielectric parallel plate waveguides periodically loaded with Jerusalem cross slots in three configurations: conventional, mirror- and glide-symmetric. Out of these three configurations, it is demonstrated that the glide-symmetric structure is the least dispersive and has the most isotropic response. Furthermore, the glide-symmetric structure provides the highest effective refractive index, which enables the realization of a broader range of electromagnetic devices. To illustrate the potential of this glide-symmetric unit cell, a Maxwell fish-eye lens is designed to operate at 5 GHz. The lens is manufactured in printed circuit board technology. Simulations and measurements are in good agreement and a measured peak transmission coefficient of −0.5 dB is achieved.

Simple and Low-Cost Dual-Band Printed Microwave Absorber for 2.4- and 5-GHz-Band Applications

Frequenz ◽  
2017 ◽  
Vol 71 (11-12) ◽  
Author(s):  
Ekajit Khoomwong ◽  
Chuwong Phongcharoenpanich
Keyword(s):  
Printed Circuit Board ◽  
Incidence Angle ◽  
Low Cost ◽  
Absorption Capacity ◽  
Microwave Absorber ◽  
Circuit Board ◽  
Dual Band ◽  
Measured Absorption ◽  
5 Ghz ◽  
Good Agreement

AbstractIn this research, a dual-band thin printed-circuit-board (PCB) microwave absorber has been proposed for applications in 2.4 and 5 GHz frequency bands. Each unit cell of the absorber consists of a square ring and a thick cross-dipole, augmented with the tuning elements. In the design process, numerical simulations were performed for the optimal characteristics of the absorber and an absorber prototype was fabricated using the simple print-transferring and etching process. The measured absorption bandwidths (50 %) of 170 MHz (2.36–2.53 GHz) and 830 MHz (5.09–5.92 GHz) were achieved for the first and second bands, respectively, with the wideband characteristic at the second operating band. The absorption rates near the center frequencies (2.45 and 5.5 GHz) were respectively 97.85 % and 97.76 %. The simulation and measured results are in good agreement. Furthermore, the incidence-angle dependencies of the absorber were of moderately wide angles with the absorption capacity of at least 50 % for both operating bands. The proposed absorber is suitable for a variety of applications requiring absorption in the 2.4/5 GHz bands.

Characteristics of Radiated Emission from a Printed Circuit Board with a Slit

2012 ◽  
Vol 132 (6) ◽  
pp. 404-410 ◽  
Author(s):  
Kenichi Nakayama ◽  
Kenichi Kagoshima ◽  
Shigeki Takeda
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit ◽  
Radiated Emission

Confirming the Signal Integrity in Transmission of Digital Signals on Microstrip Straight Circuits via the Eye Diagrams

2014 ◽  
Vol 5 (1) ◽  
pp. 737-741
Author(s):  
Alejandro Dueñas Jiménez ◽  
Francisco Jiménez Hernández
Keyword(s):  
Integrated Circuits ◽  
Printed Circuit Board ◽  
Signal Integrity ◽  
High Volume ◽  
Information Storage ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Electronic Systems ◽  
Digital Signals ◽  
Printed Circuit

Because of the high volume of processing, transmission, and information storage, electronic systems presently requires faster clock speeds tosynchronizethe integrated circuits. Presently the “speeds” on the connections of a printed circuit board (PCB) are in the order of the GHz. At these frequencies the behavior of the interconnects are more like that of a transmission line, and hence distortion, delay, and phase shift- effects caused by phenomena like cross talk, ringing and over shot are present and may be undesirable for the performance of a circuit or system.Some of these phrases were extracted from the chapter eight of book “2-D Electromagnetic Simulation of Passive Microstrip Circuits” from the corresponding author of this paper.

DIDACTIC MODEL OF LIFT

2018 ◽  
pp. 219-224
Author(s):  
Lubica Miková
Keyword(s):  
Printed Circuit Board ◽  
Base Plate ◽  
Educational Process ◽  
Circuit Board ◽  
Basic Knowledge ◽  
Practical Training ◽  
Target Setting ◽  
Lower Base ◽  
Complex Design ◽  
Starting Point

Urgency of the research. Mechatronics products become more sophisticated and complicated. Mechatronic engineers should be prepared for this complex design process. Practical experimental model helps improve educational process as preparing for practice. Target setting. Miniaturized model of the lift suitable for practical training on subjects focused to microcontrollers, sen-sors, actuators etc. Students have possibility to make practice on laboratory exercises, where they can verify theoretical knowledge obtained on lectures. The arrangement of the model has modular character, because of possibility to rearrange or adding of new function into model. The aim was to create minimized model of real lift with all functions and systems. Actual scientific researches and issues analysis. Many universities are oriented only to finished robotic kits and do not support creativity of students. Open access and open structure model missing in this field. There is a need for fast prototyping model, which allows the creation of new design of product. Uninvestigated parts of general matters defining. The question of the design of printed circuit board are uninvestigated, because they need more time than allows normal exercises. The research objective. The main aim of educational process is to educate engineers with basic knowledge, skills and handicraft. Practical models help as support devices for fulfil of this aim. All mechatronic students can practice a training on these practical models. They become as more skilled and well-oriented engineers.. The statement of basic materials. Construction consist of upper and lower base plate connected with four pillars used as linear guide for moving of lift cage. Lower base plate includes base microcontrollers boards, resistor network, power transis-tor array board, power supply terminals, relay modules, PWM module and signals terminals. Upper base plate consist of DC motor with gearing and screw mechanism for moving the lift cage. Conclusions. The model enables supports the creativity of the students. The starting point of the using of the model can be without any wired connections. Students should connect every part and try functionality of every function. The students receive the defined several problems and they have to analyze it and make any proposal for solution of defined problems.

Accelerated Discovery of High-Refractive-Index Polyimides via First-Principles Molecular Modeling, Virtual High-Throughput Screening, and Data Mining

2019 ◽  
Author(s):  
Mohammad Atif Faiz Afzal ◽  
Mojtaba Haghighatlari ◽  
Sai Prasad Ganesh ◽  
Chong Cheng ◽  
Johannes Hachmann
Keyword(s):  
Data Mining ◽  
Refractive Index ◽  
High Throughput ◽  
First Principles ◽  
High Throughput Screening ◽  
Large Scale ◽  
Computational Study ◽  
High Refractive Index ◽  
Structural Features ◽  
Learning Program

<div>We present a high-throughput computational study to identify novel polyimides (PIs) with exceptional refractive index (RI) values for use as optic or optoelectronic materials. Our study utilizes an RI prediction protocol based on a combination of first-principles and data modeling developed in previous work, which we employ on a large-scale PI candidate library generated with the ChemLG code. We deploy the virtual screening software ChemHTPS to automate the assessment of this extensive pool of PI structures in order to determine the performance potential of each candidate. This rapid and efficient approach yields a number of highly promising leads compounds. Using the data mining and machine learning program package ChemML, we analyze the top candidates with respect to prevalent structural features and feature combinations that distinguish them from less promising ones. In particular, we explore the utility of various strategies that introduce highly polarizable moieties into the PI backbone to increase its RI yield. The derived insights provide a foundation for rational and targeted design that goes beyond traditional trial-and-error searches.</div>

Root Cause Analysis of a Connector Time-Delayed Fracture

2015 ◽  
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis
Keyword(s):  
Printed Circuit Board ◽  
Ceramic Substrate ◽  
Circuit Board ◽  
Delayed Fracture ◽  
Ceramic Substrates ◽  
Printed Circuit ◽  
Root Cause ◽  
Chip Carrier ◽  
Electrical Connections ◽  
Grain Boundary Grooves

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.

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