Simple and Low-Cost Dual-Band Printed Microwave Absorber for 2.4- and 5-GHz-Band Applications

Frequenz ◽  
2017 ◽  
Vol 71 (11-12) ◽  
Author(s):  
Ekajit Khoomwong ◽  
Chuwong Phongcharoenpanich
Keyword(s):  
Printed Circuit Board ◽  
Incidence Angle ◽  
Low Cost ◽  
Absorption Capacity ◽  
Microwave Absorber ◽  
Circuit Board ◽  
Dual Band ◽  
Measured Absorption ◽  
5 Ghz ◽  
Good Agreement

AbstractIn this research, a dual-band thin printed-circuit-board (PCB) microwave absorber has been proposed for applications in 2.4 and 5 GHz frequency bands. Each unit cell of the absorber consists of a square ring and a thick cross-dipole, augmented with the tuning elements. In the design process, numerical simulations were performed for the optimal characteristics of the absorber and an absorber prototype was fabricated using the simple print-transferring and etching process. The measured absorption bandwidths (50 %) of 170 MHz (2.36–2.53 GHz) and 830 MHz (5.09–5.92 GHz) were achieved for the first and second bands, respectively, with the wideband characteristic at the second operating band. The absorption rates near the center frequencies (2.45 and 5.5 GHz) were respectively 97.85 % and 97.76 %. The simulation and measured results are in good agreement. Furthermore, the incidence-angle dependencies of the absorber were of moderately wide angles with the absorption capacity of at least 50 % for both operating bands. The proposed absorber is suitable for a variety of applications requiring absorption in the 2.4/5 GHz bands.

scholarly journals Performance Evaluation of Wide-Angle Ultrathin Microwave Metamaterial Absorber with Polarization Independence

2018 ◽  
Vol 7 (4) ◽  
pp. 71-77 ◽  
Author(s):  
K. P. Kaur ◽  
T. Upadhyaya
Keyword(s):  
Incidence Angle ◽  
Low Cost ◽  
Metamaterial Absorber ◽  
Dual Band ◽  
Physical Parameters ◽  
Wide Angle ◽  
Absorption Frequency ◽  
Radar Systems ◽  
Rf Absorber ◽  
Good Agreement

A novel dual-band wide-angle ultra-thin absorber composed of dual closed-concentric ten-point stars with polarization independence is presented in this article. The ten-point stars formed resonators are engraved on low cost FR4 substrate. The EM absorber performance is studied in terms of electrical and physical parameters. The polarization independence is practically demonstrated using waveguide measurement method. The measured results are in good agreement with simulated results. The absorbance values of 99.37% and 97.18% are achieved at 2.13 GHz and 2.52 GHz, respectively. The presented absorber design is wide-angle RF absorber with high absorbance values of about 80% up to 60° under TE mode and 87% up to 75° of oblique incidence angle for TM mode excitations. The experimental results demonstrate the absorption effectiveness of the proposed design to be utilized in RF energy harvester modules for capturing ambient UMTS band signals and in RF absorber applications for S band radar systems. The presented absorber unit cell is ultrathin and compact with the thickness and size less than λ/56 mm and λ/5 mm, respectively, at lowest absorption frequency.

scholarly journals Design of a Dual-Band Bidirectional Antenna Using Superellipse-Monopole-Fed Rectangular Ring for IEEE 802.11 a/b/g/n Applications

2016 ◽  
Vol 2016 ◽  
pp. 1-11
Author(s):  
Ekajit Khoomwong ◽  
Chuwong Phongcharoenpanich
Keyword(s):  
Method Of Moments ◽  
Low Cost ◽  
Field Tests ◽  
Dual Band ◽  
Impedance Bandwidth ◽  
Surface Probe ◽  
Ring Antenna ◽  
Measured Impedance ◽  
5 Ghz ◽  
Good Agreement

This paper presents the design of a dual-band bidirectional ring antenna fed by a superellipse surface probe for 2.4/5 GHz WLAN applications. The Method of Moments (MoM) with RWG basis function was utilized in the study and design processes. A prototype antenna was fabricated successfully with the advantages of simple and low-cost structure. The measured impedance bandwidth of 810 MHz (2.10–2.91 GHz) and 2.39 GHz (3.57–5.96 GHz) is achieved for the first and second band, respectively. The peak gains are also feasible, 4.67 dBi at 2.45 GHz and 7.83 dBi at 5.5 GHz, with bidirectional radiation patterns for both bands. From the experimental field tests, the proposed antenna was suitable for most applications in long and narrow communication sites in 2.4/5 GHz bands as desired. Also, the measured and calculated results were in good agreement.

A Novel Wideband transition from Substrate Integrated Waveguide to Rectangular Waveguide

2020 ◽  
Vol 10 ◽  
Author(s):  
Keyur Mahant ◽  
Hiren Mewada ◽  
Amit Patel ◽  
Alpesh Vala ◽  
Jitendra Chaudhari
Keyword(s):  
Rectangular Waveguide ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Single Layer ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Ka Band ◽  
Better Than ◽  
Millimeter Wave Circuits ◽  
Wideband Transition

Aim: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed Objective: In this article, wideband substrate integrated waveguide (SIW) and rectangular waveguide (RWG) transition operating in Ka-band is proposed. Method: Coupling patch etched on the SIW cavity to couple the electromagnetic energy from SIW to RWG. Moreover, metasurface is introduced into the radiating patch to enhance bandwidth. To verify the functionality of the proposed structure back to back transition is designed and fabricated on a single layer substrate using standard printed circuit board (PCB) fabrication technology. Results: Measured results matches with the simulation results, measured insertion loss is less than 1.2 dB and return loss is better than 3 dB for the frequency range of 28.8 to 36.3 GHz. By fabricating transition with 35 SRRs bandwidth of the proposed transition can be improved. Conclusion: The proposed transition has advantages like compact in size, easy to fabricate, low cost and wide bandwidth. Proposed structure is a good candidate for millimeter wave circuits and systems.

scholarly journals Compact Modelling of Electrical, Optical and Thermal Properties of Multi-Colour Power LEDs Operating on a Common PCB

Energies ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1286
Author(s):  
Krzysztof Górecki ◽  
Przemysław Ptak
Keyword(s):  
Integrated Circuits ◽  
Optical Model ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Junction Temperature ◽  
Optical Parameters ◽  
Spice Simulation ◽  
Light Emitting ◽  
Proposed Model ◽  
Good Agreement

This paper concerns the problem of modelling electrical, thermal and optical properties of multi-colour power light-emitting diodes (LEDs) situated on a common PCB (Printed Circuit Board). A new form of electro-thermo-optical model of such power LEDs is proposed in the form of a subcircuit for SPICE (Simulation Program with Integrated Circuits Emphasis). With the use of this model, the currents and voltages of the considered devices, their junction temperature and selected radiometric parameters can be calculated, taking into account self-heating phenomena in each LED and mutual thermal couplings between each pair of the considered devices. The form of the formulated model is described, and a manner of parameter estimation is also proposed. The correctness and usefulness of the proposed model are verified experimentally for six power LEDs emitting light of different colours and mounted on an experimental PCB prepared by the producer of the investigated devices. Verification was performed for the investigated diodes operating alone and together. Good agreement between the results of measurements and computations was obtained. It was also proved that the main thermal and optical parameters of the investigated LEDs depend on a dominant wavelength of the emitted light.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

scholarly journals A compact low-noise frontend for interleaved Rx/Tx arrays at K-/Ka-Band

2021 ◽  
pp. 1-7
Author(s):  
Anton Sieganschin ◽  
Thomas Jaschke ◽  
Arne F. Jacob
Keyword(s):  
Insertion Loss ◽  
Printed Circuit Board ◽  
Noise Figure ◽  
Low Noise ◽  
Single Band ◽  
Circuit Board ◽  
Dual Band ◽  
Ka Band ◽  
Compression Properties ◽  
The Individual

Abstract This contribution deals with a frontend for interleaved receive (Rx)-/transmit (Tx)-integrated phased arrays at K-/Ka-band. The circuit is realized in printed circuit board technology and feeds dual-band Rx/Tx- and single-band Tx-antenna elements. The dual-band element feed is composed of a substrate-integrated waveguide (SIW) diplexer with low insertion loss, a low-noise amplifier (LNA), a bandpass filter, and several passive transitions. The compression properties of the LNA are identified through two-tone measurements. The results dictate the maximum allowable output power of the power amplifier. The single band feed consists of a SIW with several transitions. Simulation and measurement results of the individual components are presented. The frontend is assembled and measured. It exhibits an Rx noise figure of 2 dB, a Tx insertion loss of ~ 2.9 dB, and an Rx/Tx-isolation of 70 dB. The setup represents the unit cell of a full array and thus complies with the required half-wave spacing at both Rx and Tx.

EFFECT OF HYDROTHERMAL TIME ON THE GROWTH OF ZnO NANORODS

2020 ◽  
pp. 84-91
Author(s):  
Hanh
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Cell Structure ◽  
Zno Nanorods ◽  
Zinc Nitrate ◽  
Circuit Board ◽  
Nitrate Hexahydrate ◽  
Hydrothermal Time ◽  
One Step ◽  
Surface Morphologies

In this work, ZnO nanorods (NRs) were successfully grown on printed circuit board substrates (PCBs) by utilizing a one-step, seedless, low-cost hydrothermal method. It was shown that by implementing a galvanic cell structure in an aqueous solution of 80 mM of zinc nitrate hexahydrate and hexamethylenetetramine, ZnO NRs can directly grow on the PCBs substrate without the assistance of a seed layer. The effect of hydrothermal time on the surface morphologies, and the crystallinity of the as-grown ZnO nanorods (NRs) was also investigated. The as-grown ZnO NRs also exhibited a significant enhancement in vertical growth and their crystallinity with 5 hour growth.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

scholarly journals A Compact High-Pass Filter Using Hybrid Microstrip/Nonuniform CPW with Dual-Mode Resonant Response

2016 ◽  
Vol 2016 ◽  
pp. 1-7
Author(s):  
Hui Chen ◽  
Di Jiang ◽  
Ke-Song Chen ◽  
Hong-Fei Zhao
Keyword(s):  
Printed Circuit Board ◽  
Coplanar Waveguide ◽  
Cutoff Frequency ◽  
Circuit Board ◽  
Dual Mode ◽  
Pass Filter ◽  
High Pass Filter ◽  
Mode Characteristic ◽  
High Pass ◽  
Good Agreement

A novel and miniature high-pass filter (HPF) based on a hybrid-coupled microstrip/nonuniform coplanar waveguide (CPW) resonator is proposed in this article, in which the designed CPW has exhibited a wideband dual-mode characteristic within the desired high-pass frequency range. The implemented filter consists of the top microstrip coupled patches and the bottom modified nonuniformly short-circuited CPW resonator. Simulated results from the electromagnetic (EM) analysis software and measured results from a vector network analyzer (VNA) show a good agreement. A designed and fabricated prototype filter having a 3 dB cutoff frequency (fc) of 5.78 GHz has shown an ultrawide high-pass behavior, which exhibits the highest passband frequency exceeding 4.0fcunder the minimum insertion loss (IL) 0.75 dB. The printed circuit board (PCB) area of the filter is approximately0.062λg×0.093λg, whereλgis the guided wavelength atfc.

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