scholarly journals Optimization of Wet Grinding Conditions of Sheets Made of Stainless Steel

2020 ◽  
Vol 4 (4) ◽  
pp. 114
Author(s):  
Akira Mizobuchi ◽  
Atsuyoshi Tashima
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
Rotational Speed ◽  
Grinding Wheel ◽  
Grinding Wheels ◽  
Steel Sheets ◽  
Wet Grinding ◽  
Grinding Fluid ◽  
Dry Grinding ◽  
Grinding Conditions

This study addresses the wet grinding of large stainless steel sheets, because it is difficult to subject them to dry grinding. Because stainless steel has a low thermal conductivity and a high coefficient of thermal expansion, it easily causes grinding burn and thermal deformation while dry grinding on the wheel without applying a cooling effect. Therefore, wet grinding is a better alternative. In this study, we made several types of grinding wheels, performed the wet grinding of stainless steel sheets, and identified the wheels most suitable for the process. As such, this study developed a special accessory that could be attached to a wet grinding workpiece. The attachment can maintain constant pressure, rotational speed, and supply grinding fluid during work. A set of experiments was conducted to see how some grinding wheels subjected to some grinding conditions affected the surface roughness of a workpiece made of a stainless steel sheet (SUS 304, according to Japanese Industrial Standards: JIS). It was found that the roughness of the sheet could be minimized when a polyvinyl alcohol (PVA) grinding wheel was used as the grinding wheel and tap water was used as the grinding fluid at an attachment pressure of 0.2 MPa and a rotational speed of 150 rpm. It was shown that a surface roughness of up to 0.3 μm in terms of the arithmetic average height could be achieved if the above conditions were satisfied during wet grinding. The final surface roughness was 0.03 μm after finish polishing by buffing. Since the wet grinding of steel has yet to be studied in detail, this article will serve as a valuable reference.

Optimizing the Dry Grinding Process on the Basis of Bond Materials

2014 ◽  
Vol 1017 ◽  
pp. 237-242
Author(s):  
Heike Kitzig ◽  
Nima Jandaghi ◽  
Bahman Azarhoushang ◽  
Alireza Vesali
Keyword(s):  
Surface Roughness ◽  
Process Efficiency ◽  
Grinding Wheel ◽  
Formation Mechanisms ◽  
Grinding Process ◽  
Grinding Wheels ◽  
Wet Grinding ◽  
Dry Grinding ◽  
Conventional Grinding ◽  
Selection Of

In order to decrease the negative environmental impacts of the cutting fluids (for example, disposal of grinding sludge) and also to reduce the manufacturing costs and the required space for the machines the dry grinding can be a conceivable alternative for the conventional grinding processes. Nevertheless, dry grinding has not been widely introduced into industry because of the high temperature generated in the grinding zone and difficulties of heat transfer without coolants. Selection of the proper grinding wheel bonds, grit sizes and concentration has significant effect on the grinding performance and the generated heat in the contact zone. This paper addresses the effects of the grinding wheel bond and the concentration on the dry grinding process efficiency through comparing the results of the carried out experiments with three resin bonded cBN-cup-wheels, each consisting different bond components. For this purpose, surface roughness and thermal damages during dry and wet grinding (utilizing grinding oil) by three different resin bonds were measured. The results show almost identical surface roughness values for dry and wet grinding. Furthermore, using the resin-kryolith-graphite bonded wheel leads to a reduction in thermal damages on the workpiece. Through different experiments, it was shown that the different bonds, used in this study, have significant influence on the chip loading of the grinding wheels. This is contributed to the different chip formation mechanisms and induced grinding temperatures when grinding by the different wheel bonds.

Cylindrical Grinding by Structured Wheels

2016 ◽  
Vol 874 ◽  
pp. 101-108 ◽  
Author(s):  
Amir Daneshi ◽  
Bahman Azarhoushang
Keyword(s):  
Surface Roughness ◽  
Ground Surface ◽  
Promising Method ◽  
Grinding Wheel ◽  
Grinding Wheels ◽  
Grinding Forces ◽  
Cylindrical Grinding ◽  
Dry Grinding

Structuring of the grinding wheels is a promising method to reduce the forces involved in grinding, especially during dry grinding. In this paper, one of the methods of grinding wheel structuring is presented. The structuring process was modeled to find the corresponding dressing parameters for the desired structure dimensions. The cylindrical grinding operation with the structured wheels was simulated to produce a spiral free ground surface. Afterwards, the dry grinding experiments with the structured and non-structured wheels were carried out to evaluate the efficiency of the structured wheels. The results revealed that the grinding forces can be reduced by more than 50% when the grinding wheels are structured, while the surface roughness values increase by 80%.

Proposing a New Evaluation Method in Si Wafer Rotary Grinding

2020 ◽  
Author(s):  
Jumpei Kusuyama ◽  
Bima Kawase ◽  
Yohichi Nakao ◽  
Masaki Kanazawa ◽  
Kazumasa Ishikawa
Keyword(s):  
Surface Roughness ◽  
Rotational Speed ◽  
Evaluation Method ◽  
Mechanical Polishing ◽  
Wafer Surface ◽  
Depth Of Cut ◽  
Grinding Wheel ◽  
Dimensionless Number ◽  
Approach Angle ◽  
Grinding Conditions

Abstract Although there have been several studies on machining of semiconductor materials, most of them are concerned with abrasive finishing (such as chemical-mechanical polishing, mechanical polishing and lapping), and only a few have reported on optimizing rotary grinding conditions (such as the grinding wheel rotational speed, wafer rotational speed, wheel diameter, wafer diameter, and feed rate). In this study, to gain further insight, we define a dimensionless number and use it to evaluate our experimental results. This dimensionless number — called the “grain approach angle” — is the ratio of the grain running length of the machined wafer surface and the depth of cut due to grain during the grain running time. For this study, our evaluation coefficients are taken to be surface roughness, grinding force, and grinding ratio. We found it more suitable to use the grain approach angle rather than a previously defined dimensionless number (which was evaluated as the ratio of the wheel rotational speed to the wafer rotational speed). We also found that, by using the grain approach angle, trends in surface roughness exhibited invariant similarities under varying conditions.

scholarly journals Performance of Norton Quantum Grinding Wheels

2016 ◽  
Vol 686 ◽  
pp. 125-130 ◽  
Author(s):  
Miroslav Neslušan ◽  
Jitka Baďurová ◽  
Anna Mičietová ◽  
Maria Čiliková
Keyword(s):  
Surface Roughness ◽  
Ground Surface ◽  
Bearing Steel ◽  
Grinding Wheel ◽  
Grinding Wheels ◽  
Grinding Forces ◽  
Removal Rates ◽  
Surface Burn ◽  
Conventional Grinding

This paper deals with cutting ability of progressive Norton Quantum grinding wheel during grinding roll bearing steel 100Cr6 of hardness 61 HRC. Cutting ability of this wheel is compared with conventional grinding wheel and based on measurement of grinding forces as well as surface roughness. Results of experiments show that Norton Quantum grinding wheels are capable of long term grinding cycles at high removal rates without unacceptable occurrence of grinding chatter and surface burn whereas application of conventional wheel can produce excessive vibration and remarkable temper colouring of ground surface. Moreover, while Norton Quantum grinding wheel gives nearly constant grinding forces and surface roughness within ground length at higher removal rates, conventional grinding wheel (as that reported in this study) does not.

scholarly journals Experimental Study on Grinding Force of Zirconia Ceramics in Dry/Wet Grinding Environment

2018 ◽  
Vol 198 ◽  
pp. 02004
Author(s):  
Junping Zhang ◽  
Weidong Wang ◽  
Songhua Li ◽  
Han Tao
Keyword(s):  
Grinding Force ◽  
Grinding Wheel ◽  
Feed Speed ◽  
Zirconia Ceramics ◽  
Grinding Forces ◽  
Measuring Device ◽  
Linear Speed ◽  
Wet Grinding ◽  
Dry Grinding ◽  
Force Ratio

The impacts of different linear speed of grinding wheel, grinding depth and workpiece feed speed with or without grinding fluid on grinding force were studied by plane grinding machining of zirconia ceramics. The impacts of different machining environment and grinding parameter on normal and tangential grinding forceswere studied by testing the grinding force during grinding with a force measuring device. The studies showed that the normal and tangential grinding forces decrease with the increase of the linear speed of grinding wheel and increase with the improvement of grinding depth and workpiece feed speed. The grinding depth has the greatest impacts on the normal and tangential grinding forces in dry grinding environment; while in wet grinding environment, the grinding depth exerts the greatest impacts on the normal grinding force and the linear speed of grinding wheel imposes the greatest impacts on the tangential grinding force. In addition, it was found that the normal grinding force in dry grinding is minor than that in wet grinding, that the tangential grinding force in dry grinding is greater than that in wet grinding, and that the grinding force ratio in dry grinding is lower than that in wet grinding.

scholarly journals Mechanochemical Treatment to Remove Arsenic from Copper Ore

Minerals ◽  
2019 ◽  
Vol 9 (6) ◽  
pp. 349
Author(s):  
Shingo Ishihara ◽  
Kozo Shinoda ◽  
Junya Kano
Keyword(s):  
Arsenic Removal ◽  
Chemical Activation ◽  
Xrd Analysis ◽  
Mechanochemical Treatment ◽  
Copper Ore ◽  
Wet Grinding ◽  
Dry Grinding ◽  
Grinding Conditions ◽  
Diffraction Peaks ◽  
Comparison Of The Results

This study tested the removal of arsenic from copper ore concentrate via a mechanochemical treatment by planetary ball milling. The harmful components of ore, such as arsenic, are increasing year by year and decreasing the copper grade, therefore there is a strong need to improve the separation of arsenic from copper ore. The effect of grinding as a result of chemical activation caused by mechanochemical treatment was evaluated by XRD and X-ray absorption spectroscopy (XAS) measurements. From the results of the XRD analysis, several crystalline minerals were identified from the original samples. The diffraction peaks of the original samples were reduced by grinding, although grinding did not generate any new diffraction peaks. The comparison of the results of grinding in dry and wet conditions showed that the rate of disappearance of the crystalline minerals was faster in dry grinding than in wet grinding. To clarify the chemical state of arsenic in copper ore, XAS analysis was carried out. The results indicated that the arsenic compound changed from sulfide, in the original sample, to oxide after grinding. As a result of oxidation, the arsenic was easy to dissolve in a water and alkaline solution, and optimized dry and wet grinding conditions achieved up to 76% arsenic removal efficiency.

Effect of Novel Grinding Wheels on Grinding Performance

2013 ◽  
Vol 405-408 ◽  
pp. 3302-3306
Author(s):  
Ming Yi Tsai ◽  
Shi Xing Jian ◽  
J. H. Chiang
Keyword(s):  
Surface Roughness ◽  
Pure Water ◽  
Minimum Quantity Lubrication ◽  
Grinding Wheel ◽  
Grinding Temperature ◽  
Grinding Wheels ◽  
Wheel Wear ◽  
Grinding Performance ◽  
Conventional Grinding ◽  
Removal Processes

Grinding, a technique for removing abrasive materials, is a chip-removal process that uses an individual abrasive grain as the cutting tool. Abrasive material removal processes can be very challenging owing to the high power requirements and the resulting high temperatures, especially at the workpiece-wheel interface. This paper presents a novel system that uses graphite particles impregnated in an aluminum oxide matrix to form a grinding wheel. This study specifically investigated grinding wheels with a graphite content of 0.5 wt%. The new grinding wheel was compared with conventional grinding wheels by comparing the factors of grinding performance, such as surface roughness, morphology, wheel wear ratio, grinding temperature, and grinding forces, when the wheels were used under two different coolant strategiesdry and with minimum quantity lubrication (MQL) using pure water. This study found that there is a considerable improvement in the grinding performance using graphite-impregnated grinding wheels over the performance obtained using conventional grinding wheels. The use of 0.5 wt% graphite provided better surface roughness and topography, lower grinding temperature, and decreased force; in addition, wheel consumption was lower, resulting in extended wheel life.

Analysis and Measurement of Effective Flow-Rate in Flood Grinding

2009 ◽  
Vol 626-627 ◽  
pp. 159-164 ◽  
Author(s):  
Chang He Li ◽  
Ya Li Hou ◽  
Yu Cheng Ding ◽  
Bing Heng Lu
Keyword(s):  
Boundary Layer ◽  
Flow Rate ◽  
High Speed ◽  
Good Description ◽  
Volumetric Flow Rate ◽  
Grinding Wheel ◽  
Work Surface ◽  
Grinding Fluid ◽  
Grinding Conditions ◽  
Grinding Machine

In the grinding process, grinding fluid is delivered for the purposes of chip flushing, cooling, lubrication and chemical protection of work surface. Due to high speed rotating grinding wheel, the boundary layer of air around the grinding wheel restricts most of the grinding fluid away from the grinding zone. Hence, conventional method of delivering grinding fluid that flood delivery is not believed to fully penetrate this boundary layer and, thus, the majority of the grinding fluid is deflected away from the grinding zone. The flood grinding typically delivers large volumes of grinding fluid was ineffective, especially under high speed grinding conditions. In the paper, a theoretical model is presented for flow of grinding fluid through the grinding zone. The model shows that the flow rate through the contact zone between the wheel and the work surface depends on wheel porosity and wheel speed as well as depends on nozzle volumetric flow rate and fluid jet velocity. Furthermore, the model was tested by a surface grinding machine in order to correlate between experiment and theory. Consequently, the effective flow-rate model was found to give a good description of the experimental results and the model can well forecast the effective flow-rate in flood delivery grinding.

Grinding of Carbon/Epoxy Composites Using Electroplated CBN Wheel with Controlled Abrasive Clusters

2008 ◽  
Vol 389-390 ◽  
pp. 24-29 ◽  
Author(s):  
H.P. Yuan ◽  
Hang Gao ◽  
Yong Jie Bao ◽  
Yong Bo Wu
Keyword(s):  
Epoxy Composite ◽  
Epoxy Composites ◽  
Grinding Wheel ◽  
The Novel ◽  
Grinding Wheels ◽  
Grinding Forces ◽  
Abrasive Grains ◽  
Dry Grinding ◽  
Conventional Grinding ◽  
Wheel Loading

Aiming at solving the problems of wheel loading in dry grinding of Carbon/Epoxy composite materials, a novel electroplated grinding wheel with controlled abrasive cluster was developed, in which the diameter of clusters is in Φ0.2 mm to Φ1.0 mm and the interspace between them is about 0.5 mm to 1.0 mm. A conventional electroplated grinding wheel with abrasive grains distributed randomly was fabricated in the same way. The comparison experiments involving C/E composite were conducted on a vertical spindle grinder with the novel and conventional grinding wheels. The results show that the grinding forces of novel wheel developed is more lower though little larger surface roughness, and the wheel loading phenomenon is markedly decreased compared with conventional electroplated wheel.

Effects of Relative Velocity on Grinding Performances under Si Wafer Rotary Grinding

2016 ◽  
Vol 874 ◽  
pp. 395-400
Author(s):  
Jumpei Kusuyama ◽  
Takayuki Kitajima ◽  
Akinori Yui ◽  
Toshihiro Ito
Keyword(s):  
Surface Roughness ◽  
Power Consumption ◽  
Relative Velocity ◽  
Velocity Ratio ◽  
Grinding Wheel ◽  
Grinding Process ◽  
Wafer Thickness ◽  
Grinding Conditions ◽  
The Difference ◽  
Si Wafer

For the backgrinding of semiconductor devices, a rotary grinding process is indispensable for achieving the required wafer thickness. The relative velocity between the grinding wheel and the wafer is maximum at the periphery of the wafer and minimum at the center of wafer. Generally, the grinding performances are discussed in terms of the ratio of the rotational speeds of the grinding wheel and the wafer. However, it is not possible to use this ratio to determine the grinding conditions for different wafer sizes grinding as this ratio does not show the difference in relative velocity. Therefore, a new relative velocity ratio was defined in this study. Then, the Si wafer grinding was performed to investigate the effect of the surface roughness and the power consumption of the grinding wheel spindle on the relative velocity ratio.

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