scholarly journals A Novel Preparation Method of Electrically Conductive Adhesives by Powder Spraying Process

Materials ◽  
2019 ◽  
Vol 12 (17) ◽  
pp. 2793
Author(s):  
Hongyu Dong ◽  
Xin Li ◽  
Yi Dong ◽  
Shaoqing Guo ◽  
Liangfu Zhao
Keyword(s):  
Epoxy Resin ◽  
Preparation Method ◽  
Preparation Process ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Conventional Process ◽  
Electrically Conductive Adhesive ◽  
Conductive Fillers ◽  
Powder Spraying ◽  
Spraying Process

In a conventional electrically conductive adhesive (ECA) preparation process, typical ECAs are made by adding an appropriate amount of electrically conductive fillers, such as silver, into a polymer matrix, such as epoxy resin, to form a uniformly dispersed mixture by mixing and stirring operations. However, during the preparation process, secondary pollution and mass loss are caused by the vigorous mixture process. At the same time, the stirring operation introduces many small and stable bubbles, which affect the electrical conductivity of the ECAs. In light of these problems with the conventional preparation of ECAs, we developed a novel ECA preparation method that employs a powder spraying process: silver flakes are sprayed into the epoxy resin with a certain mass fraction to form formulated pastes. The as-prepared ECAs exhibited excellent properties compared with those prepared by the conventional process. This proves that the powder spraying process is feasible and superior to the conventional process.

A Review of Electrically Conductive Adhesive Technology for Use in Surface-Mount Microelectronics

2000 ◽  
Author(s):  
Anthony J. Rafanelli
Keyword(s):  
Surface Mount Technology ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Electrically Conductive Adhesives ◽  
Surface Mount ◽  
The Past ◽  
Electrically Conductive Adhesive ◽  
Alternative Materials ◽  
Subsequent Exposure ◽  
Case Basis

Abstract Interest in alternatives to lead solders continues to increase due to several initiatives addressing the reduction of lead usage and subsequent exposure to the environment. Alternative materials can be categorized into two main groups: electrically conductive adhesives (polymers) and non-lead solders. Over the past ten years, many non-leaded solders have been developed and introduced to the electronics industry. Despite some success regarding processability, several issues still exist regarding use of these materials as “drop-in” replacements for traditional leaded solders, e.g. eutectic tin-lead. This paper provides an overview of the second alternate material group, i.e. electrically conductive adhesives. An attempt is made to compare characteristics of these materials to the tin-lead benchmark. A summary of key material properties is also included. Finally, a position is presented regarding the approaches taken in evaluating these materials as suitable substitutes for tin-lead eutectic solder. Focus is on applications in surface mount technology (SMT) interconnection since solder is the primary bonding medium for interconnection. In general, these materials are acceptable for most applications. Applications under harsh service and environmental conditions, however, would require evaluation on a case-by-case basis.

scholarly journals Preparation and Characterization of Epoxy Resin Filled with Ti3C2Tx MXene Nanosheets with Excellent Electric Conductivity

Nanomaterials ◽  
2020 ◽  
Vol 10 (1) ◽  
pp. 162 ◽  
Author(s):  
Ailing Feng ◽  
Tianqi Hou ◽  
Zirui Jia ◽  
Yi Zhang ◽  
Fan Zhang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Electrical Conductivity ◽  
Epoxy Resin ◽  
Electric Conductivity ◽  
Mechanical Performance ◽  
Conductive Adhesive ◽  
Electrically Conductive ◽  
Solution Blending ◽  
Electrically Conductive Adhesive ◽  
And Performance

MXene represents new kinds of two-dimensional material transition metal carbides and/or carbonitrides, which have attracted much attention in various applications including electrochemical storage devices, catalysts, and polymer composite. Here, we report a facile method to synthesize Ti3C2Tx MXene nanosheets and prepare a novel electrically conductive adhesive based on epoxy resin filled with Ti3C2Tx MXene nanosheets by solution blending. The structure, morphology, and performance of Ti3C2Tx MXene nanosheets and epoxy/Ti3C2Tx MXene nanosheets composite were investigated. The results show that Ti3C2Tx MXene possesses nanosheet structure. Ti3C2Tx MXene nanosheets were homogeneously dispersed in epoxy resin. Electrical conductivity and mechanical properties measurements reveal that the epoxy/Ti3C2Tx MXene nanosheet composite exhibited both good electrical conductivity (4.52 × 10−4 S/m) and favorable mechanical properties (tensile strength of 66.2 MPa and impact strength of 24.2 kJ/m2) when the content of Ti3C2Tx MXene nanosheets is 1.2 wt %. Thus, Ti3C2Tx MXene is a promising filler for electrically conductive adhesive with high electric conductivity and high mechanical performance.

scholarly journals Rheologically Assisted Design of Conductive Adhesives for Stencil Printing on PCB

Materials ◽  
2021 ◽  
Vol 14 (24) ◽  
pp. 7734
Author(s):  
Ângelo D. M. Silva ◽  
Mariana M. Silva ◽  
Hugo Figueiredo ◽  
Isabel Delgado ◽  
Paulo E. Lopes ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Deposition Process ◽  
Solder Paste ◽  
Circuit Boards ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Stencil Printing ◽  
Rheological Analysis ◽  
Electrically Conductive Adhesive ◽  
Thermal And Electrical Properties

Driven by the need to deliver new, lead-free, eco-friendly solder pastes for soldering electronic components to Printed Circuit Boards (PCB), electrically conductive adhesives (ECAs) based on epoxy, carbon nanotubes (CNT), and exfoliated graphite (EG) were designed. The rheology of the adhesives prepared is paramount for the success of the deposition process, which is based on stencil printing. Thus, a rheological analysis of the process was first performed. Then, an experimental protocol was defined to assess the relevant viscoelastic characteristics of the adhesives for stencil printing application. Different composite formulations of epoxy/CNT/EG were produced. Their rheological characteristics were established following the designed protocol and benchmarked with a commercial solder paste. The thermal and electrical properties of the composite formulations were also characterized. As a result, a new, electrically conductive adhesive was delivered with potential to be an eco-friendly alternative to the solder paste currently used in stencil printing of PCB.

scholarly journals Preparation of Silver Nanopowders and Its Application in Low Temperature Electrically Conductive Adhesive

2021 ◽  
Author(s):  
Xiao Min Zhang ◽  
Xiao-Li Yang ◽  
Bin Wang
Keyword(s):  
Electrical Conductivity ◽  
Low Temperature ◽  
High Performance ◽  
Electronic Device ◽  
Conductive Adhesive ◽  
High Electrical Conductivity ◽  
Electrically Conductive ◽  
Electrically Conductive Adhesive ◽  
Conductive Fillers ◽  
Dc Arc

Abstract Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has wide application prospect in electronic device. In order to explore new conductive fillers of interconnecting materials in electronic circuit and electronic packaging industries, silver nanopowders were prepared by DC arc plasma method with high pure. The silver nanopowders present a spherical structure, the particle’s diameter range from 15 to 220 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and was screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 ℃ for 10 min. The electrical and mechanical of above ECA were investigated and characterized. The ECA filled with 75% silver nanopowders exhibits excellent performances, including high electrical conductivity (9.5×10-4 Ω·cm), high bonding strength ( 8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.

scholarly journals Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive

Materials ◽  
2018 ◽  
Vol 11 (10) ◽  
pp. 2028 ◽  
Author(s):  
Tao Xu ◽  
Jiayu Chen ◽  
Wenhui Yuan ◽  
Yinhua Liu ◽  
Yongjun Sun ◽  
...  
Keyword(s):  
Shear Strength ◽  
Self Assembly ◽  
Silver Nanowires ◽  
Volume Resistivity ◽  
Synthesis Process ◽  
Mass Ratio ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
X Ray ◽  
Electrically Conductive Adhesive

Among recent advances in electronic packaging technologies, electrically conductive adhesives (ECAs) attract most researchers’ attention, as they are environment-friendly and simple to apply. ECAs also have a lower operating temperature and volume resistivity compared with conventional electronic conductive adhesives. In ECAs, the conducting fillers play a significant role in improving conductivity and strength. In this work, as filler additives, the silver nanowires/graphene nanocomposites (AgNWs-GNs) were successfully fabricated via a facile self-assembly method. The characteristics of the as-prepared nanocomposites were evaluated by FTIR (Fourier Transform infrared spectroscopy), XRD (X-ray Diffraction), XPS (X-ray photoelectron spectroscopy), TEM (Transmission electron microscope) and Raman tests, demonstrating a successful synthesis process. Different amounts of AgNWs-GNs were used as additives in micron flake silver filler, and the effects of AgNWs-GNs on the properties of ECAs were studied. The results suggested that the as-synthesized composites can significantly improve the electrical conductivity and shear strength of ECAs. With 0.8% AgNWs/GNs (AgNWs to GO (Graphite oxide) mass ratio is 4:1), the ECAs have the lowest volume resistivity of 9.31 × 10−5 Ω·cm (95.4% lower than the blank sample without fillers), while with 0.6% AgNWs/GNs (AgNWs to GO mass ratio is 6:1), the ECAs reach the highest shear strength of 14.3 MPa (68.2% higher than the blank sample).

Preparation and Properties of Conductive Epoxy Resin Composites

2013 ◽  
Vol 669 ◽  
pp. 171-175
Author(s):  
Xin Ding ◽  
Hua Wang ◽  
Xing You Tian ◽  
Kang Zheng
Keyword(s):  
Epoxy Resin ◽  
Resin Composites ◽  
Conductive Adhesives ◽  
Different Types ◽  
Conductive Fillers ◽  
Epoxy Resin Composites ◽  
The Relationship

The conductive adhesives were prepared by using micron silver, ball-milled silver and the mixture of them as conductive fillers, respectively, and epoxy resin as matrix. In this study, The relationship between the resistivity with the content of silver fillers was tested. With the micron sliver loading from 60 wt% to 75 wt%, the resistivity decreases significantly about 8 orders of magnitude. And the effects of the different types of silver fillers (micron silver, ball-milled silver and the mixture of them) on the resistivity were also investigated. The study shows that the ECAs filled with the micron sliver gets the highest resistivity and the resistivity of ECAs which uses the ball-milled sliver as fillers is the lowest.

scholarly journals Shear Strength of Conductive Adhesive Joints on Rigid and Flexible Substrates Depending on Adhesive Quantity

2016 ◽  
Vol 67 (3) ◽  
pp. 177-184
Author(s):  
Martin Hirman ◽  
Frantisek Steiner
Keyword(s):  
Shear Strength ◽  
Strength Test ◽  
Conductive Adhesive ◽  
Flexible Substrates ◽  
Curing Process ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Shear Strength Test ◽  
Electrically Conductive Adhesive ◽  
The Impact

Abstract This article deals with the impact of electrically conductive adhesive quantity on the shear strength of joints glued by adhesives “EPO-TEKⓇ H20S” and “MG8331S” on three types of substrates (FR-4, MELINEXⓇST504, DuPont™ PyraluxⓇAC). These joints were made by gluing chip resistors 1206, 0805 and 0603, with two curing profiles for each adhesive. Different thicknesses of stencil and reductions in the size of the hole in stencils were used for this experiment. These differences have an effect on the quantity of conductive adhesives which must be used on the samples. Samples were measured after the curing process by using a shear strength test applied by the device LabTest 3.030. This article presents the effects of different curing profiles, various types of substrates, and different quantities of adhesives on the mechanical strength of the joint.

Triple functions of polyaniline in situ coated on silver powders for high-performance electrically conductive pastes

2021 ◽  
Vol 11 (7) ◽  
pp. 1231-1238
Author(s):  
Maocheng Zhang ◽  
Mengqi Yao ◽  
Ni Wang ◽  
Wencheng Hu
Keyword(s):  
Electrical Resistivity ◽  
High Performance ◽  
Chemical Reduction ◽  
Conductive Adhesive ◽  
Silane Coupling Agents ◽  
Conductive Adhesives ◽  
Electrically Conductive ◽  
Conductive Fillers ◽  
Preparation Strategy

Silver powders, with high electrical conductivity, as the conductive fillers of electrically conductive adhesives have been widely investigated in the fields of microelectronic packaging. Herein, polyaniline (PANI)-coated silver powders were successfully fabricated via a facile chemical reduction, followed by the polymerization of aniline. The PANI plays triple functions to synergistically improve the performance of electrically conductive pastes as follows: (1) The aniline-coated silver particles are used as an ideal dispersant to substitute polyvinyl pyrrolidone and polyethylene glycol in the preparation strategy of silver powders; (2) The polymerization of aniline plays a surface modifier role instead of silane coupling agents to prepare silver-based conductive adhesives with homodisperse silver powders; (3) The high conductivity of PANI could reduce the contact resistance between silver powders and decrease the electrical resistivity of conductive adhesive films significantly. As a result, the PANI coats silver powders (pH = 3) show a decreased electrical resistivity of conductive adhesive films of 4.24×10−5 Ω·cm with the shear resistance of 9.06 MPa and the sheet resistance of 10.6 mΩ.sq−1. This work provides an efficient way to controllably synthesize PANI-coated silver powders for high-performance electrically conductive pastes.

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