scholarly journals Screen Printed Copper and Tantalum Modified Potassium Sodium Niobate Thick Films on Platinized Alumina Substrates

Materials ◽  
2021 ◽  
Vol 14 (23) ◽  
pp. 7137
Author(s):  
Brigita Kmet ◽  
Danjela Kuščer ◽  
Soma Dutta ◽  
Hana Uršič ◽  
Aleksander Matavž ◽  
...  

We show how sintering in different atmospheres affects the structural, microstructural, and functional properties of ~30 μm thick films of K0.5Na0.5NbO3 (KNN) modified with 0.38 mol% K5.4Cu1.3Ta10O29 and 1 mol% CuO. The films were screen printed on platinized alumina substrates and sintered at 1100 °C in oxygen or in air with or without the packing powder (PP). The films have a preferential crystallographic orientation of the monoclinic perovskite phase in the [100] and [−101] directions. Sintering in the presence of PP contributes to obtaining phase-pure films, which is not the case for the films sintered without any PP notwithstanding the sintering atmosphere. The latter group is characterized by a slightly finer grain size, from 0.1 μm to ~2 μm, and lower porosity, ~6% compared with ~13%. Using piezoresponse force microscopy (PFM) and electron backscatter diffraction (EBSD) analysis of oxygen-sintered films, we found that the perovskite grains are composed of multiple domains which are preferentially oriented. Thick films sintered in oxygen exhibit a piezoelectric d33 coefficient of 64 pm/V and an effective thickness coupling coefficient kt of 43%, as well as very low mechanical losses of less than 0.5%, making them promising candidates for lead-free piezoelectric energy harvesting applications.

Author(s):  
Frank Altmann ◽  
Jens Beyersdorfer ◽  
Jan Schischka ◽  
Michael Krause ◽  
German Franz ◽  
...  

Abstract In this paper the new Vion™ Plasma-FIB system, developed by FEI, is evaluated for cross sectioning of Cu filled Through Silicon Via (TSV) interconnects. The aim of the study presented in this paper is to evaluate and optimise different Plasma-FIB (P-FIB) milling strategies in terms of performance and cross section surface quality. The sufficient preservation of microstructures within cross sections is crucial for subsequent Electron Backscatter Diffraction (EBSD) grain structure analyses and a high resolution interface characterisation by TEM.


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