scholarly journals Research on Heat Dissipation of Multi-Chip LED Filament Package

Micromachines ◽  
2021 ◽  
Vol 13 (1) ◽  
pp. 77
Author(s):  
Lipeng Tan ◽  
Peisheng Liu ◽  
Chenhui She ◽  
Pengpeng Xu ◽  
Lei Yan ◽  
...  
Keyword(s):  
Thermal Analysis ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Substrate Material ◽  
Material Structure ◽  
Element Analysis ◽  
Light Emitting ◽  
High Illumination ◽  
Temperature Superposition ◽  
Distribution Mode

By studying the substrate material, structure, chip distribution, and array form of the multi-chip light-emitting diode (LED) package, the heat-dissipation capacity of the LED package is improved. Finite element analysis and steady-state thermal analysis are used to simulate and analyze LED packages with different materials and structures. Using the theory of LED illuminance and uniformity, the illuminance of some structures is computed. The results show that the change of substrate material and structure can greatly impact heat dissipation, while changing array forms has little effect on heat dissipation. By improving the spatial distribution of the chip, the temperature superposition problem of the substrate is solved, and the illuminance and uniformity are improved while dissipating heat. The LED filaments of the combined, equidistant, chip-distribution mode have improved heat dissipation. The S-type equal difference has the highest illumination and high illumination uniformity.

scholarly journals Heat transfer and structure stress analysis of micro packaging component of high power light emitting diode

2013 ◽  
Vol 17 (5) ◽  
pp. 1277-1283 ◽  
Author(s):  
Chih-Neng Hsu ◽  
Yu-Hao Chang ◽  
Chang-Yuan Liu ◽  
Shih-Hao Fang ◽  
Chun-Chieh Huang
Keyword(s):  
Heat Transfer ◽  
Stress Analysis ◽  
High Power ◽  
Silicon Substrate ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Material Structure ◽  
Light Emitting ◽  
Micro Scale ◽  
Chip Temperature

This paper focuses on the heat transfer and structural stress analysis of the micro- scale packaging structure of a high-power light emitting diode. The thermal-effect and thermal-stress of light emitting diode are determined numerically. Light emitting diode is attached to the silicon substrate through the wire bonding process by using epoxy as die bond material. The silicon substrate is etched with holes at the bottom and filled with high conductivity copper material. The chip temperature and structure stress increase with input power consumption. The micro light emitting diode is mounted on the heat sink to increase the heat dissipation performance, to decrease chip temperature, to enhance the material structure reliability and safety, and to avoid structure failure as well. This paper has successfully used the finite element method to the micro-scale light emitting diode heat transfer and stress concentration at the edges through etched holes.

Simulation Research on the Heat Dissipation Performance of a High Power LED Radiator

2012 ◽  
Vol 224 ◽  
pp. 389-394
Author(s):  
Shu Zhen Jiang ◽  
Zhong Ning Guo ◽  
Yu Deng
Keyword(s):  
Thermal Analysis ◽  
Life Span ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Environment Friendly ◽  
Simulation Research ◽  
Light Emitting ◽  
High Power Led ◽  
Long Life

Applied in illumination area, high power LED (Light Emitting Diode) has a series of advantages with energy saving, environment-friendly, long life span, etc. However, the heat dissipation of the LED is a bottleneck in its development, and has become a key point which must be studied and solved urgently. In this paper, a typical LED lamp is modeled and thermal analysis has been performed using the software of Ansys.

Reliability of High-Power Light Emitting Diode Attached With Different Thermal Interface Materials

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Xin Li ◽  
Xu Chen ◽  
Guo-Quan Lu
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Temperature Cycling ◽  
Fluorescent Light ◽  
Light Sources ◽  
Light Emitting ◽  
Die Attach ◽  
Nanosilver Paste ◽  
Interconnection Material

As a solid electroluminescent source, white light emitting diode (LED) has entered a practical stage and become an alternative to replace incandescent and fluorescent light sources. However, due to the increasing integration and miniaturization of LED chips, heat flux inside the chip is also increasing, which puts the packaging into the position to meet higher requirements of heat dissipation. In this study, a new interconnection material—nanosilver paste is used for the LED chip packaging to pursue a better optical performance, since high thermal conductivity of this material can help improve the efficiency of heat dissipation for the LED chip. The bonding ability of this new die-attach material is evaluated by their bonding strength. Moreover, high-power LED modules connected with nanosilver paste, Sn3Ag0.5Cu solder, and silver epoxy are aged under hygrothermal aging and temperature cycling tests. The performances of these LED modules are tested at different aging time. The results show that LED modules sintered with nanosilver paste have the best performance and stability.

Thermal Analysis of High Power Light Emitting Diodes Package

2011 ◽  
Vol 687 ◽  
pp. 215-221
Author(s):  
Yuan Yuan Han ◽  
Hong Guo ◽  
Xi Min Zhang ◽  
Fa Zhang Yin ◽  
Ke Chu ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Thermal Field ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Convective Heat Exchange ◽  
Input Power ◽  
Junction Temperature ◽  
Original Structure ◽  
Light Emitting

With increasing of the input power of the chips in light emitting diode (LED)， the thermal accumulation of LEDs package increases. Therefore solving the heat issue has become a precondition of high power LED application. In this paper, finite element method was used to analyze the thermal field of high power LEDs. The effect of the heatsink structure on the junction temperature was also investigated. The results show that the temperature of the chip is 95.8°C which is the highest, and it meets the requirement. The conductivity of each component affects the thermal resistance. Convective heat exchange is connected with the heat dissipation area. In the original structure of LEDs package the heat convected through the substrate is the highest, accounting for 92.58%. Three heatsinks with fin structure are designed to decrease the junction temperature of the LEDs package.

Thermal Analysis and Thermal Design of Organic Light-emitting Diode

2012 ◽  
Vol 33 (6) ◽  
pp. 624-627
Author(s):  
杨连乔 YANG Lian-qiao ◽  
付美娟 FU Mei-juan ◽  
魏斌 WEI Bin ◽  
张建华 ZHANG Jian-hua ◽  
曹进 CAO Jin
Keyword(s):  
Thermal Analysis ◽  
Light Emitting Diode ◽  
Thermal Design ◽  
Light Emitting ◽  
Organic Light Emitting Diode ◽  
Organic Light
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