scholarly journals An Integrated Approach to Design and Develop High-Performance Polymer-Composite Thermal Interface Material

Polymers ◽  
2021 ◽  
Vol 13 (5) ◽  
pp. 807
Author(s):  
Syed Sohail Akhtar
Keyword(s):  
Thermal Conductivity ◽  
Aspect Ratio ◽  
High Performance ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Design Stage ◽  
Filler Concentration ◽  
Melt Mixing ◽  
Thermal Interface ◽  
Wide Range

A computational framework based on novel differential effective medium approximation and mean-field homogenization is used to design high-performance filler-laden polymer thermal interface materials (TIMs). The proposed design strategy has the capability to handle non-dilute filler concentration in the polymer matrix. The effective thermal conductivity of intended thermal interface composites can be tailored in a wide range by varying filler attributes such as size, aspect ratio, orientation, as well as filler–matrix interface with an upper limit imposed by the shear modulus. Serval potential polymers and fillers are considered at the design stage. High-density polyethylene (HDPE) and thermoplastic polyurethane (TPU) with a non-dilute concentration (~60 vol%) of ceramic fillers exhibit high thermal conductivity (4–5 W m−1 K−1) without compromising the high compliance of TIMs. The predicted thermal conductivity and coefficient of thermal expansion are in excellent agreement with measured data of various binary composite systems considering HDPE, TPU, and polypropylene (PP) loaded with Al2O3 and AlN fillers in varying sizes, shapes, and concentrations, prepared via the melt-mixing and compression-molding route. The model also validates that manipulating filler alignment and aspect ratio can significantly contribute to making heat-conducting networks in composites, which results in ultra-high thermal conductivity.

Development of a Compliant Nanothermal Interface Material

2011 ◽  
Author(s):  
David Shaddock ◽  
Stanton Weaver ◽  
Ioannis Chasiotis ◽  
Binoy Shah ◽  
Dalong Zhong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Thermal Stresses ◽  
Performance Testing ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface Materials ◽  
Thermal Interface ◽  
Bondline Thickness ◽  
Interface Materials

The power density requirements continue to increase and the ability of thermal interface materials has not kept pace. Increasing effective thermal conductivity and reducing bondline thickness reduce thermal resistance. High thermal conductivity materials, such as solders, have been used as thermal interface materials. However, there is a limit to minimum bondline thickness in reducing resistance due to increased fatigue stress. A compliant thermal interface material is proposed that allows for thin solder bondlines using a compliant structure within the bondline to achieve thermal resistance <0.01 cm2C/W. The structure uses an array of nanosprings sandwiched between two plates of materials to match thermal expansion of their respective interface materials (ex. silicon and copper). Thin solder bondlines between these mating surfaces and high thermal conductivity of the nanospring layer results in thermal resistance of 0.01 cm2C/W. The compliance of the nanospring layer is two orders of magnitude more compliant than the solder layers so thermal stresses are carried by the nanosprings rather than the solder layers. The fabrication process and performance testing performed on the material is presented.

A thermal interface material based on foam-templated three-dimensional hierarchical porous boron nitride

2018 ◽  
Vol 6 (36) ◽  
pp. 17540-17547 ◽  
Author(s):  
Zhilin Tian ◽  
Jiajia Sun ◽  
Shaogang Wang ◽  
Xiaoliang Zeng ◽  
Shuang Zhou ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Three Dimensional ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Hierarchical Porous ◽  
Templated Method

A high thermal conductivity boron nitride based thermal interface material was developed by a foam-templated method.

Challenges in Package Cooling of High Performance Servers

2007 ◽  
Author(s):  
Jie Wei
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Heat Pipes ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Heat Spreader ◽  
Asymmetric Power ◽  
Heat Spreading ◽  
Silver Composite

Cooling technologies for dealing with high-density and asymmetric power dissipation are discussed, arising from thermal management of high performance server CPU-packages. In this paper, investigation and development of associated technologies are introduced from a viewpoint of industrial application, and attention is focused on heat conduction and removal at the package and heatsink module level. Based on analyses of power dissipation and package cooling characteristics, properties of a new metallic thermal interface material are presented where the Indium-Silver composite was evaluated for integrating the chip and its heat-spreader, effects of heat spreading materials on package thermal performance are investigated including high thermal conductivity diamond composites, and evaluations of enhanced heatsink cooling capability are illustrated where high thermal conductivity devices of heat pipes or vapor chambers were applied for improving heat spreading in the heatsink base.

Development of a Metal Micro-Textured Thermal Interface Material

2009 ◽  
Author(s):  
R. Kempers ◽  
R. Frizzell ◽  
A. Lyons ◽  
A. J. Robinson
Keyword(s):  
Thermal Conductivity ◽  
Applied Pressure ◽  
Solid Particles ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Filler Materials ◽  
Mechanical And Thermal Properties ◽  
Metal Foil ◽  
Thermal Interface ◽  
Thermally Conductive

Typical thermal interface materials (TIMs) consist of high thermal conductivity solid particles dispersed in a continuous, low thermal conductivity organic compound. Despite using filler materials of very high thermal conductivity, the effective thermal conductivity of these TIMs is often two orders of magnitude lower than the pure filler materials. In addition, dispensing and flow of the particle-matrix composite results in voids being trapped within the bond. To address these issues, a novel metal micro-textured thermal interface material (MMT-TIM) has been developed. This material consists of a thin metal foil with raised micro-scale features that plastically deform under an applied pressure thereby creating a continuous, thermally conductive, path between the mating surfaces. Numerical tools have been developed that couple the mechanical and thermal properties and behaviour of MMT-TIMs as they undergo large-plastic deformation during assembly. This study presents the modelling approach and predictions of MMT-TIM performance based on these numerical techniques. The predictions show good agreement with experimental results, which were obtained using prototype MMT-TIMs and an advanced TIM characterization facility. Finally, a future outlook for this technology is presented based on these promising initial results.

scholarly journals RGO-Coated Polyurethane Foam/Segmented Polyurethane Composites as Solid–Solid Phase Change Thermal Interface Material

Polymers ◽  
2020 ◽  
Vol 12 (12) ◽  
pp. 3004
Author(s):  
Cong Zhang ◽  
Zhe Shi ◽  
An Li ◽  
Yang-Fei Zhang
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Phase Change ◽  
High Performance ◽  
In Situ Polymerization ◽  
Solid Phase ◽  
Thermal Interface Material ◽  
Segmented Polyurethane ◽  
Thermal Interface ◽  
Self Assembling

Thermal interface material (TIM) is crucial for heat transfer from a heat source to a heat sink. A high-performance thermal interface material with solid–solid phase change properties was prepared to improve both thermal conductivity and interfacial wettability by using reduced graphene oxide (rGO)-coated polyurethane (PU) foam as a filler, and segmented polyurethane (SPU) as a matrix. The rGO-coated foam (rGOF) was fabricated by a self-assembling method and the SPU was synthesized by an in situ polymerization method. The pure SPU and rGOF/SPU composite exhibited obvious solid–solid phase change properties with proper phase change temperature, high latent heat, good wettability, and no leakage. It was found that the SPU had better heat transfer performance than the PU without phase change properties in a practical application as a TIM, while the thermal conductivity of the rGOF/SPU composite was 63% higher than that of the pure SPU at an ultra-low rGO content of 0.8 wt.%, showing great potential for thermal management.

Verbesserte Wärmeableitung sorgt für kühlere Motorventile

Konstruktion ◽  
2017 ◽  
Vol 69 (11-12) ◽  
pp. IW8-IW9
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Eine Verbesserte

Auf der IAA 2017 in Frankfurt stellte Federal-Mogul Powertrain neue Werkstoffe für Ventilsitze und -führungen mit verbesserter Wärmeableitung vor (Bild 1). Die serienreifen Materialien High Thermal Conductivity (HTC) und die Beschichtung mit Thermal Interface Material (TIM) können die Temperaturen am Ventilteller um bis zu 70 °C reduzieren. Dies ermöglicht eine verbesserte Verbrennung und niedrigere Emissionen.

Analytical Model of Heat Conduction in a Tubular Geometry With Application to a Nano-Structured Thermal Interface

2005 ◽  
Author(s):  
Anand Desai ◽  
James Geer ◽  
Bahgat Sammakia
Keyword(s):  
Thermal Conductivity ◽  
Power Dissipation ◽  
High Performance ◽  
Analytical Study ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
Inner Diameter ◽  
Parametric Analyses ◽  
Interface Materials

Power dissipation in electronic devices is projected to increase significantly over the next ten years to the range of 50-150 Watts per cm2 for high performance applications [1]. This increase in power represents a major challenge to systems integration since the maximum device temperature needs to be around 100 C. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface materials is in the range of 1 to 4 W/mK, even though the bulk thermal conductivity of the material may be significantly higher. In order to improve the effective in-situ thermal conductivity of interface materials nanotubes are being considered as a possible addition to such interfaces. The primary approach taken in the current study is to analyze the enhancement of the thermal interface by adding carbon nano tubular cylinders that are oriented in the direction of transport. This paper presents the results of an analytical study of transport in a thermal interface material that is enhanced with carbon nanotubes. A variety of parametric analyses are carried out, such as by varying the inner diameter of the nanotube and the power dissipation, and the effect on spreading resistance is calculated. The results indicate that for high thermal conductivity nanotubes there is a significant increase in the effective thermal conductivity of the thermal interface material.

A Numerical Study of Transport in a Thermal Interface Material Enhanced With Carbon Nanotubes

2005 ◽  
Vol 128 (1) ◽  
pp. 92-97 ◽  
Author(s):  
Anand Desai ◽  
Sanket Mahajan ◽  
Ganesh Subbarayan ◽  
Wayne Jones ◽  
James Geer ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotubes ◽  
High Performance ◽  
Numerical Study ◽  
Temperature Drop ◽  
Thermal Interface Material ◽  
Thermal Interface ◽  
The Impact ◽  
Interface Materials

Power dissipation in electronic devices is projected to increase over the next 10years to the range of 150-250W per chip for high performance applications. One of the primary obstacles to the thermal management of devices operating at such high powers is the thermal resistance between the device and the heat spreader or heat sink that it is attached to. Typically the in situ thermal conductivity of interface materials is in the range of 1-4W∕mK, even though the bulk thermal conductivity of the material may be significantly higher. In an attempt to improve the effective in situ thermal conductivity of interface materials nanoparticles and nanotubes are being considered as a possible addition to such interfaces. This paper presents the results of a numerical study of transport in a thermal interface material that is enhanced with carbon nanotubes. The results from the numerical solution are in excellent agreement with an analytical model (Desai, A., Geer, J., and Sammakia, B., “Models of Steady Heat Conduction in Multiple Cylindrical Domains,” J. Electron. Packaging (to be published)) of the same geometry. Wide ranges of parametric studies were conducted to examine the effects of the thermal conductivity of the different materials, the geometry, and the size of the nanotubes. An estimate of the effective thermal conductivity of the carbon nanotubes was used, obtained from a molecular dynamics analysis (Mahajan, S., Subbarayan, G., Sammakia, B. G., and Jones, W., 2003, Proceedings of the 2003 ASME International Mechanical Engineering Congress and Exposition, Washington, D.C., Nov. 15–21). The numerical analysis was used to estimate the impact of imperfections in the nanotubes upon the overall system performance. Overall the nanotubes are found to significantly improve the thermal performance of the thermal interface material. The results show that varying the diameter of the nanotube and the percentage of area occupied by the nanotubes does not have any significant effect on the total temperature drop.

scholarly journals Innocuous, Highly Conductive, and Affordable Thermal Interface Material with Copper-Based Multi-Dimensional Filler Design

Biomolecules ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 132
Author(s):  
Woochang Kim ◽  
Chihyun Kim ◽  
Wonseok Lee ◽  
Jinsung Park ◽  
Duckjong Kim
Keyword(s):  
Thermal Conductivity ◽  
Low Cost ◽  
Three Dimensional ◽  
Precursor Solution ◽  
High Thermal Conductivity ◽  
Thermal Interface Material ◽  
Interfacial Thermal Resistance ◽  
Thermal Interface ◽  
Wetting Properties ◽  
Earth Abundant

Thermal interface materials (TIMs), typically composed of a polymer matrix with good wetting properties and thermally conductive fillers, are applied to the interfaces of mating components to reduce the interfacial thermal resistance. As a filler material, silver has been extensively studied because of its high intrinsic thermal conductivity. However, the high cost of silver and its toxicity has hindered the wide application of silver-based TIMs. Copper is an earth-abundant element and essential micronutrient for humans. In this paper, we present a copper-based multi-dimensional filler composed of three-dimensional microscale copper flakes, one-dimensional multi-walled carbon nanotubes (MWCNTs), and zero-dimensional copper nanoparticles (Cu NPs) to create a safe and low-cost TIM with a high thermal conductivity. Cu NPs synthesized by microwave irradiation of a precursor solution were bound to MWCNTs and mixed with copper flakes and polyimide matrix to obtain a TIM paste, which was stable even in a high-temperature environment. The cross-plane thermal conductivity of the copper-based TIM was 36 W/m/K. Owing to its high thermal conductivity and low cost, the copper-based TIM could be an industrially useful heat-dissipating material in the future.

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