Improvement of Heat Sink Performance Using Graphite and Graphene Coating

2021 ◽  
Vol 21 (1) ◽  
pp. 50-55
Author(s):  
Ammar M. Hadi ◽  
Muneer A. Ismael ◽  
Haider A. Alhattab
Keyword(s):  
Heat Sink ◽  
Heat Dissipation ◽  
Base Plate ◽  
Thermal Dissipation ◽  
Electrical Heater ◽  
Graphene Coating ◽  
Turbulent Reynolds Number ◽  
Uncoated Specimen ◽  
Resistance To Heat

This experimental research depicts the role of coating hot surfaces by graphite and graphene on the process of heat dissipation from these hot surfaces. Three aluminum specimens have been prepared for test, one of theme is coated by graphite, another one by graphene a while the third is left free of coating for comparison purpose. Each specimen is tested separately in a home-made wind tunnel. A plate electrical heater is adhered on the bottom of the specimen to simulate the generated energy by a heat sink. A heat sink composed of high thermal conductivity was applied between the heater plate and the base plate of heat sink to reduce the contact resistance to heat flow. The experiments are conducted with four turbulent Reynolds number. The results reveal that the sample coated by graphene exhibits the best thermal dissipation while the uncoated specimen shows the worst thermal performance.

The Effect of Parameter Changes to the Performance of a Triangular Shape Interrupted Microchannel Heat Sink

2012 ◽  
Vol 58 (2) ◽  
Author(s):  
Fudhail Abd Munir ◽  
Mohd Irwan Mohd Azmi ◽  
Nadlene Razali ◽  
Ernie Mat Tokit
Keyword(s):  
Contact Angle ◽  
Pressure Drop ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Dissipation ◽  
Working Fluid ◽  
Uniform Heat Flux ◽  
Length Width ◽  
Fluent Software ◽  
Phase Water

The effect of parameter changes on triangular shaped interrupted microchannel performance was studied by simulation using FLUENT software. The parameters that were studied are total length, and the contact angle. On the other hand, the investigated effects were pressure drop and platinum film temperature. The flow in microchannel is laminar and single phase. Water was used as the working fluid and the interrupted microchannel is made of silicon. A thin platinum film plate was deposited to provide uniform heat flux. The geometry dimension of the heat sink is 30 mm in length, width of 7 mm and the thickness of 0.525 mm. From the simulation results, it is found that the improvement on heat dissipation may be achieved by increasing the microchannel length at the expense of increase in pressure drop. In addition to that, by reducing the contact angle will result to reduction in term of pressure drop and increases the improvement thermal dissipation.

scholarly journals Thermal Performance Improvement of a Fin-Arrayed Horizontal Heat Sink Corroborating Optimal Orientation Angle

2020 ◽  
Vol 9 (4) ◽  
pp. 1067-1075
Keyword(s):  
Heat Sink ◽  
Orientation Angle ◽  
Base Plate ◽  
Vertical Axis ◽  
Solid Base ◽  
Pin Fin ◽  
Wide Range ◽  
Pin Fins ◽  
Staggered Arrangement

The present study deals with a simple but effective technique for improving the forced convective cooling of a horizontal heat sink with vertical pin-fin-array.The pin fins are embedded in a staggered arrangement on thebase-plate of the horizontal sink. Air, while passing through the fin-array, convects the heat conducted from the solid base-plate to the fins’ surface. The objective of this paper is to examine the role of the orientation angle (  ) on the performance of the heat sink.  is varied from  0 to  360 by rotating the horizontal sink about a vertical axis passing through the center of the sink. A detailed CFD (computational fluid dynamics) study is coordinated over a wide range of inflow Reynolds number ( Re ) to explore the possibility for obtaining an optimum orientation angle (  ) for which Nusselt number ( Nu ) would be the maximum. Results indicate that optimum angle hovers around    120 regardless of the values of Re .

Thermal Behaviors of Passively-Cooled Hybrid Fin Heat Sinks for Lightweight and High Performance Thermal Management

2015 ◽  
Author(s):  
Nico Setiawan Effendi ◽  
Kyoung Joon Kim
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Computational Study ◽  
Heat Sinks ◽  
Channel Diameter ◽  
Internal Channel ◽  
Study Results ◽  
Parametric Effects

A computational study is conducted to explore thermal performances of natural convection hybrid fin heat sinks (HF HSs). The proposed HF HSs are a hollow hybrid fin heat sink (HHF HS) and a solid hybrid fin heat sink (SHF HS). Parametric effects such as a fin spacing, an internal channel diameter, a heat dissipation on the performance of HF HSs are investigated by CFD analysis. Study results show that the thermal resistance of the HS increases while the mass-multiplied thermal resistance of the HS decreases associated with the increase of the channel diameter. The results also shows the thermal resistance of the SHF HS is 13% smaller, and the mass-multiplied thermal resistance of the HHF HS is 32% smaller compared with the pin fin heat sink (PF HS). These interesting results are mainly due to integrated effects of the mass-reduction, the surface area enhancement, and the heat pumping via the internal channel. Such better performances of HF HSs show the feasibility of alternatives to the conventional PF HS especially for passive cooling of LED lighting modules.

Effect of Heat Sink Structure Improvement on Heat Dissipation Performance in High Heat Flux

2016 ◽  
Author(s):  
Zhuo Cui
Keyword(s):  
Heat Resistance ◽  
Water Flow ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Convection Heat Transfer ◽  
Cooling Water ◽  
High Heat Flux ◽  
Pin Fin ◽  
Pin Fins ◽  
Pin Fin Arrays

This paper presents the effects of heat dissipation performance of pin fins with different heat sink structures. The heat dissipation performance of two types of pin fin arrays heat sink are compared through measuring their heat resistance and the average Nusselt number in different cooling water flow. The temperature of cpu chip is monitored to determine the temperature is in the normal range of working temperature. The cooling water flow is in the range of 0.02L/s to 0.15L/s. It’s found that the increase of pin fins in the corner region effectively reduce the temperature of heat sink and cpu chip. The new type of pin fin arrays increase convection heat transfer coefficient and reduce heat resistance of heat sink.

Heat-dissipation performance of cylindrical heat sink with perforated fins

2021 ◽  
Vol 170 ◽  
pp. 107132
Author(s):  
Gihyun Song ◽  
Dong-Hwa Kim ◽  
Dong-Hyung Song ◽  
Ju-Bin Sung ◽  
Se-Jin Yook
Keyword(s):  
Heat Sink ◽  
Heat Dissipation

Thermal Performance Evaluation of Friction Stir Welded Flat Plate Heat Sink Using CFD Analysis

2015 ◽  
Vol 787 ◽  
pp. 505-509
Author(s):  
A.K. Lakshminarayanan ◽  
M. Suresh
Keyword(s):  
Flat Plate ◽  
Heat Sink ◽  
High Efficiency ◽  
Base Plate ◽  
Software Tool ◽  
Cover Plate ◽  
Air Cooling ◽  
Cooling Systems ◽  
Plate Heat ◽  
Friction Stir

In an era of compact cooling requirements, where air cooling systems seem to be ineffective and consistently, being replaced by liquid cooled systems, with greater watt density heat energy dissipation. Such cooling systems must work with good quality enabling high efficiency. Hence, an attempt is made to fabricate an aluminum alloy based flat plate heat sink with cover and base plate using friction stir welding. The base plate is machined to obtain channels for fluid flow and the cover plate is fitted in the base plate and welded. Two such configurations of these heat sinks were fabricated with varying channel lengths and number of channels. The flow characteristics of the model for these configurations were analyzed numerically using computational fluid dynamics (CFD) software tool, ANSYS fluent 14.

Design of Optimum Plate-Fin Natural Convective Heat Sinks

2003 ◽  
Vol 125 (2) ◽  
pp. 208-216 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Madhusudan Iyengar ◽  
Allan D. Kraus
Keyword(s):  
Nusselt Number ◽  
Specific Heat ◽  
Rectangular Plate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Heat Sinks ◽  
And Performance ◽  
Nusselt Number Correlation ◽  
The Impact

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

2012 ◽  
Vol 134 (4) ◽  
Author(s):  
A. F. M. Arif ◽  
Syed M. Zubair ◽  
S. Pashah
Keyword(s):  
Heat Sink ◽  
Structural Response ◽  
Electronics Cooling ◽  
Base Plate ◽  
Thermal Design ◽  
Heat Flow Rate ◽  
Thermal Interface ◽  
Conductive Composites ◽  
Thermally Conductive ◽  
As Stress

Thermally conductive composites as compared to metals have reduced density, decreased oxidation, and improved chemical resistance, as well as adjustable properties to fit a given application. However, there are several challenges that need to be addressed before they can be successfully implemented in heat sink design. The interface between the device and heat sink is an important factor in the thermal design of microelectronics cooling. Depending on the thermal interface conditions and material properties, the contact pressure and thermal stress level can attain undesirable values. In this paper, we investigate the effect of thermal interface between the fin and base plate on thermal-structural behavior of heat sinks. A coupled-field (thermal-structural) analysis using finite element method is performed to predict temperature as well as stress fields in the interface region. In addition temperature and heat flow rate predictions are supported through analytical results. effect of various interface geometrical (such as slot-depth, axial-gap, and radial-gap) and contact properties (such as air gap with surface roughness and gaps filled with interface material) on the resulting thermal-structural response is investigated with respect to four interface materials combinations, and it is found that the thermal performance is most sensitive to the slot-depth compared to any other parameter.

scholarly journals Mathematical modeling and numerical simulation of heat dissipation in led bulbs

2020 ◽  
Vol 24 (3 Part A) ◽  
pp. 1877-1884 ◽  
Author(s):  
Diego Alarcón ◽  
Eduardo. Balvís ◽  
Ricardo Bendaña ◽  
Alberto Conejero ◽  
de Fernández ◽  
...  
Keyword(s):  
Mathematical Modeling ◽  
Numerical Simulation ◽  
Numerical Simulations ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Contact ◽  
Heat Sinks ◽  
Experimental Measurements ◽  
Heating And Cooling ◽  
The Common

We present a detailed study of heating and cooling processes in LED luminaires with passive heat sinks. Our analysis is supported by numerical simulations as well as experimental measurements, carried on commercial systems used for outdoor lighting. We have focused our analysis on the common case of a single LED source in thermal contact with an aluminum passive heat sink, obtaining an excellent agreement with experimental measurements and the numerical simulations performed. Our results can be easily expanded, without loss of generality, to similar systems.

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