Inductively Coupled Plasma Sputtering System for Oxide Semiconductors for a Large Area Deposition

Author(s):  
Daisuke Matsuo ◽  
Takuya Ikeda ◽  
Shigeaki Kishida ◽  
Yoshitaka Setoguchi ◽  
Yasunori Andoh ◽  
...  
2015 ◽  
Vol 2015 (1) ◽  
pp. 000757-000760
Author(s):  
Y. Takaya ◽  
Y. Tanioka ◽  
H. Yoshino ◽  
A. Osawa

In recent years, both low plasma damage and low temperature deposition technic for polymer substrates (e.g. PCB, films and etc.) are often required. We have developed a plasma enhanced dual rotatable magnetron sputter source assisted with inductively coupled plasma (ICP) using low inductance antenna (LIA). LIA has same unique characteristics, a)low voltage high density plasma, b)well controllability of plasma profile to ensure uniformity over large area, c)ionization of sputtered particle and etc. when in being used as a plasma assistant, and besides, LIA can be used as a ICP source for polymer surface modification. We introduce a variety of the possibilities of whether this sputter source is usable for the process of the fabrication of PCB.


2000 ◽  
Vol 71 (2) ◽  
pp. 716-718 ◽  
Author(s):  
S. Okuji ◽  
N. Sakudo ◽  
K. Hayashi ◽  
M. Okada ◽  
T. Onogawa ◽  
...  

1999 ◽  
Vol 355-356 ◽  
pp. 252-255 ◽  
Author(s):  
Se-Geun Park ◽  
Chul Kim ◽  
Beom-hoan O

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