scholarly journals Studies of critical heat fluxes in small diameter channels

2021 ◽  
Vol 7 (4) ◽  
pp. 341-348
Author(s):  
Vladimir I. Belozerov
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Nuclear Power ◽  
Small Diameter ◽  
High Heat ◽  
Heat Fluxes ◽  
Coolant Flow ◽  
Wall Region ◽  
The Core ◽  
Flow Parameters

The paper presents the results of experimental studies of critical heat flows in vertical small diameter channels, when the coolant moves from bottom to top, which were carried out in the Obninsk branch of MEPhI in the 1970s of the last century but have not become widespread due to the lack of demand for their practical use. Nowadays, the interest in such works is manifested, first of all, in the development of compact plants and devices, particularly in nuclear power engineering. As a coolant, water, Freon-12 and 96% ethyl alcohol were used. High velocities of underheated liquid at high heat fluxes on the channel wall lead to the so-called “fast crisis” of heat transfer. In this case, the magnitude of the heat flux depends mainly on the parameters of the coolant flow in the wall zone rather than the flow core. The “slow crisis” is mainly observed at high vapor concentrations, relatively low mass flow rates and in an annular-dispersed flow. The value of the critical heat flow in this case depends mainly on the flow parameters in the core, which are probably close to the average coolant flow parameters. The conditions in the near-wall region are also largely determined by the flow in the core. High heat transfer coefficients in a flow moving at high speed usually result in a much smaller and slower rise in the wall temperature. Sometimes a DNB heat flux can occur bypassing the boiling process. In the core of a VVER-type reactor operating in its nominal mode, surface boiling is present in a number of fuel rods. Probably, surface boiling will also be present in transportable and small-size nuclear power plants. Therefore, an important task is to conduct relevant research in this area.

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

2018 ◽  
Author(s):  
Jensen Hoke ◽  
Todd Bandhauer ◽  
Jack Kotovsky ◽  
Julie Hamilton ◽  
Paul Fontejon
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Phase Change ◽  
Flow Boiling ◽  
Laser Diodes ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Maximum Heat ◽  
Average Maximum

Liquid-vapor phase change heat transfer in microchannels offers a number of significant advantages for thermal management of high heat flux laser diodes, including reduced flow rates and near constant temperature heat rejection. Modern laser diode bars can produce waste heat loads >1 kW cm−2, and prior studies show that microchannel flow boiling heat transfer at these heat fluxes is possible in very compact heat exchanger geometries. This paper describes further performance improvements through area enhancement of microchannels using a pyramid etching scheme that increases heat transfer area by ∼40% over straight walled channels, which works to promote heat spreading and suppress dry-out phenomenon when exposed to high heat fluxes. The device is constructed from a reactive ion etched silicon wafer bonded to borosilicate to allow flow visualization. The silicon layer is etched to contain an inlet and outlet manifold and a plurality of 40μm wide, 200μm deep, 2mm long channels separated by 40μm wide fins. 15μm wide 150μm long restrictions are placed at the inlet of each channel to promote uniform flow rate in each channel as well as flow stability in each channel. In the area enhanced parts either a 3μm or 6μm sawtooth pattern was etched vertically into the walls, which were also scalloped along the flow path with the a 3μm periodicity. The experimental results showed that the 6μm area-enhanced device increased the average maximum heat flux at the heater to 1.26 kW cm2 using R134a, which compares favorably to a maximum of 0.95 kw cm2 dissipated by the plain walled test section. The 3μm area enhanced test sections, which dissipated a maximum of 1.02 kW cm2 showed only a modest increase in performance over the plain walled test sections. Both area enhancement schemes delayed the onset of critical heat flux to higher heat inputs.

Analytical Model Quantifying the Net Coolant Flow Rate to a Microstructured Copper Surface validated with Two-Phase PIV Measurements

2021 ◽  
Author(s):  
Matt Harrison ◽  
Joshua Gess
Keyword(s):  
Heat Transfer ◽  
Analytical Model ◽  
Flow Rate ◽  
Circular Disk ◽  
Nucleate Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Coolant Flow ◽  
Coolant Flow Rate ◽  
Two Phase

Abstract Using Particle Image Velocimetry (PIV), the amount of fluid required to sustain nucleate boiling was quantified to a microstructured copper circular disk. Having prepared the disk with preferential nucleation sites, an analytical model of the net coolant flow rate requirements to a single site has been produced and validated against experimental data. The model assumes that there are three primary phenomena contributing to the coolant flow rate requirements at the boiling surface; radial growth of vapor throughout incipience to departure, bubble rise, and natural convection around the periphery. The total mass flowrate is the sum of these contributing portions. The model accurately predicts the quenching fluid flow rate at low and high heat fluxes with 4% and 30% error of the measured value respectively. For the microstructured surface examined in this study, coolant flow rate requirements ranged from 0.1 to 0.16 kg/sec for a range of heat fluxes from 5.5 to 11.0 W/cm2. Under subcooled conditions, the coolant flow rate requirements plummeted to a nearly negligible value due to domination of transient conduction as the primary heat transfer mechanism at the liquid/vapor/surface interface. PIV and the validated analytical model could be used as a test standard where the amount of coolant the surface needs in relation to its heat transfer coefficient or thermal resistance is a benchmark for the efficacy of a standard surface or boiling enhancement coating/surface structure.

Stability and Enhancement of Boiling in Microchannels

2011 ◽  
Author(s):  
A. E. Bergles
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Critical Heat Flux ◽  
High Heat ◽  
Heat Fluxes ◽  
Transfer Enhancement ◽  
The Past ◽  
The Stability ◽  
Saturated Boiling ◽  
Microelectronic Components

During the past 20 years, there has been intense worldwide interest in microchannel heat exchangers, particularly for cooling of microelectronic components. Saturated boiling of the coolant is usually indicated in order to accommodate high heat fluxes and to have uniformity of temperature. However, boiling is accompanied by several instabilities, the most severe of which can sharply limit the maximum, or critical, heat flux. These stability phenomena are reviewed, and recent studies will be discussed. Elevation of the critical heat flux will be discussed within the context of heat transfer enhancement. Means to improve the stability of boiling and the enhancement of boiling heat transfer, in general, are discussed.

scholarly journals Deterioration in Heat Transfer to Fluids at Supercritical Pressure and High Heat Fluxes

1969 ◽  
Vol 91 (1) ◽  
pp. 27-36 ◽  
Author(s):  
B. S. Shiralkar ◽  
Peter Griffith
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
High Heat ◽  
Supercritical Pressure ◽  
Heat Fluxes ◽  
Bulk Temperature ◽  
Operating Pressure ◽  
The Heat Transfer Coefficient

At slightly supercritical pressure and in the neighborhood of the pseudocritical temperature (which corresponds to the peak in the specific heat at the operating pressure), the heat transfer coefficient between fluid and tube wall is strongly dependent on the heat flux. For large heat fluxes, a marked deterioration takes place in the heat transfer coefficient in the region where the bulk temperature is below the pseudocritical temperature and the wall temperature above the pseudocritical temperature. Equations have been developed to predict the deterioration in heat transfer at high heat fluxes and the results compared with previously available results for steam. Experiments have been performed with carbon dioxide for additional comparison. Limits of safe operation for a supercritical pressure heat exchanger in terms of the allowable heat flux for a particular flow rate have been determined theoretically and experimentally.

Preliminary Results of Pressure Drop Modeling During Flow Boiling in Open Microchannels With Uniform and Tapered Manifolds (OMM)

2013 ◽  
Author(s):  
Ankit Kalani ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Pressure Drop ◽  
Flow Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Working Fluid ◽  
Full Potential ◽  
Transfer Coefficients ◽  
Open Microchannel

Flow boiling with microchannel can dissipate high heat fluxes at low surface temperature difference. A number of issues, such as instabilities, low critical heat flux (CHF) and low heat transfer coefficients, have prevented it from reaching its full potential. A new design incorporating open microchannels with uniform and tapered manifold (OMM) was shown to mitigate these issues successfully. Distilled, degassed water at 80 mL/min is used as the working fluid. Plain and open microchannel surfaces are used as the test sections. Heat transfer and pressure drop performance for uniform and tapered manifold with both the surfaces are discussed. A low pressure drop of 7.5 kPa is obtained with tapered manifold and microchannel chip at a heat flux of 263 W/cm2 without reaching CHF. The pressure drop data is further compared with the homogenous model and the initial results are presented.

Effect of Velocity on Heat Transfer to Boiling Freon-113

1980 ◽  
Vol 102 (1) ◽  
pp. 26-31 ◽  
Author(s):  
Salim Yilmaz ◽  
J. W. Westwater
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Atmospheric Pressure ◽  
Nucleate Boiling ◽  
High Heat ◽  
Heat Fluxes ◽  
Forced Flow ◽  
Film Boiling ◽  
Square Root ◽  
Peak Heat Flux

Measurements were made of the heat transfer to Freon-113 at near atmospheric pressure, boiling outside a 6.5 mm dia horizontal steam-heated copper tube. Tests included pool boiling and also forced flow vertically upward at uelocities of 2.4, 4.0 and 6.8 m/s. The metal-to-liquid ΔT ranged from 13 to 125° C, resulting in nucleate, transition, and film boiling. The boiling curves for different velocities did not intersect or overlap, contrary to some prior investigators. The peak heat flux was proportional to the square root of velocity, agreeing with the Vliet-Leppert correlation, but disagreeing with the Lienhard-Eichhorn prediction of an exponent of 0.33. The forced-flow nucleate boiling data were well correlated by Rohsenow’s equation, except at high heat fluxes. Heat fluxes in film boiling were proportional to velocity to the exponent 0.56, close to the 0.50 value given by Bromley, LeRoy, and Robbers. Transition boiling was very sensitive to velocity; at a ΔT of 55° C the heat flux was 900 percent higher for a velocity of 2.4 m/s than for zero velocity.

Modelling Heat Transfer Performance of a Thin Bi-Porous Evaporator for a Heat Pipe

2005 ◽  
Author(s):  
Aleksander Vadnjal ◽  
Ivan Catton
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
High Heat ◽  
Heat Transfer Process ◽  
Heat Fluxes ◽  
Capillary Structure ◽  
Porous Wick ◽  
Capillary Limit ◽  
Porous Capillary Structure ◽  
Selection Of

The evaporator of a heat exchanger is made with a porous, capillary, structure. In the past researchers [7] noticed that the heat flux limits of a bi-porous capillary structure is much greater than that of a mono-porous capillary structure and will be the focus of this work. There are three distinct stages in the heat transfer process in a bi-porous wick. Each of the stages is explored in turn. In the first stage, heat is transferred from the wall across the saturated wick by pure conduction to the evaporating front located on the top of the bi-porous wick. When the boiling limit is reached, bubbles begin to nucleate and the second stage begins. The boiling becomes more and more intensive as the heat flux is increased until all of the liquid from big pores is evaporated, and only small pores remain wetted with liquid. The point reached here is called the capillary limit, which is basically the limit at which the capillary forces are still sufficient to provide the liquid for evaporation into the big pores. The modelling of the different thermal physical processes determining heat transfer within each of the three stages for a bi-porous heat wick are modelled and significant improvement in achievable heat flux is observed. Comparison with experiment is found to be reasonable. Optimal selection of the bi-porous wick characteristics is shown to yield very high heat fluxes.

Heat Transfer and Hydraulic Characteristics of Cooling Water in a Flat Plate Heat Sink for High Heat Flux IGBT

2016 ◽  
Author(s):  
Chang-Nian Chen ◽  
Ji-Tian Han ◽  
Wei-Ping Gong ◽  
Tien-Chien Jen
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flat Plate ◽  
Heat Sink ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Hydraulic Characteristics ◽  
Flow Rates ◽  
Plate Heat

High heat flux is very dangerous for electronic heat transfer, such as IGBT (Insulated Gate Bipolar Transistor) cooling. In order to explore and master the heat transfer and hydraulic characteristics for IGBT cooling, experiments have been carried out to study the situation mentioned above in a flat plate heat sink, which was designed for high heat flux IGBT cooling. The geometrical parameters of the test section are as follows: outline dimension 229 mm × 124 mm × 30 mm; flow channels of 229 mm × 3 mm × 4 mm in total of 20. The experiments performed at atmospheric pressure and with inlet temperatures of 25–35°C, heat fluxes of 3.5–18.9 kW/m2. The influence of temperatures, heat fluxes on IGBT surface temperature and the cooling effect of the liquid cold plate have been investigated under a range of flow rates of 280–2300 kg/m2s. It was found that the heat transfer enhancement was very obvious using this kind of small sized channel for IGBT cooling, which was tens of times of the effect than air cooling or triple of the effect than that in normal sized channels. And the heat transfer enhancement increases with increasing heat fluxes and flow rates, while it decreases with increasing inlet temperatures. Most of the experimental results show good cooling effect as expected. However, it is dangerous for the cooling system under high heat fluxes when the system starts or stops suddenly, when the Respond Time (RT) is less than 5 seconds to cut off heated power. Also, the cooling performance is bad when the heat fluxes increased greatly, which is considered as abnormal situation in operating. The effect on IGBT surface temperature of heat flux is more obvious when the average Nusselt Number is smaller. For hydraulic characteristics observed, it was found that the flow friction increased with flow rates increasing, but the pressure drops of heated flow channels ahead were slightly larger than those back, especially under large flow rates conditions. That is because the temperatures of flow heated in channels ahead are lower than those back, which causes the fluid viscosity to be higher. At last, this paper suggested a series of method for enhancing heat transfer in flat plate heat sink, and also gave some ways to avoid heat transfer dangerous situations for IGBT cooling, which can provide a basis for thermodynamic and hydraulic calculation of flat plate heat sink design and lectotype.

Prediction of Refrigerant Flow Boiling Hysteresis With an Augmented Separated-Flow Model

2016 ◽  
Author(s):  
Jianwei Gao ◽  
Hongxia Li ◽  
Saif Almheiri ◽  
TieJun Zhang
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Surface Temperature ◽  
Flow Model ◽  
Flow Boiling ◽  
Separated Flow ◽  
High Heat ◽  
Heat Fluxes ◽  
High Heat Flux ◽  
Boiling Hysteresis

Thermal management is essential to compact devices particularly for high heat flux removal applications. As a popular thermal technology, refrigeration cooling is able to provide relatively high heat flux removal capability and uniform device surface temperature. In a refrigeration cycle, the performance of evaporator is extremely important to the overall cooling efficiency. In a well-designed evaporator, effective flow boiling heat transfer can be achieved whereas the critical heat flux (CHF) or dryout condition must be avoided. Otherwise the device surface temperature would rise significantly and cause device burnout due to the poor heat transfer performance of film boiling. In order to evaluate the influence of varying imposed heat fluxes, saturated flow boiling in the evaporator is systematically studied. The complete refrigerant flow boiling hysteresis between the imposed heat flux and the exit wall superheat is characterized. Upon the occurrence of CHF at the evaporator wall exit, the wall heat flux redistributes due to the axial wall heat conduction, which drives the dryout point to propagate upstream in the evaporator. As a result, a significant amount of thermal energy is stored in the evaporator wall. While the heat flux starts decreasing, the dryout point moves downstream and closer to the exit. The stored heat in the wall dissipates slowly and leads to the delay in rewetting or quenching, which is the key to understand and predict the flow boiling hysteresis. In order to reveal the transient heat releasing mechanism, an augmented separated-flow model is developed to predict the moving rewetting point and minimum heat flux at the evaporator exit, and the model predictions are further validated by experimental data from a refrigeration cooling testbed.

scholarly journals Effects of Hydrophobic Surface Patterning on Boiling Heat Transfer and Critical Heat Flux of Water at Atmospheric Pressure

2013 ◽  
Author(s):  
Carolyn Coyle ◽  
Harry O’Hanley ◽  
Bren Phillips ◽  
Jacopo Buongiorno ◽  
Thomas McKrell
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Critical Heat Flux ◽  
Infrared Camera ◽  
Hydrophobic Surface ◽  
Sio2 Nanoparticles ◽  
High Heat ◽  
Surface Patterning ◽  
Heat Fluxes ◽  
Layer By Layer

The effects of hydrophilic/hydrophobic surface patterning on critical heat flux (CHF) and heat transfer coefficient (HTC) were studied using custom-engineered testing surfaces. Patterning was created over a sapphire substrate and tested in a pool boiling facility in MITs Reactor Hydraulics Laboratory. The hydrophilic and hydrophobic matrices were created using layer by layer deposition of 50 nm thick SiO2 nanoparticles and monolayer thickness fluorosilane, respectively. Ultraviolet ozone patterning was then used with chrome-printed masks to create the desired geometric features. Hexagon, ring, star, and mixed patterns were tested to determine their abilities to affect CHF and HTC through prevention of bubble pinning at high heat fluxes. During testing, an infrared camera was used to measure the surface temperature distribution as well as locate nucleation sites for data analysis. It was found that CHF values were enhanced over the bare sapphire values by approximately 90% for hexagons, 60% for stars, 65% for rings, and 50% for mixed patterns. Contrary to expectations, patterning did not seem to affect the HTC values significantly. Although patterning did improve CHF performance over bare heaters, both CHF and HTC were found to be statistically similar to those for unpatterned, uniformly hydrophilic surfaces.

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