Nano Indentation Response of Various Thin Films Used for Tribological Applications

Author(s):  
Manish Roy

Various thin films used for tribological applications are classified under four heads. Based on their load vs. displacement curves, which have some characteristics features, the ratio of nanohardness to elastic modulus and the ratio of cube of nanohardness to square of elastic modulus are evaluated in this chapter. It is demonstrated that depending on the type of film used, these ratios vary within a certain range. For soft self-lubricating films, these ratios are very low; whereas for hard self-lubricating film, these ratios are quite high.

2021 ◽  
Vol 118 (10) ◽  
pp. 102901
Author(s):  
Shelby S. Fields ◽  
David H. Olson ◽  
Samantha T. Jaszewski ◽  
Chris M. Fancher ◽  
Sean W. Smith ◽  
...  

Author(s):  
Taylor C. Stimpson ◽  
Daniel A. Osorio ◽  
Emily D. Cranston ◽  
Jose M. Moran-Mirabal
Keyword(s):  

2009 ◽  
Vol 42 (17) ◽  
pp. 175506 ◽  
Author(s):  
Xiu-Peng Zheng ◽  
Yan-Ping Cao ◽  
Bo Li ◽  
Xi-Qiao Feng ◽  
Hanqing Jiang ◽  
...  

Author(s):  
Cemal Basaran ◽  
Jianbin Jiang

Young’s modulus (E) values published in literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by single crystal elasticity and experimentally by ultrasonic testing and Nano indentation. We compare these procedures and propose a procedure for elastic modulus determination. The deformation kinetics of the Pb/Sn solder alloys is discussed at the grain size level.


2007 ◽  
Vol 40 (22) ◽  
pp. 7755-7757 ◽  
Author(s):  
Jong-Young Lee ◽  
Kristin E. Su ◽  
Edwin P. Chan ◽  
Qingling Zhang ◽  
Todd Emrick ◽  
...  

2011 ◽  
Vol 495 ◽  
pp. 108-111 ◽  
Author(s):  
Vasiliki P. Tsikourkitoudi ◽  
Elias P. Koumoulos ◽  
Nikolaos Papadopoulos ◽  
Costas A. Charitidis

The adhesion and mechanical stability of thin film coatings on substrates is increasingly becoming a key issue in device reliability as magnetic and storage technology driven products demand smaller, thinner and more complex functional coatings. In the present study, chemical vapor deposited Co and Co3O4thin films on SiO2and Si substrates are produced, respectively. Chemical vapor deposition is the most widely used deposition technique which produces thin films well adherent to the substrate. Co and Co3O4thin films can be used in innovative applications such as magnetic sensors, data storage devices and protective layers. The produced thin films are characterized using nanoindentation technique and their nanomechanical properties (hardness and elastic modulus) are obtained. Finally, an evaluation of the reliability of each thin film (wear analysis) is performed using the hardness to elastic modulus ratio in correlation to the ratio of irreversible work to total work for a complete loading-unloading procedure.


Author(s):  
Tribeni Roy ◽  
Anuj Sharma ◽  
Prabhat Ranjan ◽  
R. Balasubramaniam

Abstract Electrical discharge machined surfaces inherently possess recast layer on the surface with heat affected zone (HAZ) beneath it and these have a detrimental effect on the mechanical properties viz. hardness, elastic modulus, etc. It is very difficult to experimentally characterise each machined surface. Therefore, an attempt is made in this study to numerically calculate the mechanical properties of the parent material, HAZ and the recast layer on a hemispherical protruded micro feature fabricated by reverse micro EDM (RMEDM). In the 1st stage, nano indentation was performed to experimentally determine the load-displacement plots, elastic modulus and hardness of the parent material, HAZ and the recast layer. In the 2nd stage, FEA simulation was carried out to mimic the nano indentation process and determine the load-displacement plots for all the three cases viz. parent material, recast layer and HAZ. Results demonstrated that the load'displacement plots obtained from numerical model in each case was in good agreement with that of the experimental curves. Based on simulated load-displacement plots, hardness was also calculated for parent material, HAZ and the recast layer. A maximum of 11% error was observed between simulated values of hardness and experimentally determined values.


2009 ◽  
Vol 1239 ◽  
Author(s):  
Yong Sun ◽  
Zaiwang Huang ◽  
Xiaodong Li

AbstractA facile electrophoretic deposition method was successfully applied to achieve novel nanoclay-reinforced polyacrylamide nanocomposite thin films. A special curled architecture of the re-aggregated nanoclay-platelets was identified, providing a possible source for realizing the interlocking mechanism in the nanocomposites. The curled architecture could be the result from strain releasing when the thin films were peeled off from the substrates. Through micro-/nano-indentation and in situ observation of the deformation during tensile test with an atomic force microscope (AFM), the localized deformation mechanism of the synthesized materials was investigated in further details. The results implied that a localized crack diversion mechanism worked in the synthesized nanocomposite thin films, which resembled its nature counterpart-nacre. The deformation behavior and fracture mechanism were discussed with reference to lamellar structure, interfacial strength between the nanoclays and the polyacrylamide matrix, and nanoclay agglomeration.


2018 ◽  
Vol 2018 ◽  
pp. 1-10 ◽  
Author(s):  
Rodica Vladoiu ◽  
Aurelia Mandes ◽  
Virginia Dinca-Balan ◽  
Vilma Bursikova

Nanostructured C-Ag thin films of 200 nm thickness were successfully synthesized by the Thermionic Vacuum Arc (TVA) method. The influence of different substrates (glass, silicon wafers, and stainless steel) on the microstructure, morphology, and mechanical properties of nanostructured C-Ag thin films was characterized by High-Resolution Transmission Electron Microscopy (HRTEM), Scanning Electron Microscopy (SEM), Atomic Force Microscopy (AFM), and TI 950 (Hysitron) nanoindenter equipped with Berkovich indenter, respectively. The film’s hardness deposited on glass (HC-Ag/Gl = 1.8 GPa) was slightly lower than in the case of the C-Ag film deposited on a silicon substrate (HC-Ag/Si = 2.2 GPa). Also the apparent elastic modulus Eeff was lower for C-Ag/Gl sample (Eeff = 100 GPa) than for C-Ag/Si (Eeff = 170 GPa), while the values for average roughness are Ra=2.9 nm (C-Ag/Si) and Ra=10.6 (C-Ag/Gl). Using the modulus mapping mode, spontaneous and indentation-induced aggregation of the silver nanoparticles was observed for both C-Ag/Gl and C-Ag/Si samples. The nanocomposite C-Ag film exhibited not only higher hardness and effective elastic modulus, but also a higher fracture resistance toughness to the silicon substrate compared to the glass substrate.


2008 ◽  
Vol 103 (12) ◽  
pp. 123515 ◽  
Author(s):  
J. Neidhardt ◽  
C. Walter ◽  
J. M. Molina-Aldareguia ◽  
M. Herrmann ◽  
W. J. Clegg ◽  
...  

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