Thermal Analysis and Cooling Optimization of the Built-In Micro Projector

2012 ◽  
Vol 160 ◽  
pp. 3-7
Author(s):  
Wei Wei ◽  
Ping Yang ◽  
Qian Hong He ◽  
Quay Le Chen
Keyword(s):  
Thermal Analysis ◽  
Mobile Phones ◽  
Heat Dissipation ◽  
Rapid Development ◽  
Thermal Design ◽  
Design Stage ◽  
Analysis Software ◽  
Projection Function ◽  
Simulation Results ◽  
Thermal Sources

With the rapid development of the micro projector, the problems of its power consumption and heat dissipation have been increasingly serious. The thermal design can improve its reliability and cut costs at the design stage. This article selects DLP built-in micro projector provided by TI Company to analyze, uses thermal analysis software Flotherm to get the temperature distribution and temperature curves of the measuring points in the steady state, then compares the simulation results of the cooling optimization with the numerical analysis, which reduces the temperatures of thermal sources and shells. The conclusion supplies new theoretical basis on the development of mobile phones integrated with the projection function.

Numerical Analysis of Temperature Field on the Desktop Computer Motherboard

2014 ◽  
Vol 644-650 ◽  
pp. 1531-1534
Author(s):  
Mao De Li ◽  
Cong Qiu ◽  
Zhi Song Zheng
Keyword(s):  
Numerical Simulation ◽  
Thermal Analysis ◽  
Temperature Field ◽  
Heat Dissipation ◽  
Software Modeling ◽  
Ansys Software ◽  
Analysis Software ◽  
Desktop Computer ◽  
Higher Power ◽  
Simulation Results

The motherboard is one of the most important parts of a computer. According to the ATX motherboard, this article introduces the numerical simulation of temperature field on the motherboard by using thermal analysis software. Firstly introducing the heat production of a motherboard briefly, then the article takes advantage of ANSYS software modeling based on the prototype of ATX motherboard, meshing, solving, and compares the results with the actual value which are well agreed. From the simulation results, it is shown that the display card and Northbridge CPU with higher power consumption. Their heat dissipation configuration should be enhanced.

scholarly journals Research on Thermal Design of Server Structure Based on LRM Mode

2021 ◽  
Vol 2095 (1) ◽  
pp. 012084
Author(s):  
Lu Ju ◽  
Shiying Men ◽  
Huan Liu ◽  
Yaozhong Chen ◽  
Jinfeng Qiao
Keyword(s):  
Thermal Analysis ◽  
Heat Pipe ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Experimental Results ◽  
Cooling Efficiency ◽  
Integration Degree

Abstract Aiming at the module heat dissipation problem of a military domestic LRM mode server, a thermal design which can improve the module cooling efficiency and equipment integration is proposed. The design can realize the easy heat dissipation and high integration of on-board equipment. Through the design of fan device, module cooling and heat pipe, the heat dissipation efficiency of the server was improved, and the heat dissipation capacity of the module was improved. Thus the integration degree of on-board equipment was improved. The designed server was thermally analyzed and tested at + 65 °C. By comparing the experimental results with the thermal analysis results, the conclusion proved the correctness and feasibility of the research content in this paper.

Research of Flat Heat Pipe Radiator Applied in LED Lighting

2013 ◽  
Vol 333-335 ◽  
pp. 2039-2043
Author(s):  
Yi Bing Liu
Keyword(s):  
Thermal Analysis ◽  
Heat Pipe ◽  
Experimental Results ◽  
Temperature Uniformity ◽  
Analysis Software ◽  
Led Lighting ◽  
Plate Heat ◽  
Simulation Results ◽  
Flat Heat Pipe

A kind of plate heat pipe radiator is designed as LED lighting heat dissipating arrangement. The plate heat pipe radiator structure is optimized by the thermal analysis software ANSYS and the optimized parameter is: fin space, 5mm, length, 180mm, width, 51mm. The optimized heat pipe radiator is validated by experiments. The experimental results and the simulation results are consistent with each other, which further verified good temperature uniformity of the heat pipe.

Thermal Analysis of High-Power LED Tube Lamp

2011 ◽  
Vol 308-310 ◽  
pp. 346-350 ◽  
Author(s):  
Xiang Jun Ma ◽  
Li Gang Wu ◽  
Shi Xun Dai ◽  
Bo You Zhou ◽  
Kun Bai ◽  
...  
Keyword(s):  
Finite Element Method ◽  
High Power ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Junction Temperature ◽  
Key Technology ◽  
High Power Led ◽  
Detailed Simulation ◽  
Simulation Results ◽  
Thermal Grease

Heat dissipation of high-power LED lamps has become a key technology to LED package due to the improvement of the LED output power. A detailed simulation of temperature distribution of three chips high-power LED tube lamp was made by finite element method. Based on the consistency of the LED lamp experimental and simulation results, the analyses of the effect of thermal conductivities of PCB, thermal grease, heat sink, convection coefficients and the length of the lamp on the junction temperature were made, which provide an effective reference for the thermal design.

Thermal Characterization of an All-Active Microring Resonating Laser

2004 ◽  
Author(s):  
Amy S. Fleischer ◽  
Ute Troppenz ◽  
Michael Hamacher ◽  
Werner John
Keyword(s):  
Thermal Analysis ◽  
Power Dissipation ◽  
Operating Temperature ◽  
Thermal Characterization ◽  
Optical Signal ◽  
Thermal Design ◽  
Microring Resonator ◽  
Design Stage ◽  
Vertical Coupling

Active microring optical devices are promising candidates for use in next generation optical signal processing and sensor products. In this design, an InP based microring laser is vertically coupled to a passive feeding waveguides using a waferbonding technology. The vertical coupling is expected to detrimentally affect the operating temperature and device performance through the low thermal conductivity of the bond material. Thus, a thermal analysis is undertaken in the design stage to better understand the implications of this fabrication process. A thermal analysis of a basic microring resonator of 50 μm radius and 100 mW power dissipation is presented and thermal design variations are discussed.

Study on Thermal Analysis of Main Mirror in Space Solar Telescope

2011 ◽  
Vol 328-330 ◽  
pp. 300-304 ◽  
Author(s):  
Rong Li ◽  
Hu Li Shi ◽  
Zhi Ping Chen
Keyword(s):  
Thermal Analysis ◽  
Temperature Field ◽  
Thermal Control ◽  
Thermal Design ◽  
Solar Observation ◽  
Solar Telescope ◽  
The Sun ◽  
Analysis Software ◽  
Primary Mirror ◽  
Space Solar Telescope

The proposed Chinese Space Solar Telescope (SST) is the first large aperture space telescope in China designed to observe the sun. With an effective aperture of Φ1m, the primary mirror faces the sun directly, which receives more than 1000W heat that will lead to unacceptable thermal distortion in such severe thermal condition. Therefore, the temperature field of SST, which is changing with its orbital position, is critical in its design. In this paper, an analysis of the thermal flux in the SST is presented firstly. Further more, the heat flux of orbit is calculated with the thermal softerware NEVADA (Net Energy Verification And Determination Analyzer) according to the orbit parameters of SST. The thermal design software SINDA/G (System Improved Numerical Differencing Analyzer/Gaski), the radiation analysis software NEVADA and the finite element analysis software MSC.Patran are used to simulate the temperature field of the SST. In the end, the temperature distribution of the primary mirror is calculated. The temperature level of the primary mirror indicates that the system can achieve high spatial resolution with 0.1″~0.15″. It also means that the thermal control design is effective. The optical requirements to the SST thermal control are met. The thoughts and methods of the thermal analysis are also useful for similar optical telescopes designed for solar observation.

Thermal Design Improvements on Avionic Device in Confined Space under Supersonic Conditions

2013 ◽  
Vol 842 ◽  
pp. 536-540
Author(s):  
Yang Li ◽  
Gui Cui Fu ◽  
Nan Li
Keyword(s):  
High Temperature ◽  
Heat Exchange ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Heat Sinks ◽  
Confined Space ◽  
Design Rules ◽  
Numerical Studies ◽  
Simulation Results ◽  
Electronic Cabinet

Thermal design improvements of avionic devices in confined space under supersonic conditions are presented in this paper through a numerical studies and improvements on the heat sinks and cooling vents. The components locations are also rearranged. Thus the avionic device can operate in the confined space, and heat dissipation can be easier. Simulation results show that the cooling vents added on the surfaces of the electronic cabinet can make heat exchange more smoothly, and the high temperature zones are affected by the changing of the locations of heat sinks obviously. The design rules and guidelines are proposed to improve thermal design. The design and simulation results can be used as the reference for the thermal design of other avionic devices in the similar style.

Thermal Design and Thermal Analysis of Control Cabinet for Pattern Sewing Machine

2012 ◽  
Vol 217-219 ◽  
pp. 2467-2472
Author(s):  
Qi Bing Li ◽  
Yu Huang
Keyword(s):  
Thermal Analysis ◽  
Heat Dissipation ◽  
Research Process ◽  
Basic Flow ◽  
Thermal Design ◽  
Flow Sheet ◽  
Sewing Machine ◽  
Numerical Simulation Result ◽  
Thermal Test ◽  
Control Cabinet

Thermal design and thermal analysis of control cabinet for pattern sewing machine was researched to make components’ temperature meets the requirement. Basic flow sheet of research process was introduced. Then, preliminary thermal design and thermal analysis was performed, and the computed result indicated that temperature of some components was out of limit. Next, by optimizing the location of fan and components in cabinet, the temperature of servo driver 1 to 3 dropped 11.1 oC, 10.8 oC and 11.3 oC respectively. The data shows that cabinet’s heat dissipation is improved, and the thermal design of the cabinet is reasonable. Finally, Thermal test of the prototype was performed, which proves the thermal design is effective, and the numerical simulation result is correct.

Thermal Analysis of Desktop Computer Based on Icepak

2014 ◽  
Vol 889-890 ◽  
pp. 417-420
Author(s):  
Tian Wang ◽  
Ping Xu ◽  
Xian Cheng
Keyword(s):  
Thermal Analysis ◽  
Environmental Temperature ◽  
System Structure ◽  
Normal Operation ◽  
Stable Operation ◽  
Optimized Design ◽  
Analysis Software ◽  
Desktop Computer ◽  
Computer Based ◽  
Simulation Results

Generally, after the desktop computer working very long hours under the high environmental temperature, the components temperature inside the computer chassis would rise. If the temperature of the components was too high to meet the spec, it affected the normal operation of the equipment. Icepak thermal analysis software was adopted for optimized design of the desktop computer system structure, and in the case of not changing the installed position of every component, the internal duct of the computer chassis was designed. The conclusion is known from the simulation results that the design can effectively decrease the components temperature inside the computer and also ensure the stable operation of the equipment.

scholarly journals Evasion guidance for air-breathing hypersonic vehicles against unknown pursuer dynamics

2021 ◽  
Author(s):  
Tian Yan ◽  
Yuanli Cai ◽  
Bin Xu
Keyword(s):  
Parameter Estimation ◽  
Gradient Descent ◽  
Rapid Development ◽  
Energy Optimization ◽  
Hypersonic Vehicles ◽  
Air Breathing ◽  
Related Research ◽  
Practical Guidance ◽  
Simulation Results ◽  
Guidance Algorithm

AbstractThe rapid development of hypersonic vehicles has motivated the related research dramatically while the evasion of the hypersonic vehicles becomes one of the challenging issues. Different from the work based on the premise that the pursuers’ information is fully known, in this paper the evasion guidance for air-breathing hypersonic vehicles (AHVs) against unknown pursuer dynamics is studied. The gradient descent is employed for parameter estimation of the unknown dynamics of the pursuer. The energy-optimized evasion guidance algorithm is further developed by taking the acceleration constraint and energy optimization into consideration. Under the proposed algorithm, the system can deal with the unknown pursuer dynamics effectively and provide more practical guidance for the evasion process. The simulation results show that the proposed method can enable the AHV to achieve successful evasion.

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