Design of the Heat Dissipation for 4W High Power LED Lamp

At present, about 80 ~ 90% of high-power LED input power is converted into heat, so heat dissipation is a key factor affecting the use of LED. By the theory of thermal resistance, the heat conduction mode of the 4W high power LED light is obtained, and the effective cooling area of the LED radiator is computed. According to the EFD method the natural convection thermal analysis is conducted. Finally the heat experiment is conducted to verify the simulation results. The results show that the LED radiator meet the application requirement, namely the maximum temperature is less than 65°C. Undoubtedly the research will provide design guidance on the heat dissipation of LED lighting

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MEMS Based Metal Plated Silicon Package for High Power LED

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.326-328.309 ◽

2006 ◽

Vol 326-328 ◽

pp. 309-312 ◽

Cited By ~ 1

Author(s):

Sung Jun Lee ◽

Ji Hyun Park ◽

Chang Hyun Lim ◽

Won Kyu Jeong ◽

Seog Moon Choi ◽

...

Keyword(s):

Thermal Resistance ◽

High Power ◽

Power Dissipation ◽

Heat Dissipation ◽

High Efficiency ◽

Low Cost ◽

Wafer Level ◽

High Power Led ◽

Key Factor ◽

Mems Technology

By the development of high power LED for solid states lighting, the requirement for driving current has increased critically, thereby increasing power dissipation. Heat flux corresponds to power dissipation is mainly generated in p-n junction of LED, so the effective removal of heat is the key factor for long lifetime of LED chip. In this study, we newly proposed the silicon package for high power LED using MEMS technology and estimated its heat dissipation characteristic. Our silicon package structure is composed of base and reflector cup. The role of base is that settle LED chip at desired position and supply electrical interconnection for LED operation, and finally transfer the heat from junction region to outside. For improved heat transfer, we introduced the heat conductive metal plated trench structure at the opposite side of LED attached side. The depth and the diameter of trench were 150 and 100um, respectively. Copper with high thermal conductivity than silicon was filled in trench by electroplating and the thickness of copper was about 100um. Reflector cup was formed by anisotropic wet etching and then, silicon package platform could be fabricated by eutectic bonding between base and reflector cup. The thermal resistance of silicon package was about 6 to 7K/W from junction to case, and also, thermal resistance reduction of 0.64K/W was done by metal plated trench. This result could be comparable to that of other high power LED package. Our silicon package platform is easy to be expanded into array and wafer level package. So, it is suitable for future high efficiency and low cost package.

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High Power LED Heat Dissipation Comparison Analysis via Aluminum and Copper Slug

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.893.811 ◽

2014 ◽

Vol 893 ◽

pp. 811-814

Author(s):

Rajendaran Vairavan ◽

Zaliman Sauli ◽

Vithyacharan Retnasamy

Keyword(s):

High Power ◽

Heat Dissipation ◽

Simulation Analysis ◽

Input Power ◽

Junction Temperature ◽

Von Mises Stress ◽

Comparison Analysis ◽

Single Chip ◽

High Power Led ◽

Von Mises

The vast development of the LED industry has created contemporary set of thermal issues with limits the reliability of the high power LEDs. Thus, this paper reports a simulation analysis done on single chip high power LED package to evalute the effects of heat slug material on the heat dissipation of the LED package. The heat dissipation of two types of heat slug material, aluminum (Al) and copper (Cu) were compared in terms of junction temperature, von Mises stress and thermal resistance of the LED chip at varied input power of 0.1 W and 1W. Results of the analysis showed that the copper heat slug exhibits a better heat dissipation due to its superior thermal conductivity.

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Comparative Analysis Between Water-Cooled and Air-Cooled Heat Dissipation in a High-Power Light-Emitting Diode Chipset

Journal of Thermal Science and Engineering Applications ◽

10.1115/1.4043004 ◽

2019 ◽

Vol 11 (6) ◽

Author(s):

Yuanlong Chen ◽

Tingbo Hou ◽

Minqiang Pan

Keyword(s):

Thermal Conductivity ◽

Flow Rate ◽

High Power ◽

Heat Dissipation ◽

Volumetric Flow Rate ◽

Critical Value ◽

Input Power ◽

Substrate Thickness ◽

Light Emitting ◽

High Power Led

With a substantial increase in thermal power density, the operating temperature of high-power light-emitting diodes (LEDs) rises rapidly, exerting a notable effect on chipsets’ performance. A water-cooled microchannel radiator and an air-cooled radiator are proposed to solve this problem. The effects of key factors of both radiators on heat dissipation in a high-power LED chipsets, and general comparisons between each method, are analyzed via Fluent. The simulation results indicate that heat dissipation from the water-cooled microchannel radiator is readily affected by the microchannel’s flow rate and aspect ratio. A larger flow rate and larger aspect ratio favor improved heat dissipation in the water-cooled microchannel radiator. Heat dissipation in the air-cooled radiator is related to volumetric flow rate, rib number, rib height, rib thickness, and substrate thickness. A larger volumetric flow rate, rib number, and rib height favor heat dissipation in the air-cooled radiator. However, there is a critical thickness value: if the thickness is less than the critical value, heat dissipation is greatly affected by rib thickness and substrate thickness, if the thickness is larger than the critical value, the influence is insignificant. The high-power LED chipsets’ temperature is also related to the insulating substrate’ input power and thermal conductivity. A large input power leads to a substantial increase in temperature, and larger thermal conductivity of the insulating substrate minimizes temperature increase in the high-power LED chipsets. When comparing the two radiators, results show an air-cooled radiator should be used in low-power LED chipsets. When an air-cooled radiator cannot satisfy the chipset’s needs, a water-cooled microchannel radiator should be utilized.

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Improved Heat Dissipation of High-Power LED Lighting by a Lens Plate with Thermally-Conductive Plastics

Journal of Nanoscience and Nanotechnology ◽

10.1166/jnn.2018.14950 ◽

2018 ◽

Vol 18 (3) ◽

pp. 1909-1912 ◽

Cited By ~ 1

Author(s):

Dong Kyu Lee ◽

Hyun Jung Park ◽

Yu-Jung Cha ◽

Hyeong Jin Kim ◽

Joon Seop Kwak

Keyword(s):

High Power ◽

Heat Dissipation ◽

Led Lighting ◽

High Power Led ◽

Thermally Conductive ◽

Conductive Plastics

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Thermal conductivity performance of nanoporous plate for high-power LED lighting and power electronics

Journal of Physics Conference Series ◽

10.1088/1742-6596/1309/1/012016 ◽

2019 ◽

Vol 1309 ◽

pp. 012016

Author(s):

A D Kurilov ◽

V V Belyaev ◽

K D Nessemon ◽

E D Besprozvannyi ◽

A O Osin ◽

...

Keyword(s):

Thermal Conductivity ◽

Power Electronics ◽

High Power ◽

Led Lighting ◽

High Power Led

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Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

Applied Sciences ◽

10.3390/app11094035 ◽

2021 ◽

Vol 11 (9) ◽

pp. 4035

Author(s):

Jinsheon Kim ◽

Jeungmo Kang ◽

Woojin Jang

Keyword(s):

Light Source ◽

High Power ◽

Heat Dissipation ◽

Light Emitting Diode ◽

Light Distribution ◽

Light Sources ◽

Led Light ◽

High Power Led ◽

Distribution Requirement ◽

Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

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