MEMS Based Metal Plated Silicon Package for High Power LED

2006 ◽  
Vol 326-328 ◽  
pp. 309-312 ◽  
Author(s):  
Sung Jun Lee ◽  
Ji Hyun Park ◽  
Chang Hyun Lim ◽  
Won Kyu Jeong ◽  
Seog Moon Choi ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Power Dissipation ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Low Cost ◽  
Wafer Level ◽  
High Power Led ◽  
Key Factor ◽  
Mems Technology

By the development of high power LED for solid states lighting, the requirement for driving current has increased critically, thereby increasing power dissipation. Heat flux corresponds to power dissipation is mainly generated in p-n junction of LED, so the effective removal of heat is the key factor for long lifetime of LED chip. In this study, we newly proposed the silicon package for high power LED using MEMS technology and estimated its heat dissipation characteristic. Our silicon package structure is composed of base and reflector cup. The role of base is that settle LED chip at desired position and supply electrical interconnection for LED operation, and finally transfer the heat from junction region to outside. For improved heat transfer, we introduced the heat conductive metal plated trench structure at the opposite side of LED attached side. The depth and the diameter of trench were 150 and 100um, respectively. Copper with high thermal conductivity than silicon was filled in trench by electroplating and the thickness of copper was about 100um. Reflector cup was formed by anisotropic wet etching and then, silicon package platform could be fabricated by eutectic bonding between base and reflector cup. The thermal resistance of silicon package was about 6 to 7K/W from junction to case, and also, thermal resistance reduction of 0.64K/W was done by metal plated trench. This result could be comparable to that of other high power LED package. Our silicon package platform is easy to be expanded into array and wafer level package. So, it is suitable for future high efficiency and low cost package.

scholarly journals Analysis and Prediction of Thermal Resistance for High Power LED Using GA-SVR

2012 ◽  
Vol 4 ◽  
pp. 153-160
Author(s):  
De Huai Zeng ◽  
Yuan Liu ◽  
Li Li ◽  
De Gui Yu ◽  
Gang Xu
Keyword(s):  
Service Life ◽  
Thermal Resistance ◽  
High Power ◽  
Thermal Characteristics ◽  
Junction Temperature ◽  
Support Vector ◽  
Mean Squared Errors ◽  
Absolute Relative Error ◽  
High Power Led ◽  
Key Factor

With the development of high power LED technology, junction temperature as a key factor constrains the performance and the service life of LED, and the main parameter of junction temperature is thermal resistance. Therefore, how to measure the thermal resistance of high power LED quickly and accurately plays an important part in improving the performance and the service life of LED. In this paper the accurate and fast measurement equipment was applied to study the thermal characteristics of high power LED. The forward-voltage based method was conducted to measure the junction temperature of high power. Then, support vector regression (SVR) combined with genetic algorithm (GA) for its parameter optimization, was proposed to establish a model to predict the thermal resistance of high power LED. The prediction performance of GA-SVR was compared with those of BPNN model. The result demonstrated that the estimated errors GA-SVR models, such as Mean Absolute Relative Error (MARE) and Root Mean Squared Errors (RMSE), all are smaller than those achieved by the BPNN applying identical samples.

A Novel High Efficiency Solution of High Power LED Lighting

2011 ◽  
Vol 301-303 ◽  
pp. 121-126
Author(s):  
Qiang Fan ◽  
Xian Song Fu ◽  
Yi Li Liu ◽  
Ping Juan Niu ◽  
Tie Cheng Gao
Keyword(s):  
High Power ◽  
High Efficiency ◽  
Supply Voltage ◽  
High Reliability ◽  
Current Mode ◽  
Constant Current ◽  
Output Current ◽  
High Power Led ◽  
Key Factor ◽  
Continuous Current

High power LED is a kind of ideal green lighting source, which owns longer life, higher efficiency and lower electricity power consumption than incandescent lamps and fluorescent bulbs. Constant current driver is the most key factor for high power LED’s premium properties. Based on the specific chip LM3478, a novel Boost DC/DC converting circuit to drive LED was proposed. The whole circuit structure was simple, and owned high reliability with over current protection. The circuit operates continuous current mode (CCM), with normal supply voltage 12V. The constant output current is 700mA, which can drive two-row LED series, 5 LEDs at least each series. The test results show that the electricity efficiency is up to 93.20% and that the output current deviation is 7.71%. The operating temperature range is -40~+125°C.

Experimental Study of Heat Pipe Exchanger for High Power LED Cooling System

2011 ◽  
Vol 295-297 ◽  
pp. 1985-1988
Author(s):  
Yu Jun Gou ◽  
Zhong Liang Liu ◽  
Xiao Hui Zhong
Keyword(s):  
Heat Exchanger ◽  
Heat Pipe ◽  
High Power ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Cooling System ◽  
Two Phase ◽  
High Power Led ◽  
New Type ◽  
Two Phase Heat Transfer

A new cooling concept for high power LED by combining the heat release of high power LED with two-phase heat transfer heat pipes was proposed, and in this study a new type of heat pipe with specific fins structure was developed. Through experimental results, we found the new heat pipe heat exchanger has the features of high efficiency of heat dissipation and compact construction which meets the demand of heat dissipation for high power LED. We also found the heat dissipation performance of the HP heat exchanger changed with the work angle.

Design of the Heat Dissipation for 4W High Power LED Lamp

2012 ◽  
Vol 241-244 ◽  
pp. 734-737
Author(s):  
Chang Yin Gao ◽  
Wan Quan Li
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Input Power ◽  
Maximum Temperature ◽  
Led Lighting ◽  
High Power Led ◽  
Key Factor ◽  
Conduction Mode ◽  
Heat Experiment ◽  
Design Guidance

At present, about 80 ~ 90% of high-power LED input power is converted into heat, so heat dissipation is a key factor affecting the use of LED. By the theory of thermal resistance, the heat conduction mode of the 4W high power LED light is obtained, and the effective cooling area of the LED radiator is computed. According to the EFD method the natural convection thermal analysis is conducted. Finally the heat experiment is conducted to verify the simulation results. The results show that the LED radiator meet the application requirement, namely the maximum temperature is less than 65°C. Undoubtedly the research will provide design guidance on the heat dissipation of LED lighting

Heat Sink Cooling Fan and Rotation Speed Effect Analysis on Heat Dissipation of High Power GaN LED Package

2014 ◽  
Vol 1082 ◽  
pp. 315-318
Author(s):  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Rotation Speed ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Cooling Fan ◽  
High Power Led ◽  
Von Mises

In this work, thermal simulation analysis on high power LED is reported where the effect of the heat sink cooling fan and its rotation speed on the heat dissipation of the high power LED was evaluated. Ansys version 11 was utilized for the simulation. The thermal performance of the high power LED package was assessed in terms of operating junction temperature, von Mises stress and thermal resistance. The heat dissipation analysis was done under four types of convection condition:one natural convection conditionthree forced convection condition,. The forced convection condition was used to replicate the effect of a fan with various rotation speeds placed under the heat sink to increase the convective heat transfer coefficient. Results of the analysis showed that that the junction temperature, von Mises stress and thermal resistance of the GaN chip reduces with the increase of the fan rotation speed.

scholarly journals Analysis on High-Power Seaport LED Luminaire with Uniform Light Distribution Based on Optimized Lens and Heatsink

2021 ◽  
Vol 11 (9) ◽  
pp. 4035
Author(s):  
Jinsheon Kim ◽  
Jeungmo Kang ◽  
Woojin Jang
Keyword(s):  
Light Source ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
Light Distribution ◽  
Light Sources ◽  
Led Light ◽  
High Power Led ◽  
Distribution Requirement ◽  
Lighting Application

In the case of light-emitting diode (LED) seaport luminaires, they should be designed in consideration of glare, average illuminance, and overall uniformity. Although it is possible to implement light distribution through auxiliary devices such as reflectors, it means increasing the weight and size of the luminaire, which reduces the feasibility. Considering the special environment of seaport luminaires, which are installed at a height of 30 m or more, it is necessary to reduce the weight of the device, facilitate replacement, and secure a light source with a long life. In this paper, an optimized lens design was investigated to provide uniform light distribution to meet the requirement in the seaport lighting application. Four types of lens were designed and fabricated to verify the uniform light distribution requirement for the seaport lighting application. Using numerical analysis, we optimized the lens that provides the required minimum overall uniformity for the seaport lighting application. A theoretical analysis for the heatsink structure and shape were conducted to reduce the heat from the high-power LED light sources up to 250 W. As a result of these analyses on the heat dissipation characteristics of the high-power LED light source used in the LED seaport luminaire, the heatsink with hexagonal-shape fins shows the best heat dissipation effect. Finally, a prototype LED seaport luminaire with an optimized lens and heat sink was fabricated and tested in a real seaport environment. The light distribution characteristics of this prototype LED seaport luminaire were compared with a commercial high-pressure sodium luminaire and metal halide luminaire.

Thermal characterisation analysis and modelling techniques for CubeSat-sized spacecrafts

2017 ◽  
Vol 121 (1246) ◽  
pp. 1858-1878
Author(s):  
Anwar Ali ◽  
Khalil Ullah ◽  
Hafeez Ur Rehman ◽  
Inam Bari ◽  
Leonardo M. Reyneri
Keyword(s):  
Thermal Resistance ◽  
Heat Dissipation ◽  
Small And Medium Enterprises ◽  
Low Cost ◽  
Detailed Model ◽  
Small Surface ◽  
Short Development Time ◽  
Similar Materials ◽  
Absorbed Power ◽  
Medium Enterprises

ABSTRACTRecently, universities and Small and Medium Enterprises (SMEs) have initiated the development of nanosatellites because of their low cost, small size and short development time. The challenging aspects for these satellites are their small surface area for heat dissipation due to their limited size. There is not enough space for mounting radiators for heat dissipation. As a result, thermal modelling becomes a very important element in designing a small satellite. The paper presents detailed and simplified generic thermal models for CubeSat panels and also for the complete satellite. The detailed model takes all thermal resistances associated with the respective layers into account, while in the simplified model, the layers with similar materials have been combined and are represented by a single thermal resistance. The proposed models are then applied to a CubeSat standard nanosatellite called AraMiS-C1, developed at Politecnico di Torino, Italy. Thermal resistance measured through both models is compared, and the results are similar. The absorbed power and the corresponding temperature differences between different points of the single panel and complete satellite are measured. In order to verify the theoretical results, thermal resistance of the AraMiS-C1 and its panels are measured through experimental set-ups. Theoretical and measured values are in close agreement.

Analysis and Optimization of Heat Dissipation Characteristics of High-power LED

2021 ◽  
Author(s):  
Pingfeng Wu ◽  
Runji Fang ◽  
Xuanjun Dai ◽  
Anak Agung Ayu Putri
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
High Power Led
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