Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review
2013 ◽
Vol 421
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pp. 260-266
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Keyword(s):
To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders.This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that byadditions of non-metal reinforcement from micron up to nanoparticle size had suppressed the intermetallic compound formations of lead-free composite solders.
2015 ◽
Vol 830-831
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pp. 265-269
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Keyword(s):
2016 ◽
Vol 700
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pp. 123-131
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Keyword(s):
2007 ◽
Vol 37
(1)
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pp. 73-83
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Keyword(s):
2012 ◽
Vol 626
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pp. 791-796
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Keyword(s):
2021 ◽
Vol ahead-of-print
(ahead-of-print)
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Keyword(s):