Heat Sink Fin Number Variation Analysis on Single Chip High Power LED

2014 ◽  
Vol 487 ◽  
pp. 149-152 ◽  
Author(s):  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Photon Emission ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Single Chip ◽  
High Power Led ◽  
Number Variation ◽  
And Performance ◽  
Work Done

Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating junction temperature of LED. This paper demonstrates a simulation work done to evaluate the influence heat sink fin number on the junction temperature and stress of single chip LED package using Ansys version 11. The heat sink with fin number of 4 fins, 6 fins and 8 fins were used and compared. Results showed that increase in heat sink fin number significantly reduces the junction temperature of the LED package.

Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design

2014 ◽  
Vol 1082 ◽  
pp. 332-335
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
Gan Meng Kuan
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Single Chip ◽  
Pin Fin ◽  
High Power Led ◽  
Different Shapes ◽  
Fin Design

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m2.oC respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.

Thermal Analysis and Optimization of High Power LED Automotive Headlamp Cooling Device

2013 ◽  
Vol 457-458 ◽  
pp. 399-404
Author(s):  
Xin Jie Zhao ◽  
Yi Xi Cai ◽  
Jing Wang ◽  
Xiao Hua Li ◽  
Chun Zhang
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Input Power ◽  
Junction Temperature ◽  
Cooling Device ◽  
External Cooling ◽  
High Power Led ◽  
Simulation And Experiment ◽  
Led Headlamp ◽  
The One

High power LED headlamp cannot operate normally and efficiently in case the maximum junction temperature exceeds 120°C. Therefore, it is essential to install external cooling device with excellent thermal management. A model based on plate-fin heat sink is presented, the heat transfer plates (HTPS) are added to bridge aluminum substrate and heat sink. And its thermal performance is evaluated compared with the one only installing heat sink. Results reveal the HTPS coupled with heat sink has a good cooling performance. In addition, the correlation between the junction temperature and the HTPS length is investigated. The optimum length is 47 mm. Furthermore, considerable simulation and experiment are conducted on the junction temperature variation subject to input power, ambient temperature, as well as the installation angle respectively. Finally, a fan is added based on the original device to enhance cooling. It indicates that the junction temperature decreases gradually with the presence of velocity air flow.

The Application of Heat Pipe Heat Sink for High Power LED Lamps

2014 ◽  
Vol 602-605 ◽  
pp. 2713-2716 ◽  
Author(s):  
Xin Rui Ding ◽  
Yu Ji Li ◽  
Zong Tao Li ◽  
Yong Tang ◽  
Bin Hai Yu ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Practical Significance ◽  
Heat Accumulation ◽  
Element Analysis ◽  
High Power Led

LED has been regarded as the next generation lighting source. As for high power LED lamps, heat accumulation will cause a series of problems. Therefore, thermal management is very important for designing a high power LED lamp. Three types of heat sinks are designed by using the finite element analysis (FEA) method for an 180W high power LED lamp. Then the optimized heat sinks are developed and experiments are performed to demonstrate the simulated results. At the same time, the thermal performances with different working angles are investigated experimentally. The heat sink with heat pipe has a better heat dissipation performance than the conventional heat sink under the same input power. The working angles of the lamps greatly influence the thermal performance of each heat sink. For the same heat sink, the temperature varies with different install directions and working angles. Finally, the heat sink with the best thermal performance is recommended. The results have practical significance in designing high power LED lamps.

High Power LED Heat Dissipation Comparison Analysis via Aluminum and Copper Slug

2014 ◽  
Vol 893 ◽  
pp. 811-814
Author(s):  
Rajendaran Vairavan ◽  
Zaliman Sauli ◽  
Vithyacharan Retnasamy
Keyword(s):  
High Power ◽  
Heat Dissipation ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Comparison Analysis ◽  
Single Chip ◽  
High Power Led ◽  
Von Mises

The vast development of the LED industry has created contemporary set of thermal issues with limits the reliability of the high power LEDs. Thus, this paper reports a simulation analysis done on single chip high power LED package to evalute the effects of heat slug material on the heat dissipation of the LED package. The heat dissipation of two types of heat slug material, aluminum (Al) and copper (Cu) were compared in terms of junction temperature, von Mises stress and thermal resistance of the LED chip at varied input power of 0.1 W and 1W. Results of the analysis showed that the copper heat slug exhibits a better heat dissipation due to its superior thermal conductivity.

Measurement of Temperature Resistance of High Power LED

2014 ◽  
Vol 701-702 ◽  
pp. 510-513
Author(s):  
Xiao Zeng Wang
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Junction Temperature ◽  
Measuring Instrument ◽  
Electrical Parameters ◽  
Temperature Resistance ◽  
Chip Temperature ◽  
Main Work ◽  
High Power Led ◽  
Allowable Temperature

In the absence of cooling measures, the chip temperature of high power LED rises rapidly. When the junction temperature exceeds the maximum allowable temperature, the high power LED will be damaged due to overheating. In the design of high power LED lamps, the main work is to the temperature design. Using a good linear relationship characteristic of the semiconductor devices between the LED junction voltage and junction temperature, this paper measured the high-power LED working voltage, working current, temperature of the incubator and heat sink. Adopting the method of electrical parameters, the paper measure the temperature resistor of high power LED. The high-power LED temperature resistance measuring instrument is designed and made. The temperature resistance from the LED wafer to the heat sink is measured fast and accurately, and the error is less than 5%.

Heat Sink Cooling Fan and Rotation Speed Effect Analysis on Heat Dissipation of High Power GaN LED Package

2014 ◽  
Vol 1082 ◽  
pp. 315-318
Author(s):  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
...  
Keyword(s):  
Thermal Resistance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Rotation Speed ◽  
Junction Temperature ◽  
Von Mises Stress ◽  
Cooling Fan ◽  
High Power Led ◽  
Von Mises

In this work, thermal simulation analysis on high power LED is reported where the effect of the heat sink cooling fan and its rotation speed on the heat dissipation of the high power LED was evaluated. Ansys version 11 was utilized for the simulation. The thermal performance of the high power LED package was assessed in terms of operating junction temperature, von Mises stress and thermal resistance. The heat dissipation analysis was done under four types of convection condition:one natural convection conditionthree forced convection condition,. The forced convection condition was used to replicate the effect of a fan with various rotation speeds placed under the heat sink to increase the convective heat transfer coefficient. Results of the analysis showed that that the junction temperature, von Mises stress and thermal resistance of the GaN chip reduces with the increase of the fan rotation speed.

The Design Research of Single-Chip High Power LED Radiator

2011 ◽  
Vol 103 ◽  
pp. 219-224
Author(s):  
Yuan Luo ◽  
Ti Wei Wei ◽  
Zheng Wei Tang ◽  
Wei Xi Kong
Keyword(s):  
High Power ◽  
Thermal Effects ◽  
Heat Dissipation ◽  
Design Research ◽  
Junction Temperature ◽  
White Led ◽  
Single Chip ◽  
Finite Element Software ◽  
High Power Led ◽  
New Generation

As new generation of solid-state lighting source with green environmental protection, White LED has become the focus of attentions. Along with the development of high power LED, heat dissipation problems of LED become more and more important. This paper makes research on single-chip high power LED by ANSYS finite element software, and analyzes the thermal effects of parameters on the radiator. This paper believes that the influence of radiator materials’ thermal conductivity is not obvious, and the finned height and cooling area of radiator play an very important role in reducing chip junction temperature.

Design of Optimum Plate-Fin Natural Convective Heat Sinks

2003 ◽  
Vol 125 (2) ◽  
pp. 208-216 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Madhusudan Iyengar ◽  
Allan D. Kraus
Keyword(s):  
Nusselt Number ◽  
Specific Heat ◽  
Rectangular Plate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Heat Sinks ◽  
And Performance ◽  
Nusselt Number Correlation ◽  
The Impact

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

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