The Application of Heat Pipe Heat Sink for High Power LED Lamps

2014 ◽  
Vol 602-605 ◽  
pp. 2713-2716 ◽  
Author(s):  
Xin Rui Ding ◽  
Yu Ji Li ◽  
Zong Tao Li ◽  
Yong Tang ◽  
Bin Hai Yu ◽  
...  
Keyword(s):  
Heat Pipe ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Heat Sinks ◽  
Practical Significance ◽  
Heat Accumulation ◽  
Element Analysis ◽  
High Power Led

LED has been regarded as the next generation lighting source. As for high power LED lamps, heat accumulation will cause a series of problems. Therefore, thermal management is very important for designing a high power LED lamp. Three types of heat sinks are designed by using the finite element analysis (FEA) method for an 180W high power LED lamp. Then the optimized heat sinks are developed and experiments are performed to demonstrate the simulated results. At the same time, the thermal performances with different working angles are investigated experimentally. The heat sink with heat pipe has a better heat dissipation performance than the conventional heat sink under the same input power. The working angles of the lamps greatly influence the thermal performance of each heat sink. For the same heat sink, the temperature varies with different install directions and working angles. Finally, the heat sink with the best thermal performance is recommended. The results have practical significance in designing high power LED lamps.

Heat Dissipation Analysis of High Power LED Connected to Copper Coated Heat Sink by Soldering

2011 ◽  
Vol 32 (11) ◽  
pp. 1171-1175 ◽  
Author(s):  
柴伟伟 CHAI Wei-wei ◽  
陈清华 CHEN Qing-hua ◽  
李琳红 LI Ling-hong ◽  
唐文勇 TANG Wen-yong ◽  
张学清 ZHANG Xue-qing ◽  
...  
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
High Power Led

Experimental Investigation of a PCM-Based Topology Optimized Heat Sink for Passive Cooling of Electronics

2020 ◽  
Author(s):  
Jin Yao Ho ◽  
Kai Choong Leong
Keyword(s):  
Thermal Performance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Volume Fraction ◽  
Solid Volume Fraction ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Base Temperature ◽  
Storage Unit ◽  
Cooling Of Electronics

Abstract A thermal energy storage unit filled with phase change material (PCM) can serve as a heat sink for the cooling of electronics with intermittent or periodic heat dissipation rates. The use of thermal conductive structures (TCS) is an effective method of improving the thermal performance of a PCM-based heat sink. In this paper, topology optimization is explored to develop a new class of TCS with a tree-like structure to enhance the thermal performance of a trapezoidal heat sink. The topology-optimized heat sink was then fabricated by Selective Laser Melting (SLM) using an aluminum alloy, AlSi10Mg, as the base powder. Experiments were performed to evaluate the thermal performance of the topology-optimized heat sink with the tree-like structure. In addition, a conventional longitudinal-fin heat sink of the same solid volume fraction (φ = 16.2%) and a heat sink without enhanced structure were also fabricated and experimentally investigated for comparison. Rubitherm RT-35HC paraffin wax was used as the PCM. Three different heat fluxes of 4.00 kW/m2, 5.08 kW/m2 and 7.24 kW/m2 were applied at the base of each specimen by a silicone rubber heater. The structure wall and the PCM temperatures were measured over time. Our results show that, for all heat rates tested, the topology-optimized heat sink was able to maintain a lower base temperature as compared to the fin-structure and the plain heat sinks. A thermal enhancement ratio (ε) is defined to evaluate the performance of the heat sinks with and without the use of PCM. From the experimental results, the highest ε value of 8.6 was achieved by the topology-optimized heat sink. These results indicate the better performance of the topology-optimized heat sink in dissipating heat as compared to the other specimens.

Enabling Thermal Management of High-Powered Server Processors Using Passive Thermosiphon Heat Sink

2019 ◽  
Author(s):  
Devdatta P. Kulkarni ◽  
Priyanka Tunuguntla ◽  
Guixiang Tan ◽  
Casey Carte
Keyword(s):  
Heat Pipe ◽  
High Power ◽  
Heat Sink ◽  
Capital Investment ◽  
Thermal Design ◽  
Heat Sinks ◽  
Air Cooling ◽  
Liquid Cooling ◽  
Two Phase ◽  
Pipe Heat

Abstract In recent years, rapid growth is seen in computer and server processors in terms of thermal design power (TDP) envelope. This is mainly due to increase in processor core count, increase in package thermal resistance, challenges in multi-chip integration and maintaining generational performance CAGR. At the same time, several other platform level components such as PCIe cards, graphics cards, SSDs and high power DIMMs are being added in the same chassis which increases the server level power density. To mitigate cooling challenges of high TDP processors, mainly two cooling technologies are deployed: Liquid cooling and advanced air cooling. To deploy liquid cooling technology for servers in data centers, huge initial capital investment is needed. Hence advanced air-cooling thermal solutions are being sought that can be used to cool higher TDP processors as well as high power non-CPU components using same server level airflow boundary conditions. Current air-cooling solutions like heat pipe heat sinks, vapor chamber heat sinks are limited by the heat transfer area, heat carrying capacity and would need significantly more area to cool higher TDP than they could handle. Passive two-phase thermosiphon (gravity dependent) heat sinks may provide intermediate level cooling between traditional air-cooled heat pipe heat sinks and liquid cooling with higher reliability, lower weight and lower cost of maintenance. This paper illustrates the experimental results of a 2U thermosiphon heat sink used in Intel reference 2U, 2 node system and compare thermal performance using traditional heat sinks solutions. The objective of this study was to showcase the increased cooling capability of the CPU by at least 20% over traditional heat sinks while maintaining cooling capability of high-power non-CPU components such as Intel’s DIMMs. This paper will also describe the methodology that will be used for DIMMs serviceability without removing CPU thermal solution, which is critical requirement from data center use perspective.

Experimental Study of Heat Pipe Exchanger for High Power LED Cooling System

2011 ◽  
Vol 295-297 ◽  
pp. 1985-1988
Author(s):  
Yu Jun Gou ◽  
Zhong Liang Liu ◽  
Xiao Hui Zhong
Keyword(s):  
Heat Exchanger ◽  
Heat Pipe ◽  
High Power ◽  
Heat Dissipation ◽  
High Efficiency ◽  
Cooling System ◽  
Two Phase ◽  
High Power Led ◽  
New Type ◽  
Two Phase Heat Transfer

A new cooling concept for high power LED by combining the heat release of high power LED with two-phase heat transfer heat pipes was proposed, and in this study a new type of heat pipe with specific fins structure was developed. Through experimental results, we found the new heat pipe heat exchanger has the features of high efficiency of heat dissipation and compact construction which meets the demand of heat dissipation for high power LED. We also found the heat dissipation performance of the HP heat exchanger changed with the work angle.

scholarly journals Finite Element Simulation of the Machining Process of Boiling Structures in a Novel Radial Heat Sink for High-Power LEDs

Materials ◽  
2020 ◽  
Vol 13 (18) ◽  
pp. 3958
Author(s):  
Jianhua Xiang ◽  
Zeyu Liu ◽  
Chunliang Zhang ◽  
Chao Zhou ◽  
Conggui Chen
Keyword(s):  
Heat Transfer ◽  
Plastic Deformation ◽  
Finite Element ◽  
Phase Change ◽  
High Power ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Machining Process ◽  
High Power Led ◽  
Radial Heat

A phase change heat sink has higher heat transfer efficiency compared to a traditional metal solid heat sink, and is thus more preferred for the heat dissipation of high-power light-emitting diodes (LEDs) with very high heat flux. The boiling structure at the evaporation surface is the biggest factor that affects heat sink resistance. It is necessary to investigate the plastic deformation law during the machining process of boiling structures. In this study, a novel phase change radial heat sink was developed for high-power LED heat dissipation. First, a working principle and a fabrication process for the heat sink were introduced. Subsequently, to achieve an excellent heat dissipation performance, the machining process of boiling structures was numerically simulated and investigated. To be specific, plastic deformation generated during the formation was analyzed, and key parameters related to the morphology of the boiling structures were discussed including feeding angles and machining depths. Moreover, the finite element (FE) simulation results were compared with those of experiments. Last but not least, the heat transfer performance of the fabricated heat sink was tested. Results showed that the developed heat sink was well suited for a high-power LED application.

Heat Transfer Analysis of Supercritical Methane in Microchannels with Different Geometric Configurations On High Power Electromechanical Actuator

2022 ◽  
Author(s):  
Zhigang Gao ◽  
Tianhu Wang ◽  
Yuxin Yang ◽  
Xiaolong Shang ◽  
Junhua Bai ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
High Power ◽  
Heat Sink ◽  
Heat Removal ◽  
Electrical Equipment ◽  
Heat Sinks ◽  
Electromechanical Actuator ◽  
Regenerative Cooling ◽  
Geometric Configurations

Abstract The issue of regenerative cooling is one of the most important key technologies of flight vehicles, which is applied into both the engine and high-power electrical equipment. One pattern of regenerative cooling channels is the microchannel heat sinks, which are thought as a prospective means of improving heat removal capacities on electrical equipment of smaller sizes. In this paper, three numerical models with different geometric configurations, namely straight, zigzag, and sinusoid respectively, are built to probe into the thermal hydraulic performance while heat transfer mechanism of supercritical methane in microchannel heat sinks for the heat removal of high-power electromechanical actuator is also explored. In addition, some crucial influence factors on heat transfer such as inlet Reynolds number, operating pressure and heating power are investigated. The calculation results imply the positive effect of wavy configurations on heat transfer and confirm the important effect of buoyancy force of supercritical methane in channels. The heat sinks with wavy channel show obvious advantages on comprehensive thermal performance including overall thermal performance parameter ? and thermal resistance R compared with that of the straight one. The highest Nu and average heat transfer coefficient am appear in the heat sink with zigzag channels, but the pumping power of the heat sink with sinusoidal channels is lower due to the smaller flow loss.

Heat Sink Fin Number Variation Analysis on Single Chip High Power LED

2014 ◽  
Vol 487 ◽  
pp. 149-152 ◽  
Author(s):  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Photon Emission ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Single Chip ◽  
High Power Led ◽  
Number Variation ◽  
And Performance ◽  
Work Done

Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating junction temperature of LED. This paper demonstrates a simulation work done to evaluate the influence heat sink fin number on the junction temperature and stress of single chip LED package using Ansys version 11. The heat sink with fin number of 4 fins, 6 fins and 8 fins were used and compared. Results showed that increase in heat sink fin number significantly reduces the junction temperature of the LED package.

Thermal Management for High Power Light-Emitting Diode Street Lamp

2010 ◽  
Author(s):  
M. Ying ◽  
S. M. L. Nai ◽  
P. Shi ◽  
J. Wei ◽  
C. K. Cheng ◽  
...  
Keyword(s):  
Thermal Management ◽  
Thermal Performance ◽  
High Power ◽  
Heat Dissipation ◽  
Light Emitting Diode ◽  
System Level ◽  
Light Emitting ◽  
High Power Led ◽  
Street Lamp ◽  
Lamp System

Light-emitting diode (LED) street lamp has gained its acceptance rapidly in the lighting system as one of choices for low power consumption, high reliability, dimmability, high operation hours, and good color rendering applications. However, as the LED chip temperature strongly affects the optical extraction and the reliability of the LED lamps, LED street lamp performance is heavily relied on a successful thermal management, especially when applications require LED street lamp to operate at high power and hash environment to obtain the desired brightness. As such, a well-designed thermal management, which can lower the LED chip operation temperature, becomes one of the necessities when developing LED street lamp system. The current study developed an effective heat dissipation method for the high power LED street lamp with the consideration of design for manufacturability. Different manufacturable structure designs were proposed for the high power street lamp. The thermal contact conductance between aluminum interfaces was measured in order to provide the system assembly guidelines. The module level thermal performance was also investigated with thermocouples. In addition, finite element (FE) models were established for the temperature simulation of both the module and lamp system. The coefficient of natural convection of the heat sink surface was determined by the correlation of the measurement and simulation results. The system level FE model was employed to optimize and verify the heat dissipation concepts numerically. An optimized structure design and prototype has shown that the high power LED street lamp system can meet the thermal performance requirements.

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