Low Temperature Densification of ZnO-Based Ceramic Using Phenolic Resin as Binder
2014 ◽
Vol 668-669
◽
pp. 35-38
Keyword(s):
ZnO-based ceramic was densified at low temperature by using PSP as binder. The results showed that phenolic resin filled in the ZnO grain boundary layer. The sample has a well hardness of 0.8 GPa and bending strength of 78 MPa. The effect of temperature on the microstructure and mechanical properties was also investigated. It was found that the samples sintered at 300 °C showed higher density and better mechanical properties.
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