Machining Characteristics of Semibonded Abrasive Grinding Plate

2008 ◽  
Vol 53-54 ◽  
pp. 173-178
Author(s):  
Ju Long Yuan ◽  
Yi Yang ◽  
Zhi Wei Wang ◽  
Dong Qiang Yu ◽  
Miao Qian ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Removal Rate ◽  
Abrasive Particle ◽  
Precision Machining ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fine Surface ◽  
Ultra Precision ◽  
Machining Characteristics

This work aims to obtain fine surface of silicon wafer during precision and ultra precision machining, and presents a new method called semibonded abrasive machining. A semibonded abrasive grinding plate is used in the semibonded abrasive machining. Abrasive particle of 1000# Green SiC and bond named SSB are adopted in the manufacture of the plate. Four plates with different concentration of bond which are 1.5%, 2.5%, 3.5%, 4.5% respectively are made. The paper studies the effect of concentration of bond, the control parameters which include the lapping time, the load, and the rotating velocity of the plate on the surface roughness. Experimental results indicate each plate with different concentration of bond can obtain fine surface roughness. When the load or the rotating velocity increases, there is little effect on the surface roughness, but the material removal rate increases correspondingly. The initial roughness of the silicon wafer surface lapping by the plate could be improved from Ra 0.2μm to Ra 0.02μm in 9 min.

Observation in the Surface Roughness of Silicon Wafer during Semi-Fixed Abrasive Machining with Large Grains

2009 ◽  
Vol 69-70 ◽  
pp. 253-257
Author(s):  
Ping Zhao ◽  
Jia Jie Chen ◽  
Fan Yang ◽  
K.F. Tang ◽  
Ju Long Yuan ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Silicon Wafer ◽  
Processing Parameters ◽  
Wafer Surface ◽  
Abrasive Machining ◽  
Fixed Abrasive ◽  
Is Failure ◽  
Better Than

Semi-fixed abrasive is a novel abrasive. It has a ‘trap’ effect on the hard large grains that can prevent defect effectively on the surface of the workpiece which is caused by large grains. In this paper, some relevant experiments towards silicon wafers are carried out under the different processing parameters on the semi-fixed abrasive plates, and 180# SiC is used as large grains. The processed workpieces’ surface roughness Rv are measured. The experimental results show that the surface quality of wafer will be worse because of higher load and faster rotating velocity. And it can make a conclusion that the higher proportion of bond of the plate, the weaker of the ‘trap’ effect it has. Furthermore the wet environment is better than dry for the wafer surface in machining. The practice shows that the ‘trap’ effect is failure when the workpiece is machined by abrasive plate which is 4.5wt% proportion of bond in dry lapping.

scholarly journals Ultra-High-Speed Magnetic Abrasive Surface Micro-Machining of AISI 304 Cylindrical Bar

Metals ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 489 ◽  
Author(s):  
Cheng Yin ◽  
Rui Wang ◽  
Jeong Kim ◽  
Sang Lee ◽  
Sang Mun
Keyword(s):  
Surface Roughness ◽  
Plastic Strain ◽  
High Speed ◽  
Precision Machining ◽  
Plastic Strains ◽  
Abrasive Machining ◽  
Machined Surface ◽  
Aisi 304 ◽  
Ultra High Speed ◽  
Ultra Precision

The ultra-high-speed magnetic abrasive machining (UHSMAM) process is a surface improvement technique, which has been widely used to minimize the surface accuracy and change the precision morphology of difficult-to-machine materials. Surface integrity plays an important role in the machining process, because it is used to evaluate the high stress and the loaded components on the machined surface. It is important to evaluate the plastically deformed layers in ultra-precision machining surface of material. However, the usual plastic strains in the ultra-precision machining surface are significantly difficult to consider. In this paper, an ultra-high-speed magnetic abrasive machining technique is used to improve the surface accuracy and dimensional accuracy of an AISI 304 bars. Additionally, the subsequent recrystallizations technique is used for measuring the plastic strain on machined surface of AISI 304 bars. The purpose of this paper is to evaluate the effects of an UHSMAM process on the plastic strains and the strain energy of the machined surface, and to evaluate the residual strain in the plastic deformation of AISI 304 bars materials by analyzing a plastically deformed layer. The results showed that the plastic strain of the material did not change after machined by an UHSMAM process. Based on the results, an UHSMAM process could significantly improve the surface roughness, micro-diameter, and removal weight of AISI 304 bars effectively. The surface roughness Ra of AISI 304 bars was improved from 0.32 µm to 0.03 µm for 40 s of machining time at 80,000 rpm of workpiece revolution speed.

Experimental Study and Modeling of Lapping Using Abrasive Grits with Mixed Sizes

2011 ◽  
Vol 133 (3) ◽  
Author(s):  
Chunhui Chung ◽  
Chad S. Korach ◽  
Imin Kao
Keyword(s):  
Experimental Study ◽  
Surface Roughness ◽  
Removal Rate ◽  
Abrasive Particle ◽  
Wafer Surface ◽  
Particle Distributions ◽  
Mixing Ratios ◽  
Lapping Machine ◽  
Wafer Surfaces ◽  
Abrasive Size

In this paper, the lapping process of wafer surfaces is studied with experiments and contact modeling of surface roughness. In order to improve the performance of the lapping processes, effects of mixed abrasive grits in the slurry of the free abrasive machining (FAM) process are studied using a single-sided wafer-lapping machine. Under the same slurry density, a parametric experimental study employing different mixing ratios of large and small abrasive grits and various normal loadings on the wafer surface applied through a jig is conducted. Observations and measurements of the total amount of material removed, material removal rate, surface roughness, and relative angular velocity are presented as a function of various mixing ratios and loadings and discussed in the paper. The experiments show that the 1:1 mixing ratio of abrasives removes more material than other mixing ratios under the same conditions, with a slightly higher surface roughness. Modeling of the mixed abrasive particle distributions correspondingly indicates that the roughness trend is due to the abrasive size distribution and the particle contact mechanics. The results of this study can provide a good reference to the FAM processes that practitioners use today by exploiting different abrasive mixing ratios in slurry and normal loadings in the manufacturing processes.

Ultra Precision Machining Technique of InSb Substrate Material for Detector Devices

2011 ◽  
Vol 183-185 ◽  
pp. 1137-1140
Author(s):  
Xin Huan Niu ◽  
Yan Gang He ◽  
Bao Hong Gao ◽  
Bai Mei Tan ◽  
Yu Ling Liu
Keyword(s):  
Surface Roughness ◽  
Physical Adsorption ◽  
Surface Adsorption ◽  
Surface Preparation ◽  
Precision Machining ◽  
Wafer Surface ◽  
Ionic Surfactant ◽  
Adsorption Model ◽  
Preferential Adsorption ◽  
Ultra Precision

Indium antimony(InSb) is one of the important materials which can be used to make semiconductor devices such as infrared detection device. Due to the low hardness and great brittleness, the surface scratching always appears and surface roughness is hard to lower during surface preparation. So it should be increasing the InSb surface quality during ultra precision machining. In this paper the InSb surface adsorption-control technology was introduced. Through controlling surface roughness during chemical mechanical polishing(CMP) and using preferential adsorption during cleaning, the adsorptions of InSb surface were controlled. Through experiments, the CMP optimal process parameters under the alkaline conditions were gotten. Under such conditions, the preferable surface state was realized. According to the preferential adsorption model, through using FA/O non-ionic surfactant the polished wafer surface can be kept in physical adsorption and easy cleaning state, so the wafer surface adsorption can be controlled effectively and the clean surface was obtained.

A Study on Statistical Analysis of Si-Wafer Polishing Process for the Optimum Polishing Condition

2008 ◽  
Vol 389-390 ◽  
pp. 493-497 ◽  
Author(s):  
Sung Chul Hwang ◽  
Jong Koo Won ◽  
Jung Taik Lee ◽  
Eun Sang Lee
Keyword(s):  
Surface Roughness ◽  
Statistical Analysis ◽  
Process Parameters ◽  
Wafer Surface ◽  
Wafer Polishing ◽  
Ultra Precision ◽  
Important Processing ◽  
The Many ◽  
Selection Of ◽  
Si Wafer

As the level of Si-wafer surface directly affects device line-width capability, process latitude, yield, and throughput in fabrication of microchips, it needs to have ultra precision surface and flatness. Polishing is one of the important processing having influence on the surface roughness in manufacturing of Si-wafers. The surface roughness in wafer polishing is mainly affected by the many process parameters. For decreasing the surface roughness, the control of polishing parameters is very important. In this paper, the optimum condition selection of ultra precision wafer polishing and the effect of polishing parameters on the surface roughness were evaluated by the statistical analysis of the process parameters.

Material Removal and Application by Chemical Impact Reaction in Nano-Abrasive Jet Polishing

2013 ◽  
Vol 631-632 ◽  
pp. 550-555
Author(s):  
Wen Qiang Peng ◽  
Sheng Yi Li ◽  
Chao Liang Guan ◽  
Xin Min Shen
Keyword(s):  
Material Removal ◽  
Abrasive Particle ◽  
Precision Machining ◽  
Optical Surface ◽  
Polishing Process ◽  
Abrasive Particles ◽  
Mechanical Process ◽  
Abrasive Jet Polishing ◽  
Ultra Precision ◽  
Machining Properties

Material removed by mechanical process inevitably causes surface or subsurface damage containing cracks, plastic scratch, residual stress or dislocations. In nano-abrasive jet polishing (NAJP) the material is removed by chemical impact reaction. The chemical impact reaction is validated by contrast experiment with traditional lap polishing process in which the material is mainly removed through mechanical process. Experiment results show the dependence of the abrasive particles on the choice of materials. Even if the abrasive particle and the workpiece are composed of similar components, the machining properties are remarkably different due to slight differences in their physical properties or crystallography etc. Plastic scratches on the sample which was polished by the traditional mechanical process are completely removed by NAJP process, and the surface root-square-mean roughness has decreased from 1.403nm to 0.611nm. The NAJP process will become a promising method for ultra precision machining method for ultrasmooth optical surface.

Research on Ultra-Precision Machining Technology for KTP

2004 ◽  
Vol 471-472 ◽  
pp. 473-476 ◽  
Author(s):  
Ju Long Yuan ◽  
Fei Yan Lou ◽  
Zhi Wei Wang ◽  
M. Chang ◽  
W.P. Du ◽  
...  
Keyword(s):  
Surface Roughness ◽  
Frequency Conversion ◽  
Removal Rate ◽  
Nonlinear Coefficient ◽  
Damage Threshold ◽  
Green Laser ◽  
Machining Process ◽  
Polished Surface ◽  
Nonlinear Frequency ◽  
Ultra Precision

Potassium Titanium Oxide Phosphate (KTP) is a new nonlinear frequency-conversion crystal. It has chemical stability, high nonlinear coefficient, high damage threshold, easily-polished surface, and a broad transparency range. It is be used in solid green laser with medium and low power widely. The requirement for surface roughness is less than 1nm.In this paper, the removal rate and surface roughness are discussed with different velocity, pressure and size of abrasive powder. In order to satisfy the requirement, new polishing techniques with ultra-precision plane polishing machine (Nanopoli-100), and fine AL2O3, SiO2 powders are proposed in this study. The final surface roughness of the KTP is less than 1nm.The machining process and characteristics are also indicated.

Characterization of Cutting-Induced Heat Generation in Ultra-Precision Milling of Aluminium Alloy 6061

2013 ◽  
Vol 552 ◽  
pp. 201-206
Author(s):  
Su Juan Wang ◽  
Suet To ◽  
Xin Du Chen
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Heat Generation ◽  
Feed Rate ◽  
Dimensional Accuracy ◽  
Precision Machining ◽  
Machined Surface ◽  
Single Crystal Diamond ◽  
Ultra Precision ◽  
Alloy 6061

The technology of ultra-precision machining with single crystal diamond tool produces advanced components with higher dimensional accuracy and better surface quality. The cutting-induced heat results in high temperature and stress at the chip-tool and tool-workpiece interfaces therefore affects the materials and the cutting tool as well as the surface quality. In the ultra-precision machining of al6061, the cutting-induced heat generates precipitates on the machined surface and those precipitates induce imperfections on the machined surface. This paper uses the time-temperature-precipitation characteristics of aluminum alloy 6061 (al6061) to investigate the effect of feed rate on the cutting-induced heat generation in ultra-precision multi-axis milling process. The effect of feed rate and feed direction on the generation of precipitates and surface roughness in ultra-precision raster milling (UPRM) is studied. Experimental results show that heat generation in horizontal cutting is less than that in vertical cutting and a larger feed rate generates more heat on the machined workpiece. A smaller feed rate produces a better surface finish and under a larger feed rate, scratch marks are produced by the generated precipitates and increase surface roughness.

Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping

2009 ◽  
Vol 416 ◽  
pp. 439-442
Author(s):  
Xun Lv ◽  
Ju Long Yuan ◽  
Dong Hui Wen
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Processing Parameters ◽  
Good Surface ◽  
Ultra Precision ◽  
New Processing ◽  
Short Time

Semi bonded abrasive lapping is an effective ultra-precision lapping method. It can obtain good surface quality of workpiece in short time. This paper focused on the differences of processing features by comparing semi bonded abrasive lapping and loose abrasive lapping in several groups processing parameters. The results showed that the surface roughness of workpiece in semi bonded abrasive lapping was far superior to that of loose abrasive lapping in same processing parameters. And the MRR (material removal rate) of semi bonded abrasive lapping was slightly lower than that of loose abrasive lapping. For these features of semi bonded abrasive, a new processing flow would also be proposed in this paper.

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