The analysis of 3-Level Charge Pumping in SOHOS Flash Memory

2013 ◽  
Vol 658 ◽  
pp. 658-661
Author(s):  
Seung Dong Yang ◽  
Ho Jin Yun ◽  
Kwang Seok Jeong ◽  
Yu Mi Kim ◽  
Sang Youl Lee ◽  
...  

This paper discusses the 3-level charge pumping method in planar-type Silicon-Oxide-High-k-Oxid e-Silicon (SOHOS) and Silicon-Oxide-Nitride-Oxide-Silicon (SONOS) devices to find out the reason for degradation of data retention properties. In the CP thechnique, a pulse is applied to the gate of the MOSFET which alternately fills the traps withe electrons and holes, thereby causing a recombination current Icp to flow in the substrate. A 3-level charge pumping method may be used to determine not only interface trap densities but also capture cross sections as a function of trap energy. By applying this method, SOHOS device found to have a higher interface trap density than SONOS device. Therefore, degradation of data retention characteristics is attributed to the many interface trap sites.

2009 ◽  
Vol 48 (4) ◽  
pp. 04C068 ◽  
Author(s):  
Won-Ho Choi ◽  
Sung-Soo Park ◽  
Kwang-Il Choi ◽  
Dong-Ho Nam ◽  
Hyuk-Min Kwon ◽  
...  

Micromachines ◽  
2021 ◽  
Vol 12 (11) ◽  
pp. 1401
Author(s):  
Jun-Kyo Jeong ◽  
Jae-Young Sung ◽  
Woon-San Ko ◽  
Ki-Ryung Nam ◽  
Hi-Deok Lee ◽  
...  

In this study, polycrystalline silicon (poly-Si) is applied to silicon-oxide-nitride-oxide-silicon (SONOS) flash memory as a channel material and the physical and electrical characteristics are analyzed. The results show that the surface roughness of silicon nitride as charge trapping layer (CTL) is enlarged with the number of interface traps and the data retention properties are deteriorated in the device with underlying poly-Si channel which can be serious problem in gate-last 3D NAND flash memory architecture. To improve the memory performance, high pressure deuterium (D2) annealing is suggested as a low-temperature process and the program window and threshold voltage shift in data retention mode is compared before and after the D2 annealing. The suggested curing is found to be effective in improving the device reliability.


2007 ◽  
Vol 28 (8) ◽  
pp. 750-752 ◽  
Author(s):  
M. Park ◽  
Kangdeog Suh ◽  
Keonsoo Kim ◽  
S. Hur ◽  
K. Kim ◽  
...  

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