Investigation to Semi-Fixed Abrasives Plate Lapping SUS440 Stainless Steel

2009 ◽  
Vol 69-70 ◽  
pp. 113-117
Author(s):  
Qian Fa Deng ◽  
Dong Hui Wen ◽  
Feng Chen ◽  
Li Tao ◽  
Ju Long Yuan
Keyword(s):  
Stainless Steel ◽  
Surface Quality ◽  
Load Distribution ◽  
Material Removal ◽  
Removal Rate ◽  
High Surface ◽  
High Surface Quality ◽  
Rotating Speed ◽  
Size Dispersion ◽  
Fixed Abrasive

To obtain high surface quality and high finishing efficiency in machining SUS440 stainless steel, a novel machining technology employing a semi-fixed abrasive plate (SFAP) is adopted. The SFAP is developed for preventing lapped surface from damage caused by larger particles (from grain size dispersion or from outside of processing area, larger particles could bring uneven load distribution on processing region). The effects of different parameters on the surface quality and the material removal rate (MRR) of SUS440 stainless steel which is lapped by SFAP are investigated in this paper. The control parameters of the lapping process include the lapping time, the load, the rotating speed of the lapping plate, and etc. SFAP of 800# SiC abrasive used, Experimental results indicate that SFAP can avoid the large scratch effectively and the surface roughness (Ra) of the workpiece could be improved from 250 nm to 50 nm in 12 Min. A nearly mirror-like surface can be obtained.

The Experiment Research of Precision Grinding of Li-Ti Ferrite with Graphite Grinding Wheel

2010 ◽  
Vol 431-432 ◽  
pp. 322-325
Author(s):  
Bei Zhang ◽  
Hong Hua Su ◽  
Hong Jun Xu ◽  
Yu Can Fu
Keyword(s):  
Surface Quality ◽  
Material Removal ◽  
Removal Rate ◽  
High Surface ◽  
Ground Surface ◽  
Grinding Wheel ◽  
Precision Grinding ◽  
High Surface Quality ◽  
Good Surface ◽  
Good Surface Quality

Li-Ti ferrite used in aviation occasions needs good surface quality. In conventional grinding it is difficult to meet the surface demand. Accordingly, this paper proposed a new grinding process to change the situation. The process employed graphite grinding wheel which is always used in ultra-precision grinding of steel piece. The process can obtain good surface quality and ensure certain material removal rate. The ground surface appearance is nearly mirror-like. The lowest surface roughness of Ra value of the ground surface is 0.05μm in the experiment. The ground surface morphology is made up of spread glazed area and dispersed minute pits. The ductile regime dominates the material removal mechanism and no surface damage is induced in the process. In consideration of the results in the experiment it can be seen that grinding with graphite grinding wheel is a good finishing procedure in ferrite machining because of its obtained high surface quality.

Influences of Properties of Fixed Abrasive Tool on the Lapping Process of Stainless Steel Substrate

2010 ◽  
Vol 135 ◽  
pp. 365-369
Author(s):  
Cong Rong Zhu ◽  
Bing Hai Lv ◽  
Ju Long Yuan
Keyword(s):  
Surface Roughness ◽  
Stainless Steel ◽  
Material Removal Rate ◽  
Material Removal ◽  
Stainless Steel Substrate ◽  
Removal Rate ◽  
Steel Substrate ◽  
Abrasive Tool ◽  
Bonding Material ◽  
Fixed Abrasive

To improve the machining efficiency as well as surface roughness, a series of experiments employed fixed abrasive tools are carried out for stainless steel substrate, and influences of properties of fixed abrasive tool on the lapping process are studied. It is found that the resin is the best bonding material in this study. The surface roughness under different concentration of bonding material is similar, and the material removal rate (MRR) increases as the concentration of bonding material decreases from 50% to 20%. But too little of bonding material results into low bond strength that causing low material removal rate. It is also found that higher shear strength, lower wear rate, and the shear strength of the tool with 35% bonding material is the highest. It is obvious that the surface roughness and material removal rate decline as the grit size decreases. The roughness of surface lapped with resin bonded 4000# SiC abrasive tool comes to 18nm, and the material removal rate is 0.63μm/min.

Machining Characteristics of Electrochemical Polishing Using Ultrasonic Vibration for Nanoscale High Surface Quality

2021 ◽  
Vol 21 (9) ◽  
pp. 4891-4896
Author(s):  
Uk Su Kim ◽  
Seung-Yub Baek ◽  
Tae-Wan Kim ◽  
Jeong Woo Park
Keyword(s):  
Surface Quality ◽  
Ultrasonic Vibration ◽  
Surface Defects ◽  
High Current Density ◽  
Removal Rate ◽  
High Surface ◽  
Electrochemical Polishing ◽  
High Surface Quality ◽  
Surface Polishing ◽  
Work Material

This study demonstrates a method to improve the surface quality by adding artificial vibration to the electrolyte in electrochemical polishing (ECP, electropolishing). ECP is a typical non-contact surface polishing process that has been used to improve surface quality without leaving any of the mechanical scratch marks that can arise when applying mechanical processes. ECP can polish work material via electrochemical dissolution between the surfaces of an anode and a cathode, and irregular defects are generated on the surface by impurities and bubbles generated during machining. This study confirms that our novel ECP method yields improved results over conventional ECP based on experiments using vibration electrochemical polishing (VECP) with ultrasonic vibrations. VECP minimizes nanoscale surface defects, improves surface roughness, makes it possible to quickly remove materials at nanoscale by increasing the material removal rate (MRR). Under high current density, where the electrochemical relatively reaction is active, value of the current is increased when ultrasonic vibration is added. The localized roughness of the work material was measured by atomic force microscopy (AFM) according to various electrical conditions. In addition, we also compared the overall surface quality and productivity to those obtained by conventional ECP.

Research on Subsurface Damage After Abrasives and Fixed-Abrasive Lapping of K9 Glass

2011 ◽  
Vol 487 ◽  
pp. 253-256 ◽  
Author(s):  
Jun Li ◽  
P. Gao ◽  
Yong Wei Zhu ◽  
B. Li ◽  
Y.L. Sun ◽  
...  
Keyword(s):  
Surface Quality ◽  
High Surface ◽  
Surface Damage ◽  
Subsurface Damage ◽  
High Surface Quality ◽  
Grain Sizes ◽  
Chemical Etch ◽  
Surface Damages ◽  
Damage Depth ◽  
Fixed Abrasive

Fixed-abrasive lapping (FAL) is a new machining technology and is adopted to manufacture hard brittle materials to obtain the high surface quality. In the same machining condition, K9 glasses are lapped by abrasives and fixed-abrasive, respectively. Two grain sizes of diamond abrasives are adopted in every lapping means. Differential chemical etch method (DCEM) is employed to measure the depth of subsurface damage (SSD) of different lapping means. Surface damages are compared by Microscope. The results show that the depth of SSD is 53 and 15.2μm after abrasives lapping (AL) by 40 and 28μm diamond abrasives. FAL with 40 and 28μm diamond abrasive leads to 4.5 and 3.4μm subsurface damage depth, respectively. FAL can get smaller surface damage and shallower depth of SSD than AL. And FAL can obtain the higher surface quality than AL.

Study on Chemical Mechanical Polishing with Ultrasonic Vibration

2010 ◽  
Vol 126-128 ◽  
pp. 311-315 ◽  
Author(s):  
Pei Lum Tso ◽  
Yao Cheng Chang
Keyword(s):  
Surface Quality ◽  
Ultrasonic Vibration ◽  
Chemical Mechanical Polishing ◽  
Removal Rate ◽  
Semiconductor Industry ◽  
High Surface ◽  
Mechanical Polishing ◽  
High Surface Quality ◽  
Wafer Size

Chemical Mechanical Polishing(CMP) is currently the most effective planarization method used in the semiconductor industry. Because of the continuous improvement of the wafer size and line width, the CMP process must be promoted and improved. Many studies have been undertaken to try and achieve both a high material remval rate (MRR) while maintaing a high surface quality of silicon wafer, however up until this point it appears that the two objectives are mutually exclusive. In this paper, an innovative method which integrated ultrasonic vibration assisted machining and CMP (UCMP) has been developed. With the use of ultrasonic vibration, the CMP efficiency and the quality of ploished suface improves considerably as shown in this paper. The basic principle effects of ultrasonic vibration are further illustrated and the experiments had been done to demostrate the proper procedure. The results showed that UCMP achieves a higher material removal rate (MRR) and better surface quality at the same time.

Lapping and Polishing of Sapphire Wafer with Fixed Abrasive Pad

2014 ◽  
Vol 1027 ◽  
pp. 68-71 ◽  
Author(s):  
Jian Bin Wang ◽  
Yong Wei Zhu ◽  
Jun Xu ◽  
Zhan Kui Wang ◽  
Ji Hua Miao
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Sapphire Wafer ◽  
Good Surface ◽  
Good Surface Quality ◽  
Fixed Abrasive Pad ◽  
Fixed Abrasive

The processing technology of sapphire with a high material removal rate a good surface quality is critical for its applications. The experiment of sapphire lapping and polishing was carried out by using three different fixed abrasive pad (FAP). Their material removal rate (MRR) and surface roughness (Ra) were measured and analyzed. Results indicate that a MRR of 5.6μm/min reaches in rough lapping and a MRR of 0.4μm/min in fine lapping. The average surface roughness Ra of rough lapping and fine lapping is 142nm and 1.2nm respectively. The processing efficiency of sapphire wafer is effectively improved and a good surface quality is obtained when FAP adopted.

Effect of Abrasive and Surfactant on Chemical Mechanical Polishing of Hard Disk Substrates

2011 ◽  
Vol 314-316 ◽  
pp. 133-136
Author(s):  
Sheng Li Wang ◽  
Zhen Xia Li ◽  
Li Bing Yang ◽  
Li Bin Liu ◽  
Yu Tian
Keyword(s):  
Material Removal Rate ◽  
Chemical Mechanical Polishing ◽  
Material Removal ◽  
Removal Rate ◽  
High Surface ◽  
Hard Disk ◽  
Mechanical Polishing ◽  
Surfactant Adsorption ◽  
Abrasive Particles ◽  
High Surface Quality

Chemical mechanical polishing (CMP) has been a widely applied process for hard disk substrates with nickel–phosphorous (Ni–P) plated. In this paper, the effects of abrasive and surfactant on the polishing performance of hard disk substrates using prepared colloidal silica-based alkaline slurry were investigated. The experimental results indicate that the material removal rate (MRR) strongly depends on the abrasive concentration and nonionic surfactant have little influence on the material removal rate. Under the testing conditions, smaller SiO2, moderate SiO2 concentration and higher surfactant concentration can obtain high surface quality in the prepared slurry. These results have been explained by which the abrasive particles move through the cover layer caused by surfactant adsorption on the disk substrates surface being polished.

Free and Fixed Abrasive Lapping of BK7 Glass

2016 ◽  
Vol 693 ◽  
pp. 780-787
Author(s):  
Jun Li ◽  
Y.K. Tang ◽  
Y.W. Zhu ◽  
Y. L. Sun ◽  
Dun Wen Zuo
Keyword(s):  
Surface Quality ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Surface Damage ◽  
Good Surface ◽  
Bk7 Glass ◽  
Fixed Abrasive ◽  
Damage Categories ◽  
Free Abrasive

Fixed abrasive technology which has many advantages is one of the future machining directions. Free and fixed abrasive lapping of BK7 glass was investigated and different material removal modes and surface damage categories by lapping were discussed. The results show that material removal rate is larger for free abrasive lapping than that of fixed abrasive lapping with four abrasive sizes and decreases with diamond size decreasing in two lapping processes. Surface quality is better for fixed abrasive lapping than that of free abrasive lapping at the same diamond size and gets better with the decreasing of diamond size. Fixed abrasive lapping can achieve simultaneously high MRR and good surface quality.

scholarly journals Experimental investigation of the machining characteristics in diamond wire sawing of unidirectional CFRP

2021 ◽  
Author(s):  
Lukas Seeholzer ◽  
Stefan Süssmaier ◽  
Fabian Kneubühler ◽  
Konrad Wegener
Keyword(s):  
Surface Quality ◽  
Influencing Factors ◽  
Material Properties ◽  
High Surface ◽  
Workpiece Surface ◽  
High Surface Quality ◽  
High Productivity ◽  
Surface Temperatures ◽  
Process Forces ◽  
The Wire

AbstractEspecially for slicing hard and brittle materials, wire sawing with electroplated diamond wires is widely used since it combines a high surface quality with a minimum kerf loss. Furthermore, it allows a high productivity by machining multiple workpieces simultaneously. During the machining operation, the wire/workpiece interaction and thus the material removal conditions with the resulting workpiece quality are determined by the material properties and the process and tool parameters. However, applied to machining of carbon fibre reinforced polymers (CFRP), the process complexity potentially increases due to the anisotropic material properties, the elastic spring back potential of the material, and the distinct mechanical wear due to the highly abrasive carbon fibres. Therefore, this experimental study analyses different combinations of influencing factors with respect to process forces, workpiece surface temperatures at the wire entrance, and the surface quality in wire sawing unidirectional CFRP material. As main influencing factors, the cutting and feed speeds, the density of diamond grains on the wire, the workpiece thickness, and the fibre orientation of the CFRP material are analysed and discussed. For the tested parameter settings, it is found that while the influence of the grain density is negligible, workpiece thickness, cutting and feed speeds affect the process substantially. In addition, higher process forces and workpiece surface temperatures do not necessarily deteriorate the surface quality.

scholarly journals Investigation on the Surface Quality Obtained during Trochoidal Milling of 6082 Aluminum Alloy

Machines ◽  
2021 ◽  
Vol 9 (4) ◽  
pp. 75
Author(s):  
Nikolaos E. Karkalos ◽  
Panagiotis Karmiris-Obratański ◽  
Szymon Kurpiel ◽  
Krzysztof Zagórski ◽  
Angelos P. Markopoulos
Keyword(s):  
Surface Roughness ◽  
Surface Quality ◽  
Process Parameters ◽  
Manufacturing Industry ◽  
High Surface ◽  
Cutting Tools ◽  
Cutting Speed ◽  
Depth Of Cut ◽  
High Surface Quality ◽  
Trochoidal Milling

Surface quality has always been an important goal in the manufacturing industry, as it is not only related to the achievement of appropriate geometrical tolerances but also plays an important role in the tribological behavior of the surface as well as its resistance to fatigue and corrosion. Usually, in order to achieve sufficiently high surface quality, process parameters, such as cutting speed and feed, are regulated or special types of cutting tools are used. In the present work, an alternative strategy for slot milling is adopted, namely, trochoidal milling, which employs a more complex trajectory for the cutting tool. Two series of experiments were initially conducted with traditional and trochoidal milling under various feed and cutting speed values in order to evaluate the capabilities of trochoidal milling. The findings showed a clear difference between the two milling strategies, and it was shown that the trochoidal milling strategy is able to provide superior surface quality when the appropriate process parameters are also chosen. Finally, the effect of the depth of cut, coolant and trochoidal stepover on surface roughness during trochoidal milling was also investigated, and it was found that lower depths of cut, the use of coolant and low values of trochoidal stepover can lead to a considerable decrease in surface roughness.

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