Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solder and Cu Substrate

2013 ◽  
Vol 706-708 ◽  
pp. 138-141
Author(s):  
Xiao Ying Liu ◽  
Ming Liang Huang ◽  
Ning Zhao
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Growth Kinetics ◽  
Liquid State ◽  
Composite Solder ◽  
Interfacial Reactions ◽  
The Other ◽  
Cu Substrate ◽  
Soldering Process ◽  
Small Cracks

The growth kinetics and morphology of intermetallic compound (IMC) between Sn-3Ag-0.5Cu -xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250°C. During soldering process, Fe particles quickly deposited in the vicinity of IMC, resulting in the formation of Fe-rich area. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains of Sn-Ag-Cu/Cu interface after reflowing for 30 min while they were not found in the other composite solders.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

2007 ◽  
Vol 22 (10) ◽  
pp. 2817-2824 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Hyun-Suk Chun ◽  
Hoo-Jeong Lee ◽  
Seung-Boo Jung
Keyword(s):  
High Temperature ◽  
Solid State ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Microstructural Evolution ◽  
Surface Finish ◽  
Solder Matrix ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Study Results

The microstructural evolution and interfacial reactions of fluxless-bonded, Au-20wt%Sn/Cu solder joint were investigated during reflow and aging. After reflowing at 310 °C, only one thick and irregularly shaped ζ(Cu) layer was formed at the interface. After the prolonged reflow reaction, the AuCu layer was formed between the ζ(Cu) layer and the Cu substrate. During reflowing, the Cu substrate reacted primarily with the ζ-phase in the solder matrix. The solid-state interfacial reaction was much faster at 250 °C than at 150 °C. After aging at 250 °C for 100 h, thick ζ(Cu), AuCu and AuCu3 IMC layers were formed at the interface. The formation of the AuCu3 intermetallic compound (IMC) was caused by Cu enrichment at the AuCu/Cu layer interface. After aging for 500 h, cracks were observed inside the interfacial AuCu layer. The study results clearly demonstrate the need for an alternative surface finish on Cu, to ensure the high temperature reliability of the Au-20Sn/Cu solder joint.

Interfacial Reaction of Cu/Sn-Ag/ENIG Sandwich Solder Joint during Aging

2006 ◽  
Vol 15-17 ◽  
pp. 1001-1007 ◽  
Author(s):  
Jeong Won Yoon ◽  
Seung Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Interfacial Reaction ◽  
Isothermal Aging ◽  
Aging Treatment ◽  
Interfacial Reactions ◽  
The Other ◽  
Other Hand ◽  
Electroless Ni ◽  
Isothermal Aging Treatment

The interaction between Cu/Sn-Ag and Sn-Ag/Ni interfacial reactions has been studied during isothermal aging at 150°C for up to 1000h using a Cu/Sn-3.5Ag/ENIG sandwich solder joint. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing. On the other hand, a (Cu,Ni)6Sn5 IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the (Cu,Ni)6Sn5 IMC layer formed on the Ni side has to be contributed from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the (Cu,Ni)6Sn5 IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment at 150°C was performed, any Ni was not detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the (Cu,Ni)6Sn5 IMC layer of the Cu/Sn-Ag/ENIG sandwich joint retarded effectively the consumption of the Ni from the electroless Ni-P layer.

Effect of Aging Time towards Intermetallic Compound (IMC) Growth Kinetics Formation for Sn-0.7Cu-Si3N4 Composite Solder on Copper Substrate

2013 ◽  
Vol 795 ◽  
pp. 505-508 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Diffusion Coefficient ◽  
Intermetallic Compound ◽  
Aging Time ◽  
Growth Kinetics ◽  
Aging Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Intermetallic Growth ◽  
Reliability Of Solder Joints ◽  
Electronic Assemblies

The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its interfacial joint on Cu substrate. Various isothermal of aging times were carried in this study by using 24hrs, 240hrs, 480hrs, 600hrs and 720hrs at 150°C of aging temperature. The Cu-Sn IMC thickness was increase with increasing aging time and the diffusion coefficient of this composite solder is 1.16x10-16m2/s.

Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

2007 ◽  
Vol 437 (1-2) ◽  
pp. 169-179 ◽  
Author(s):  
Peng Sun ◽  
Cristina Andersson ◽  
Xicheng Wei ◽  
Zhaonian Cheng ◽  
Dongkai Shangguan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Sandwich Structure ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Cu Metallization

Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C

2006 ◽  
Vol 21 (12) ◽  
pp. 3196-3204 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Jun Hyung Lim ◽  
Hoo-Jeong Lee ◽  
Jinho Joo ◽  
Seung-Boo Jung ◽  
...  
Keyword(s):  
Solder Joint ◽  
Eutectic Reaction ◽  
Bulk Solder ◽  
Interfacial Reactions ◽  
Test Results ◽  
Mechanical Reliability ◽  
Viable Option ◽  
Reaction Behavior ◽  
Cu Substrate ◽  
Joint Reliability

Joint reliability of immersion Ag with two different solders, Sn–37Pb and Sn–3.5Ag, were evaluated. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn–Pb solder produced a Pb-rich phase along the interface between the solder and the Cu substrate during aging. In contrast, the Sn–Ag solder exhibits an off-eutectic reaction to produce the eutectic phase and Ag3Sn precipitate. The shear test results show that the Sn–Pb solder joint fractured along the interface showing brittle failure indications possibly due to the brittle Pb-rich layer. In contrast, the failure of Sn–Ag solder joint was only through the bulk solder, providing evidence that the interface is mechanically reliable. The results from this study confirm that the immersion Ag/Sn–Ag solder joint is mechanically robust, and thus the combination is a viable option for a Pb-free package system.

Non-Metal Reinforced Lead-Free Composite Solder Fabrication Methods and its Reinforcing Effects to the Suppression of Intermetallic Formation: Short Review

2013 ◽  
Vol 421 ◽  
pp. 260-266 ◽  
Author(s):  
M.A.A. Mohd Salleh ◽  
Stuart McDonald ◽  
Kazuhiro Nogita
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Composite Solder ◽  
Short Review ◽  
Lead Free ◽  
Nanoparticle Size ◽  
Intermetallic Formation ◽  
Reinforcing Effects ◽  
Lead Free Solders

To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders.This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that byadditions of non-metal reinforcement from micron up to nanoparticle size had suppressed the intermetallic compound formations of lead-free composite solders.

scholarly journals Influences of silicon carbide nanowires addition on IMC growth behavior of pure Sn solder during solid-liquid diffusion

2021 ◽  
Author(s):  
Mulan Li ◽  
Liang Zhang ◽  
Jiang Nan ◽  
Sujuan Zhong ◽  
Lei Zhang
Keyword(s):  
Silicon Carbide ◽  
Solder Joint ◽  
Ductile Fracture ◽  
Composite Solder ◽  
Mechanical Performance ◽  
Growth Behavior ◽  
Liquid Diffusion ◽  
Soldering Process ◽  
Solid Liquid ◽  
Pure Sn

Abstract In this paper, various mass fraction (0, 0.2, 0.4, 0.6, 0.8, 1.0 wt%) of silicon carbide nanowires (SiC) were incorporated into pure Sn solder to enhance the performances of Sn solder joint. The wetting behavior, shear strength and intermetallic compound (IMC) growth mechanism of Sn-xSiC/Cu solder during solid-liquid diffusion at 250°C was investigated systematically. The experiment results demonstrated that the wettability of Sn-xSiC/Cu solder had a significant improvement when the addition of SiC was up to 0.6 wt%, and excessive additives would degrade the wettability of the composite solder. The formation of the Cu6Sn5 IMC layer was observed at the Sn-xSiC solder/Cu interface. Meanwhile, SiC as an additive was conducive to restraining the growth of interfacial IMC during soldering process and the IMC thickness overtly fell down after doping 0.8 wt% SiC into Sn solder. Moreover, SiC addition would contribute to enhancing the mechanical performance of Sn solder joint. The fracture mechanism of solder joint changed from a mix of brittle and ductile fracture to a characteristic of typical ductile fracture.

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