Effect of Aging Time towards Intermetallic Compound (IMC) Growth Kinetics Formation for Sn-0.7Cu-Si3N4 Composite Solder on Copper Substrate

2013 ◽  
Vol 795 ◽  
pp. 505-508 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Diffusion Coefficient ◽  
Intermetallic Compound ◽  
Aging Time ◽  
Growth Kinetics ◽  
Aging Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Intermetallic Growth ◽  
Reliability Of Solder Joints ◽  
Electronic Assemblies

The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic assemblies industry. In this investigation, we used Sn-0.7Cu/1.0-Si3N4 composite solder to analyze its interfacial joint on Cu substrate. Various isothermal of aging times were carried in this study by using 24hrs, 240hrs, 480hrs, 600hrs and 720hrs at 150°C of aging temperature. The Cu-Sn IMC thickness was increase with increasing aging time and the diffusion coefficient of this composite solder is 1.16x10-16m2/s.

Low and High Temperature Isothermal Aging Effect on Morphology and Diffusion Kinetics of Intermetallic Compound (IMC) for Sn-Cu-Si3N4 Composite Solder

2013 ◽  
Vol 594-595 ◽  
pp. 666-670
Author(s):  
Saud Norainiza ◽  
S.I. Najib ◽  
M.A.A. Mohd Salleh
Keyword(s):  
High Temperature ◽  
Intermetallic Compound ◽  
Aging Temperature ◽  
Composite Solder ◽  
Aging Effect ◽  
Cu6sn5 Phase ◽  
High Aging Temperature ◽  
Reliability Of Solder Joints ◽  
Kinetics Of ◽  
And Diffusion

The effect of excessive intermetallic growth to the reliability of solder joints become major problem in electronic devices industry. In this study, we used Sn-Cu-Si3N4composite solder to observe the intermetallic compound (IMC) growth during low and high temperature aging. 50°C and 150°C represent low and high aging temperature respectively. Various isothermal of aging times were carried out by using 24hrs, 240hrs and 720hrs. The IMC thickness increases with increasing of aging temperature and time. Cu6Sn5 phase appear at low aging temperature whilst Cu6Sn5together with Cu3Sn phases has been observed at high aging temperature. The growth kinetics for low and high aging temperature is 1.63x10-18μm2/s and 2.75 x10-18μm2/s.

Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 546-550 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Contact Angle ◽  
Intermetallic Compound ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Solder Paste ◽  
X Ray Diffraction ◽  
Free Solder ◽  
Sic Particle

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste

2016 ◽  
Vol 700 ◽  
pp. 123-131 ◽  
Author(s):  
Rita Mohd Said ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
Norhayanti Mohd Nasir ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Aging Time ◽  
Isothermal Aging ◽  
Composite Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Interfacial Imcs ◽  
Planar Shape ◽  
Interfacial Intermetallic Compound

This work investigated the effects of 1.0 wt. % TiO2 particles addition into Sn-Cu-Ni solder paste to the growth of the interfacial intermetallic compound (IMC) on Cu substrate after isothermal aging. Sn-Cu-Ni solder paste with TiO2 particles were mechanically mixed to fabricate the composite solder paste. The composite solder paste then reflowed in the reflow oven to form solder joint. The reflowed samples were then isothermally aged 75, 125 and 150 ° C for 24 and 240 h. It was found that the morphology of IMCs changed from scallop-shape to a more uniform planar shape in both Sn-Cu-Ni/Cu joints and Sn-Cu-Ni-TiO2 /Cu joint. Cu6Sn5 and Cu3Sn IMC were identified and grew after prolong aging time and temperature. The IMCs thickness and scallop diameter of composite solder paste were reduced and the growth of IMCs thickness after isothermal aging become slower as compared to unreinforced Sn-Cu-Ni solder paste. It is suggested that TiO2 particles have influenced the evolution and retarded the growth of interfacial IMCs.

The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 551-555 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Activated Carbon ◽  
Intermetallic Compound ◽  
Melting Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Contact Angles ◽  
Solder Paste ◽  
Compound Formation ◽  
Carbon Particles ◽  
Intermetallic Compound Formation

This paper reports on the effect of activated carbon (AC) addition on the properties of Sn-Cu-Ni (SN100C) solder paste. The composite solder was prepared by mixing reinforcement particles (0, 0.25, 0.5, 0.75 and 1.0 wt. %) into SN100C solder paste. The melting temperature of composite solder was determined by using differential scanning calorimetry (DSC). Wettability of fabricated solder was studied through contact angles between solder and copper substrate interface. The intermetallic compound formation was studied after reflow soldering process.With increased carbon particles addition, the composite solder was found to have a slightly lower melting temperature compared to monolithic solder while the wettability of composite solder effectively had improved. The activated carbon particles in solder paste composite have significant effects on the formation of intermetallic compounds (IMCs) at the solder/Cu substrate interfaces by suppressing the IMCs thickness.

Correlation analysis of wettability, intermetallic compound formation and PCB contamination

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 70-75 ◽  
Author(s):  
Frantisek Steiner ◽  
Karel Rendl ◽  
Vaclav Wirth
Keyword(s):  
Intermetallic Compound ◽  
Printed Circuit Boards ◽  
Thickness Measurement ◽  
Wetting Angle ◽  
Content Type ◽  
Reliability Of Solder Joints ◽  
Set Up ◽  
Laser Confocal Microscope ◽  
Ionic Contamination ◽  
Electronic Assemblies

Purpose – The purpose of this paper is to verify how solder joint properties correlate with soldering profile set-up. These characteristics act against each other. All observed properties may significantly affect the quality and reliability of solder joints. The purpose is also to design recommendations for manufacturers of electronic assemblies. Design/methodology/approach – The samples for experiment were reflowed by using a laboratory reflow oven. A LEXT laser confocal microscope was used for wetting angle and intermetallic compound (IMC) thickness measurement. The ionic contamination was measured by using a contaminometer. Findings – The appropriate choice of soldering profile is very important for the reliability of electronic assemblies. The higher temperatures or longer preheating and soldering times improve the wetting angle. Likewise, there is also the activation of all the fluxes. The result is low contamination with printed circuit boards (PCBs). On the other hand, we must not forget that higher temperatures and longer soldering time also affect the thickness of the IMC. The outer limits recommended by the manufacturer were selected for the soldering profile set-up. Even within these limits, it is possible to achieve an improvement in the wetting angle, an improvement in levels of PCB contamination and an increase in the thickness of the IMC. This paper presents the results achieved for solders Sn42Bi57.6Ag0.4, Sn96.5Ag3Cu0.5 and Sn97Ag3. Originality/value – The gained knowledge on the correlation between IMC thickness, solderability of PCB and PCB contamination caused by different soldering profile set-ups can help to prevent reliability problems because each of the named effects has a significant influence on reliability.

Effect of Aging Temperature on the Intermetallic Compound (IMC) Formation of Sn-0.7Cu/Si3N4 Composite Solder

2013 ◽  
Vol 795 ◽  
pp. 522-525 ◽  
Author(s):  
S.I. Najib ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Saud Norainiza
Keyword(s):  
Intermetallic Compound ◽  
Aging Temperature ◽  
Electronic Packaging ◽  
Isothermal Aging ◽  
Aging Process ◽  
Composite Solder ◽  
Intermetallic Formation ◽  
Imcs Growth ◽  
Packaging Industry ◽  
Growth Formation

Nowadays, excessive growth intermetallic formation becomes the major issue in electronic packaging industry. The investigation on the effect of aging temperature to the intermetallic compound (IMCs) growth formation for Sn-0.7Cu/1.0-Si3N4 was studied. Isothermal aging process was carried out for 24 hours, with 5 difference aging temperature from 50°C up to 150°C. It is found that the Cu-Sn IMCs which appear after reflowed process, has grew rapidly when aging temperature was increased up to 125°C and started to reduced after 150°C aging temperature.

scholarly journals Effect of Power Cycling and Heat Aging on Reliability and IMC Growth of Sn-5Sb and Sn-10Sb Solder Joints

2018 ◽  
Vol 2018 ◽  
pp. 1-6
Author(s):  
Tatsuya Kobayashi ◽  
Ikuo Shohji ◽  
Yusuke Nakata
Keyword(s):  
Growth Kinetics ◽  
Aging Temperature ◽  
Solder Joints ◽  
High Reliability ◽  
Power Cycles ◽  
Power Cycle ◽  
Cycling Test ◽  
Power Cycling ◽  
Reliability Of Solder Joints ◽  
Kinetics Of

Power cycle reliability of solder joints with Sn-5Sb (mass%) and Sn-10Sb (mass%) alloys was investigated. The effects of power cycling and heat aging on the growth of intermetallic compound (IMC) layers at the interfaces between Sn-Sb alloys and Cu plates were also investigated. In the power cycling test, the solder joint with Sn-10Sb has high reliability compared with that of Sn-5Sb. IMC layers grew in both joints with increasing number of power cycles. Compared with Sn-5Sb and Sn-10Sb, difference in growth kinetics of IMC layers was negligible. A similar tendency was observed in the heat aging test. Compared with the power cycling and the heat aging, growth of IMC layers at the aging temperature of 200°C is faster than that in the power cycling test at the temperature range of 100°C to 200°C, while that at the aging temperature of 100°C, the growth is slower. On the basis of the comparison between the power cycling and the heat aging, it was clarified that growth kinetics of IMC layers in the power cycling can be predicted by investigating growth kinetics of the IMC layer at the temperatures in the vicinity of the peak temperature in power cycling.

Mechanical Reliability of Epoxy Sn–58wt.%Bi Composite Solder Under Temperature-Humidity Treatment with Organic Solderability Preservatives (OSP) Surface Finish

2020 ◽  
Vol 12 (4) ◽  
pp. 525-530
Author(s):  
Haksan Jeong ◽  
Woo-Ram Myung ◽  
Kyung-Yeol Kim ◽  
Kyung Deuk Min ◽  
Seung-Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Aging Time ◽  
Composite Solder ◽  
Solder Paste ◽  
Mechanical Reliability ◽  
Surface Finishes ◽  
Osp Surface Finish ◽  
Drop Number ◽  
Point Bend ◽  
Board Level

The microstructures and mechanical reliability of Sn–58Bi solder and epoxy Sn–58Bi composite solder joint were investigated with organic solderability preservative surface finishes. The mechanical reliabilities of Sn58Bi and epoxy Sn58Bi solder were evaluated by the board-level drop test and the 3-point bend test after temperature-humidity storage testing. The microstructure and chemical composition of the solder joints were characterized by scanning electron microscopy and energy dispersive X-ray spectroscopy, respectively. The addition of epoxy in solder paste did not affect the morphology of the intermetallic compound. The thickness of the scalloped-shaped Cu6Sn5 intermetallic compound of solder/OSP joint increased with aging time. The drop number until fail for the epoxy Sn58Bi/OSP joint was higher than that for the Sn–58Bi/OSP joint; the average numbers of drops withstood by the Sn–58Bi/OSP joint and epoxy Sn–58Bi/OSP joint following the reflow process were fewer than 10 drops and 180 drops, respectively. The drop number of solder/OSP joints decreased with increasing aging time. The result of the 3-point bend tests shows that the number of bend cycles for the epoxy Sn–58Bi/OSP joint was 30 times higher than that for the Sn–58Bi/OSP joint. The number of bend cycles for solder/OSP joints was decreased with increasing aging time.

Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solder and Cu Substrate

2013 ◽  
Vol 706-708 ◽  
pp. 138-141
Author(s):  
Xiao Ying Liu ◽  
Ming Liang Huang ◽  
Ning Zhao
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Growth Kinetics ◽  
Liquid State ◽  
Composite Solder ◽  
Interfacial Reactions ◽  
The Other ◽  
Cu Substrate ◽  
Soldering Process ◽  
Small Cracks

The growth kinetics and morphology of intermetallic compound (IMC) between Sn-3Ag-0.5Cu -xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250°C. During soldering process, Fe particles quickly deposited in the vicinity of IMC, resulting in the formation of Fe-rich area. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains of Sn-Ag-Cu/Cu interface after reflowing for 30 min while they were not found in the other composite solders.

scholarly journals Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing

Materials ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 776
Author(s):  
Nur Syahirah Mohamad Zaimi ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Andrei Victor Sandu ◽  
Mohd Mustafa Al Bakri Abdullah ◽  
Norainiza Saud ◽  
...  
Keyword(s):  
Shear Strength ◽  
Composite Solder ◽  
Printed Circuit Board ◽  
Microwave Sintering ◽  
Copper Substrate ◽  
Bulk Diffusion ◽  
Circuit Board ◽  
Sac305 Solder ◽  
Lap Shear ◽  
Isothermal Ageing

This paper elucidates the effect of isothermal ageing at temperature of 85 °C, 125 °C and 150 °C for 100, 500 and 1000 h on Sn-3.0Ag-0.5Cu (SAC305) lead-free solder with the addition of 1 wt% kaolin geopolymer ceramic (KGC) reinforcement particles. SAC305-KGC composite solders were fabricated through powder metallurgy using a hybrid microwave sintering method and reflowed on copper substrate printed circuit board with an organic solderability preservative surface finish. The results revealed that, the addition of KGC was beneficial in improving the total thickness of interfacial intermetallic compound (IMC) layer. At higher isothermal ageing of 150 °C and 1000 h, the IMC layer in SAC305-KGC composite solder was towards a planar-type morphology. Moreover, the growth of total interfacial IMC layer and Cu3Sn layer during isothermal ageing was found to be controlled by bulk diffusion and grain-boundary process, respectively. The activation energy possessed by SAC305-KGC composite solder for total interfacial IMC layer and Cu3Sn IMC was 74 kJ/mol and 104 kJ/mol, respectively. Based on a lap shear test, the shear strength of SAC305-KGC composite solder exhibited higher shear strength than non-reinforced SAC305 solder. Meanwhile, the solder joints failure mode after shear testing was a combination of brittle and ductile modes at higher ageing temperature and time for SAC305-KGC composite solder.

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