We focus on the epi layer carrier concentration variation effects to improve the current –
voltage (I-V) characteristics of an n-GaN schottky diode. The carrier concentration of 1×10 15cm-3,
1×1016 cm−3, 1×1017 cm−3 were employed. The simulated current was obtained by forward biasing
the device of up to 2Volt at room temperature using Pt electrode. The study was conducted by
using Atlas/Blaze using various models such as Consrh (Concentration Dependent Shockley Read
Hall), Cvt (Lombardi Model), Fermi (Fermi Dirac), Bgn (Bandgap Narrowing), Conmob
(Concentration Dependent Mobility), Auger (Auger). We found that as the concentration increases
the value of forward current also increase linearly when biased at maximum of 2 volts. The reverse
bias characteristics at the same concentration of the simulated diode up to 100Volt were also
determined. We found that at low carrier concentration the reverse leakage current is minimum and
breakdown voltage is maximum. As the carrier concentration increases there is a linear relationship
between reverse leakage current and epi layer doping carrier concentration. By analyzing the
forward and reverse characteristics we conclude that in forward bias for low carrier concentration
the diode shows schottky rectifying behavior while for higher carrier concentration the diode shows
ohmic behavior. For higher carrier concentration there is a linear relationship between carrier
concentration (n) and forward current. The reverse leakage current is minimum approaching an
ideal value at n≤1×1015cm-3 and breakdown voltage is maximum at these values of concentration.
Increasing the concentration from n≤1×1015cm-3 the value of reverse leakage current is approaching
to the maximum value as a result breakdown voltage decreases. We conclude that for n-GaN
schottky diode the ideal schottky rectifying behavior of I-V characteristics is obtained at carrier
concentration of n≤ 1×1015cm-3 for the simulated diodes at different carrier concentration.