Effect of Bonding Temperature on the Microstructure and Strength of the Joint between Magnesium AZ31 and Ti-6Al-4V Alloys Using Copper Coatings and Tin Interlayers

Transient Liquid Phase (TLP) bonding was performed between Mg-AZ31 and Ti-6Al-4V alloys with various bonding temperatures using Cu coatings and Sn interlayers. The bonding parameters such as bonding pressure and bonding time were fixed at 1 MPa and 15 minutes respectively in order to study the effect of bonding temperature on the joint evolution. Bonds made at temperatures of 540, 560, 580 and 600 C showed good bond strength. The obtained bonds were investigated by Electron Probe Micro-analyzer EPMA and showed reaction layers and diffusion zones for all bonds made. The maximum joint shear strength of 78 MPa was obtained for bond made at 580 C. X-ray diffraction XRD and X-ray photoelectron spectroscopy XPS were taken for the fractured surfaces of bond made at 580 C. The analysis of the fractured surfaces found that the reaction layer contains Sn5Ti6 IMC in the titanium side and Mg2Cu IMC in the magnesium side where the fracture occurs at the diffusion zone in the mg side.

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A process analysis for microchannel deformation and bonding strength by in-mold bonding of microfluidic chips

Journal of Polymer Engineering ◽

10.1515/polyeng-2013-0092 ◽

2015 ◽

Vol 35 (3) ◽

pp. 267-275 ◽

Cited By ~ 6

Author(s):

Chunpeng Chu ◽

Bingyan Jiang ◽

Laiyu Zhu ◽

Fengze Jiang

Keyword(s):

Bonding Strength ◽

Process Analysis ◽

Bonding Temperature ◽

Bonding Time ◽

Production Cycle ◽

Microfluidic Chips ◽

Bonding Pressure ◽

Bonding Parameters ◽

Bonding Technology ◽

Assembly Technology

Abstract A novel combination of thermal bonding and in-mold assembly technology was created to produce microfluidic chips out of polymethylmethacrylate (PMMA), which is named “in-mold bonding technology”. In-mold bonding experiments of microfluidic chips were carried out to investigate the influences of bonding process parameters on the deformation and bonding strength of microchannels. The results show that bonding temperature has the greatest impact on the deformation of microchannels, while bonding pressure and bonding time have more influence on deformation in height than in top width. Considering the bonding strength, the bonding temperature and the bonding pressure have more impact than the bonding time. The time is crucial for the sealing of the chips. By setting the bonding parameters reasonably, the microchannel deformation is <10%, while the bonding strength of the chips is 350 kPa. The production cycle of the chip is reduced to <5 min.

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Bonding Parameters of Anisotropic Conductive Adhesive Film and Peeling Strength

Key Engineering Materials ◽

10.4028/www.scientific.net/kem.297-300.918 ◽

2005 ◽

Vol 297-300 ◽

pp. 918-926 ◽

Cited By ~ 8

Author(s):

Xu Chen ◽

Jun Zhang ◽

Chunlei Jiao ◽

Yan Min Liu

Keyword(s):

High Temperature ◽

Adhesive Strength ◽

Bonding Temperature ◽

Curing Time ◽

Post Processing ◽

Bonding Pressure ◽

Adhesive Film ◽

Bonding Parameters ◽

Anisotropic Conductive Adhesive ◽

Peeling Strength

The effects of different bonding parameters-temperature, pressure, curing time, bonding temperature ramp and post-processing on the adhesive strengths of Anisotropic Conductive Adhesive Film (ACF) interconnection were investigated. The test results showed the adhesive strength increased as the bonding temperature increase. The curing time had great influence on the adhesive strength of ACF joints. The adhesive strengths increased as the bonding pressure increasing, but decreased if the bonding pressure was over 0.25MPa. The effects of different Teflon thickness on the pressure header and post-processing on adhesive strengths performance of ACF joints were studied. It was shown that the 90o peeling strength became deteriorated as the Teflon thickness increase. Different post-processing conditions showed that the specimens kept in 120oC chamber for 30 minutes had the best performance of the ACF interconnection. The environmental experiments of the thermal cycling (-40 - 125oC) and the high temperature/humidity (85oC, 85%RH) aging were used to evaluate the reliability of the specimens with different bonding parameters. It was shown that the high temperature/humidity was the harshest condition to the ACF bonding. The optimum bonding parameters were determined to obtain better peeling strength.

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Efficient Diffusion Bonding between BSCCO Superconducting Multifilamentary Tapes

Materials Science Forum ◽

10.4028/www.scientific.net/msf.580-582.295 ◽

2008 ◽

Vol 580-582 ◽

pp. 295-298

Author(s):

Gui Sheng Zou ◽

Yan Ju Wang ◽

Ai Ping Wu ◽

Hai Lin Bai ◽

Nai Jun Hu ◽

...

Keyword(s):

High Temperature ◽

Diffusion Bonding ◽

New Technology ◽

Bonding Temperature ◽

Interface Bonding ◽

Bonding Pressure ◽

Bonding Parameters ◽

Efficient Diffusion ◽

Bonding Technology ◽

Multifilamentary Tapes

To improve the joining efficiency of Bi-Sr-Ca-Cu-O ( BSCCO) superconducting tapes, a new diffusion bonding technology with a direct uniaxial pressing at high temperature was developed to join 61-filament tapes. It was observed that bonding parameters such as bonding pressure and holding time, significantly affected the critical current ratio (CCRo). A peak CCRo value of 89 % for the lap-joined tapes was achieved at 3 MPa for 2 h when bonding temperature was 800 °C. Compared with the conventional diffusion bonding technology, this new technology remarkably shortened the fabrication period and improved the superconductivity of the joints. The bonding interface and microstructures of the joints were evaluated and correlated to the CCRo. An uniaxial pressing at high temperature was beneficial to interface bonding, and there was an optimal pressure value for the CCRo.

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Tribochemical Behavior of Pure Magnesium During Sliding Friction

Metals ◽

10.3390/met9030311 ◽

2019 ◽

Vol 9 (3) ◽

pp. 311 ◽

Cited By ~ 3

Author(s):

Yan Zhou ◽

Jinfang Peng ◽

Mengjie Wang ◽

Jiliang Mo ◽

Changguang Deng ◽

...

Keyword(s):

Photoelectron Spectroscopy ◽

Sliding Friction ◽

Pure Magnesium ◽

Surface Oxide Layer ◽

Chemical Behavior ◽

Friction Mechanism ◽

X Ray ◽

Reciprocating Sliding ◽

Electron Probe Micro Analyzer ◽

Worn Surface

Reciprocating sliding friction tests were conducted on pure magnesium using a UMT-II tester. The tribo-chemical behavior was characterized using X-ray photoelectron spectroscopy (XPS) and electron probe micro-analyzer (EPMA), which showed that the tribo-chemical behavior of pure magnesium was due to a tribo-oxidation reaction. At room temperature, the debris layer on the worn surface contained Mg(OH)2, MgO, and MgCO3. According to the reciprocating sliding friction mechanism, the decomposition of MgCO3 into MgO should occur. XPS results revealed that the surface oxide layer, containing Mg(OH)2, and MgO, acted as a third layer to protect the surface. Apparently, Mg(OH)2·nH2O was the main tribo-chemical product of pure magnesium under sliding friction.

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Optimization of Diffusion Bonding Process Parameters of Aluminium AA6061-Fly Ash Composites using Taguchi Method

International Journal of Vehicle Structures and Systems ◽

10.4273/ijvss.9.4.05 ◽

2017 ◽

Vol 9 (4) ◽

Author(s):

A. Sittaramane ◽

G. Mahendran

Keyword(s):

Fly Ash ◽

Taguchi Method ◽

Process Parameters ◽

Diffusion Bonding ◽

Bonding Strength ◽

Bonding Temperature ◽

Bonding Process ◽

Bonding Pressure ◽

Bonding Parameters ◽

Response Table

This paper focused to determine optimal bonding parameters based on Taguchi method for maximizing bonding strength. The experiments were conducted on diffusion bonding machine using aluminium fly ash (AFA) composites. Three bonding parameters such as temperature, pressure and time, each at three levels were examined. Taguchi L27 orthogonal array was used as a design of experiment. The response table and the analysis of variance (ANOVA) were calculated to determine which process parameters significantly affect the bonding strength and also the % contribution of each parameter. The results show that the combination of factors and their levels of A2B3C3 i.e. the bonding done at a temperature of 475°C with a pressure of 10 MPa and time for 20 minutes yielded the optimum i.e. maximum bonding strength. Finally, ANOVA results indicated that all three process parameters significantly affected the bonding strength with a maximum contribution from the bonding temperature (85.93%), followed by bonding time (12.6%) and bonding pressure (1.48%). It is also observed that the bonding strength of the diffusion bonding process can be improved effectively through this approach.

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Microstructure Evolution and Shear Property of Cu-In Transient Liquid Phase Sintering Joints

Frontiers in Materials ◽

10.3389/fmats.2021.658464 ◽

2021 ◽

Vol 8 ◽

Author(s):

Bang Jiang ◽

Qiaoxin Zhang ◽

Lin Shi ◽

Chundong Zhu ◽

Zhiwen Chen ◽

...

Keyword(s):

Phase Transition ◽

Shear Strength ◽

Liquid Phase ◽

Solder Joints ◽

Bonding Temperature ◽

Transient Liquid Phase ◽

Liquid Phase Sintering ◽

Holding Time ◽

Bonding Pressure ◽

Transient Liquid Phase Sintering

Transient liquid phase sintering (TLPS) is a promising joining technology that can achieve high temperature resistant solder joints at low temperature, showing excellent potential in power electronics. In this work, Cu/Cu-In/Cu solder joints were successfully prepared by TLPS process. The effects of bonding pressure and holding time on the microstructure and shear strength of Cu-In TLPS joints at 260 and 320°C were studied. The results showed that as bonding pressure increased from 0.1–0.6 MPa, the porosity decreased and shear strength increased significantly. No obvious change was found as bonding pressure continued to increase to 1 MPa. As holding time increased at 260°C, Cu11In9 was formed and gradually transformed to Cu2In that can withstand elevated temperature. Meanwhile, the porosity decreased while shear strength increased. It was calculated that volume expansion (12.74%) occurred during the phase transition from Cu11In9 to Cu2In. When bonding temperature increased to 320°C, only Cu2In was detected and then gradually transformed to Cu7In3 with the growing holding time. As holding time reached 120 min, their porosity increased and lead to weak shear strength due to volume shrinkage (15.43%) during the phase transition from Cu2In to Cu7In3.

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Characterization of electroless nickel and copper coatings: An x-ray photoelectron spectroscopy study

Surface and Coatings Technology ◽

10.1016/0257-8972(87)90138-1 ◽

1987 ◽

Vol 30 (2) ◽

pp. 137-146 ◽

Cited By ~ 5

Author(s):

N.B.S. Nageswara Rao ◽

R.H. Jog ◽

S. Badrinarayanan ◽

A.B. Mandale ◽

A.P.B. Sinha

Keyword(s):

Photoelectron Spectroscopy ◽

Electroless Nickel ◽

Spectroscopy Study ◽

X Ray ◽

Copper Coatings

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Effect of joining temperature on Al2024/Ag/Ti-6Al-4V joints during transient liquid phase bonding

International Journal of Materials Research (formerly Zeitschrift fuer Metallkunde) ◽

10.1515/ijmr-2020-1110509 ◽

2020 ◽

Vol 111 (5) ◽

pp. 424-431

Author(s):

Hamid Naeimian ◽

Mohammad Ammar Mofid

Keyword(s):

Mechanical Properties ◽

Shear Strength ◽

Bonding Temperature ◽

Transient Liquid Phase ◽

Silver Foil ◽

X Ray Diffraction ◽

X Ray ◽

Diffusion Bonds ◽

State Diffusion ◽

Distribution Of Elements

Abstract The objective of this study is to investigate the effect of bonding temperature on the microstructure and mechanical properties of Al2024 and Ti-6Al-4V diffusion bonds using a 30 μm pure silver foil as interlayer. Using optical microscopy, scanning electron microscopy, line scan and X-ray diffraction, the interfaces of joints were evaluated. The mechanical properties of joints were measured using Vickers micro-hardness and shear strength. At the bonding temperature of 570°C joints contained a non-uniform distribution of elements and various intermetallic phases. With increasing bonding temperature, an uninterrupted microstructure is achieved. According to the results, liquid eutectic formed between Ag interlayer and Al2024, while solid-state diffusion occurs between the Ag interlayer and Ti-6Al-4V. The increase in bonding temperature from 570 to 580 °C resulted in higher shear strength, from 71 MPa to 121 MPa.

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