Development of a Combined Diamond Impregnated Lapping Plate

2017 ◽  
Vol 739 ◽  
pp. 157-163
Author(s):  
Guan Fu Lin ◽  
Ming Yi Tsai ◽  
Chiu Yuan Chen
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Single Crystal Silicon ◽  
High Quality ◽  
Crystal Silicon ◽  
Temperature Heating ◽  
Oxidized Diamond ◽  
High Temperature Heating

This paper presents a combined diamond-impregnated lapping plate for single crystal silicon carbide (SiC) to improve the material removal rate due to SiC having very low material removal rate. Three different dimaond shapes were prepared: (1) "sharp," a sharp-edged diamod; (2) "blocky," a high quality crystalline diamond; (3) "oxidized diamond". The diamonds were manufactured by using high temperature heating method in a furnace to induce diamond oxidation resulting in improvement of Ra and sharpness of the diamonds. Three combined diamond-impregnated lapping plates were fabricated using the above mentioned diamond shapes with diamond size of 6μm. The surface roughness and removal rate of the SiC lapping with these plate were investigated. Experimental results showed that the average material removal rate (MRR) of oxidized diamond is higher than that of the other diamond shapes. The MRR of oxidized diamond for C-face and Si-face SiC are 4.72μm/hr and 6.26μm/hr, respectively. It is found that the surface roughness (Ra) of oxidized diamond for C-face and Si-face are 7.547nm and 8.06nm, respectively. This indicates that the combined diamond-impregnated lapping plate can be effectively used for SiC machining.

Effects of Nano-scale Colloidal Abrasive Particle Size on SiO2 by Chemical Mechanical Polishing

2001 ◽  
Vol 671 ◽  
Author(s):  
Chunhong Zhou ◽  
Lei Shan ◽  
S.H. Ng ◽  
Robert Hight ◽  
Andrew. J. Paszkowski ◽  
...  
Keyword(s):  
Particle Size ◽  
Material Removal Rate ◽  
Surface Finish ◽  
Material Removal ◽  
Removal Rate ◽  
Abrasive Particle ◽  
Single Crystal Silicon ◽  
Weight Percent ◽  
Crystal Silicon ◽  
P Type

ABSTRACTThis paper reports on the effect of colloidal abrasive particle size in the polishing of thermally grown silicon dioxide on 100mm diameter, P-type, (100), single crystal silicon wafers. The abrasive particle sizes were varied in six (6) slurries with pH values of 10.97 ± 0.08. The abrasive sizes were 10, 20, 50, 80, 110 and 140nm in diameter, and the slurry contained 30 weight percent abrasives. The experimental results indicate that the material removal rate (MRR) varies with the volume of the particle size. Results also confirm that there exists an optimum abrasive particle size with respect to material removal rate and surface finish. For a pad surface roughness of 5.2μm (Ra), the slurry containing 80nm particles resulted in the highest material removal rate and best surface finish. A nano-film model based on the pad roughness is used to explain the results.

Effect of Polishing Time and Pressure on Polishing Pad Performance

2008 ◽  
Vol 389-390 ◽  
pp. 510-514
Author(s):  
A.Q. Biddut ◽  
Liang Chi Zhang ◽  
Y.M. Ali
Keyword(s):  
Single Crystal ◽  
Material Removal Rate ◽  
Material Removal ◽  
Removal Rate ◽  
Single Crystal Silicon ◽  
Crystal Silicon ◽  
Critical Limit ◽  
Polishing Pads ◽  
Required Quality ◽  
Effective Life

This paper experimentally investigates the effect of time and pressure on the condition of polishing pads and the material removal rate (MRR) of single crystal silicon. It was found that as the pad deteriorates with time, MRR decreases. Surfaces with a required quality can only be achieved before the texture deterioration reaches a critical limit. At a higher pressure, 25 kPa, deterioration is slower, and the effective life of pads and MRR is enhanced.

Effects of Process Parameters on Surface Roughness and MRR in the hard turning of EN 36 steel

2018 ◽  
pp. 102-110
Author(s):  
Amritpal Singh ◽  
Rakesh Kumar
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Hard Turning ◽  
Control Parameter ◽  
Removal Rate ◽  
Cutting Speed ◽  
Depth Of Cut ◽  
Cutting Condition ◽  
Dry Cutting

In the present study, Experimental investigation of the effects of various cutting parameters on the response parameters in the hard turning of EN36 steel under the dry cutting condition is done. The input control parameters selected for the present work was the cutting speed, feed and depth of cut. The objective of the present work is to minimize the surface roughness to obtain better surface finish and maximization of material removal rate for better productivity. The design of experiments was done with the help of Taguchi L9 orthogonal array. Analysis of variance (ANOVA) was used to find out the significance of the input parameters on the response parameters. Percentage contribution for each control parameter was calculated using ANOVA with 95 % confidence value. From results, it was observed that feed is the most significant factor for surface roughness and the depth of cut is the most significant control parameter for Material removal rate.

Effect of SiC-Cu Electrode on Material Removal Rate, Tool Wear and Surface Roughness in EDM Process

2020 ◽  
Vol 38 (9A) ◽  
pp. 1406-1413
Author(s):  
Yousif Q. Laibia ◽  
Saad K. Shather
Keyword(s):  
Surface Roughness ◽  
Tool Wear ◽  
Material Removal Rate ◽  
Material Removal ◽  
Electrical Discharge Machining ◽  
Removal Rate ◽  
304 Stainless Steel ◽  
Tool Electrode ◽  
Pulse Time ◽  
Edm Process

Electrical discharge machining (EDM) is one of the most common non-traditional processes for the manufacture of high precision parts and complex shapes. The EDM process depends on the heat energy between the work material and the tool electrode. This study focused on the material removal rate (MRR), the surface roughness, and tool wear in a 304 stainless steel EDM. The composite electrode consisted of copper (Cu) and silicon carbide (SiC). The current effects imposed on the working material, as well as the pulses that change over time during the experiment. When the current used is (8, 5, 3, 2, 1.5) A, the pulse time used is (12, 25) μs and the size of the space used is (1) mm. Optimum surface roughness under a current of 1.5 A and the pulse time of 25 μs with a maximum MRR of 8 A and the pulse duration of 25 μs.

Enhancement of EDM Performance by Using Copper-Silver Composite Electrode

2020 ◽  
Vol 38 (9A) ◽  
pp. 1352-1358
Author(s):  
Saad K. Shather ◽  
Abbas A. Ibrahim ◽  
Zainab H. Mohsein ◽  
Omar H. Hassoon
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
High Speed ◽  
Composite Electrode ◽  
Removal Rate ◽  
Pure Copper ◽  
High Speed Steel ◽  
Pulse On Time ◽  
Pulse Off Time

Discharge Machining is a non-traditional machining technique and usually applied for hard metals and complex shapes that difficult to machining in the traditional cutting process. This process depends on different parameters that can affect the material removal rate and surface roughness. The electrode material is one of the important parameters in Electro –Discharge Machining (EDM). In this paper, the experimental work carried out by using a composite material electrode and the workpiece material from a high-speed steel plate. The cutting conditions: current (10 Amps, 12 Amps, 14 Amps), pulse on time (100 µs, 150 µs, 200 µs), pulse off time 25 µs, casting technique has been carried out to prepare the composite electrodes copper-sliver. The experimental results showed that Copper-Sliver (weight ratio70:30) gives better results than commonly electrode copper, Material Removal Rate (MRR) Copper-Sliver composite electrode reach to 0.225 gm/min higher than the pure Copper electrode. The lower value of the tool wear rate achieved with the composite electrode is 0.0001 gm/min. The surface roughness of the workpiece improved with a composite electrode compared with the pure electrode.

High-Throughput Picosecond Laser Machining of Aerospace Nickel Superalloy

2021 ◽  
pp. 095440542110288
Author(s):  
Sundar Marimuthu ◽  
Bethan Smith
Keyword(s):  
Surface Roughness ◽  
Material Removal Rate ◽  
Material Removal ◽  
Thermal Damage ◽  
Removal Rate ◽  
Picosecond Laser ◽  
Nickel Superalloy ◽  
Laser Machining ◽  
Process Conditions ◽  
Machining Performance

This manuscript discusses the experimental results on 300 W picosecond laser machining of aerospace-grade nickel superalloy. The effect of the laser’s energetic and beam scanning parameters on the machining performance has been studied in detail. The machining performance has been investigated in terms of surface roughness, sub-surface thermal damage, and material removal rate. At optimal process conditions, a picosecond laser with an average power output of 300 W can be used to achieve a material removal rate (MRR) of ∼140 mm3/min, with thermal damage less than 20 µm. Shorter laser pulse widths increase the material removal rate and reduce the resultant surface roughness. High scanning speeds improve the picosecond laser machining performance. Edge wall taper of ∼10° was observed over all the picosecond laser machined slots. The investigation demonstrates that high-power picosecond lasers can be used for the macro-machining of industrial components at an acceptable speed and quality.

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