Development and Characterization of Tapered Silicon Etch Process by Topography Modeling for TSV Application
2010 ◽
Vol 7
(1)
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pp. 58-66
Keyword(s):
Set Up
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A dual-etch via tapering technology has been presented which combines Bosch process and isotropic etch process. It has been shown that the dual-etch process technology provides a high degree of process flexibility to the user by independently controlling and optimizing the etch rate and profile tapering process. Based on experimental work, RIE process models have been set up using ELITE simulation software from Silvaco. Detailed DOE has been done to optimize the RIE models so that the experimental and simulation results match over a wide range of via geometries and aspect ratios. The optimized models have been further used to predict the aspect ratio induced RIE lag effects.
2020 ◽
Vol 39
(14)
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pp. 1668-1685
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Keyword(s):
2007 ◽
Vol 10-12
◽
pp. 647-651
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