Addressing Next Generation Packaging and IoT with Glass Solutions

2016 ◽  
Vol 2016 (1) ◽  
pp. 000277-000281 ◽  
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Kevin Adriance ◽  
Gene Smith
Keyword(s):  
Mobile Communications ◽  
Mechanical Performance ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Next Generation ◽  
Glass Forming ◽  
Cost Structures ◽  
Downstream Processes ◽  
The Internet Of Things ◽  
Made In

Abstract New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) brings about interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, and manage bonded stacks leveraging TGV and carrier applications. Glass forming processes allow to form in a panel format as well as wafer format at thicknesses as low as 100 μm, giving opportunities to optimize or eliminate current polishing type manufacturing methods and address packaging challenges in a cost effective way. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. We will provide the latest demonstrations of electrical, thermal and mechanical performance and reliability as well as describe areas where glass is being leveraged to achieve goals of next generation products.

Addressing Next Generation Packaging and IoT with Glass Solutions

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-19 ◽  
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Gene Smith
Keyword(s):  
Mobile Communications ◽  
Mechanical Performance ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Electronics Packaging ◽  
Next Generation ◽  
High Frequencies ◽  
Glass Forming ◽  
The Internet Of Things ◽  
Electrical Loss

New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) provide interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, bonded stacks leveraging TGV and in carrier applications. Glass forming processes allow the potential to both form in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods and address packaging challenges in a cost effective way. We will provide the latest demonstrations of electrical, thermal and mechanical performance and reliability, describe areas where glass is being leveraged to achieve goals of next generation products and how properties of different glass types are leveraged by application.

Leveraging Glass Properties for Advanced Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000370-000374
Author(s):  
A.B. Shorey ◽  
Y.J. Lu ◽  
G.A. Smith
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
Glass Substrates ◽  
Glass Forming ◽  
Cost Structures ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust the coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to form both in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.

Advancements in Glass for Packaging Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001879-001892
Author(s):  
Kevin Adriance ◽  
Gene Smith ◽  
Aric Shorey ◽  
Rachel Lu ◽  
Gene Smith
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
Glass Substrates ◽  
Glass Forming ◽  
Cost Structures ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to both form in panel format as well as to at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.

Advancements in Through Glass Via (TGV) Technology

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001343-001363
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Scott Pollard ◽  
Ekatarina Kuksenkova ◽  
Gene Smith
Keyword(s):  
Technology Development ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Mechanical Reliability ◽  
Fabrication Technology ◽  
High Frequencies ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The material properties give many opportunities. As an insulator, glass provides advantages in providing low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks. Forming processes allow the potential to both form in panel format as well as to form at thicknesses as low as 100 um, giving opportunities to provide cost-effective solutions for the industry. Via fabrication technology development continues to advance providing via diameters < 20 um in size in production ready environment. [1–5] As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. There also continues to be increasing amounts of data showing the ability to achieve electrical and thermo-mechanical reliability of substrates with TGV and latest data here will also be provided.

Glass Solutions for Packaging and IoT

2017 ◽  
Vol 2017 (1) ◽  
pp. 000473-000476
Author(s):  
Rachel Lu ◽  
Aric Shorey
Keyword(s):  
Technology Development ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
The Past ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Semiconductor Packaging ◽  
Electrical Loss ◽  
Made In

Abstract The interest in glass as a semiconductor packaging material has continually grown over the past several years. Glass, and its material properties, provides many opportunities for application in advanced packaging. As an insulator, glass is well-suited due to its low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives the opportunity to better manage warp in glass core substrates as well as bonded stacks, either in carrier or interposer applications. Forming processes allow the potential to both manufacture in a panel format as well as at thicknesses as low as 100 um. Both of these give real opportunity to provide cost-effective packaging solutions. Via fabrication technology development continues to advance providing via diameters < 20 um in size in a production ready environment. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and both via and surface metallization. Additionally, data showing the ability to achieve electrical and thermo-mechanical reliability is readily available. Here we provide the latest data on reliability and new product applications for glass-based solutions.

Glass Interposer Substrates: Fabrication, Characterization and Modeling

2013 ◽  
Vol 2013 (1) ◽  
pp. 000625-000630 ◽  
Author(s):  
Aric Shorey ◽  
Satish Chaparala ◽  
Scott Pollard ◽  
Garrett Piech ◽  
John Keech
Keyword(s):  
Economies Of Scale ◽  
Functional Performance ◽  
Positive Impact ◽  
Coefficient Of Thermal Expansion ◽  
Electrical Characterization ◽  
Electrical Performance ◽  
Patterned Wafers ◽  
Downstream Processes ◽  
3D Applications ◽  
Made In

There is growing interest in applying glass as a substrate for 2.5D/3D applications. Glass has many material properties that make it well suited for interposer substrates. Glass based solutions provide significant opportunities for cost reduction by leveraging economies of scale as well as forming substrates at design thickness. A lot of work is being done to validate the value of glass as an interposer substrate. One important area is the electrical performance of glass relative to silicon. Because glass is an insulator, an interposer made with glass should have better electrical performance than one made with silicon. Electrical characterization and electrical models confirm this advantage, and its positive impact on functional performance. Further advantages are anticipated in reliability, driven by the ability to tailor thermal properties such as coefficient of thermal expansion (CTE) of glass. Modeling results will be presented that show how the proper choice of CTE can significantly lower stack warpage. Additionally, significant progress has been made in the demonstration of glass interposer fabrication. Fully patterned wafers and panels with through holes and blind holes are being fabricated today. It is equally important to be able to demonstrate the ability to leverage existing downstream processes for metallization of these substrates. The ability to apply existing downstream processes to make functional glass interposers using both through and blind via technology will be presented.

scholarly journals NOD: a web server to predict New use of Old Drugs to facilitate drug repurposing

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Tarun Jairaj Narwani ◽  
Narayanaswamy Srinivasan ◽  
Sohini Chakraborti
Keyword(s):  
Chemical Space ◽  
Web Server ◽  
Drug Repurposing ◽  
Cost Effective ◽  
Evolutionary Information ◽  
Cost Effective Alternative ◽  
Similarity Searches ◽  
Old Drugs ◽  
Control Study ◽  
Made In

AbstractComputational methods accelerate the drug repurposing pipelines that are a quicker and cost-effective alternative to discovering new molecules. However, there is a paucity of web servers to conduct fast, focussed, and customized investigations for identifying new uses of old drugs. We present the NOD web server, which has the mentioned characteristics. NOD uses a sensitive sequence-guided approach to identify close and distant homologs of a protein of interest. NOD then exploits this evolutionary information to suggest potential compounds from the DrugBank database that can be repurposed against the input protein. NOD also allows expansion of the chemical space of the potential candidates through similarity searches. We have validated the performance of NOD against available experimental and/or clinical reports. In 65.6% of the investigated cases in a control study, NOD is able to identify drugs more effectively than the searches made in DrugBank. NOD is freely-available at http://pauling.mbu.iisc.ac.in/NOD/NOD/.

Sign in / Sign up

Export Citation Format

Share Document