Addressing Next Generation Packaging and IoT with Glass Solutions

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-19 ◽  
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Gene Smith
Keyword(s):  
Mobile Communications ◽  
Mechanical Performance ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Electronics Packaging ◽  
Next Generation ◽  
High Frequencies ◽  
Glass Forming ◽  
The Internet Of Things ◽  
Electrical Loss

New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) provide interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, bonded stacks leveraging TGV and in carrier applications. Glass forming processes allow the potential to both form in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods and address packaging challenges in a cost effective way. We will provide the latest demonstrations of electrical, thermal and mechanical performance and reliability, describe areas where glass is being leveraged to achieve goals of next generation products and how properties of different glass types are leveraged by application.

Addressing Next Generation Packaging and IoT with Glass Solutions

2016 ◽  
Vol 2016 (1) ◽  
pp. 000277-000281 ◽  
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Kevin Adriance ◽  
Gene Smith
Keyword(s):  
Mobile Communications ◽  
Mechanical Performance ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Next Generation ◽  
Glass Forming ◽  
Cost Structures ◽  
Downstream Processes ◽  
The Internet Of Things ◽  
Made In

Abstract New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) brings about interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, and manage bonded stacks leveraging TGV and carrier applications. Glass forming processes allow to form in a panel format as well as wafer format at thicknesses as low as 100 μm, giving opportunities to optimize or eliminate current polishing type manufacturing methods and address packaging challenges in a cost effective way. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. We will provide the latest demonstrations of electrical, thermal and mechanical performance and reliability as well as describe areas where glass is being leveraged to achieve goals of next generation products.

Leveraging Glass Properties for Advanced Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000370-000374
Author(s):  
A.B. Shorey ◽  
Y.J. Lu ◽  
G.A. Smith
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
Glass Substrates ◽  
Glass Forming ◽  
Cost Structures ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust the coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to form both in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.

Advancements in Glass for Packaging Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001879-001892
Author(s):  
Kevin Adriance ◽  
Gene Smith ◽  
Aric Shorey ◽  
Rachel Lu ◽  
Gene Smith
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
Glass Substrates ◽  
Glass Forming ◽  
Cost Structures ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to both form in panel format as well as to at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.

Advancements in Through Glass Via (TGV) Technology

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001343-001363
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Scott Pollard ◽  
Ekatarina Kuksenkova ◽  
Gene Smith
Keyword(s):  
Technology Development ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Mechanical Reliability ◽  
Fabrication Technology ◽  
High Frequencies ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The material properties give many opportunities. As an insulator, glass provides advantages in providing low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks. Forming processes allow the potential to both form in panel format as well as to form at thicknesses as low as 100 um, giving opportunities to provide cost-effective solutions for the industry. Via fabrication technology development continues to advance providing via diameters < 20 um in size in production ready environment. [1–5] As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. There also continues to be increasing amounts of data showing the ability to achieve electrical and thermo-mechanical reliability of substrates with TGV and latest data here will also be provided.

Glass Solutions for Packaging and IoT

2017 ◽  
Vol 2017 (1) ◽  
pp. 000473-000476
Author(s):  
Rachel Lu ◽  
Aric Shorey
Keyword(s):  
Technology Development ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
The Past ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Semiconductor Packaging ◽  
Electrical Loss ◽  
Made In

Abstract The interest in glass as a semiconductor packaging material has continually grown over the past several years. Glass, and its material properties, provides many opportunities for application in advanced packaging. As an insulator, glass is well-suited due to its low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives the opportunity to better manage warp in glass core substrates as well as bonded stacks, either in carrier or interposer applications. Forming processes allow the potential to both manufacture in a panel format as well as at thicknesses as low as 100 um. Both of these give real opportunity to provide cost-effective packaging solutions. Via fabrication technology development continues to advance providing via diameters < 20 um in size in a production ready environment. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and both via and surface metallization. Additionally, data showing the ability to achieve electrical and thermo-mechanical reliability is readily available. Here we provide the latest data on reliability and new product applications for glass-based solutions.

Signal Processing Enhanced Fiber Vibration Sensors

2013 ◽  
Vol 543 ◽  
pp. 302-305
Author(s):  
Daniele Tosi ◽  
Massimo Olivero ◽  
Alberto Vallan ◽  
Guido Perrone
Keyword(s):  
Signal Processing ◽  
Optical Fibers ◽  
Adaptive Filters ◽  
Spectral Estimation ◽  
Cost Effective ◽  
Fiber Sensors ◽  
High Frequencies ◽  
Vibration Sensors ◽  
Signal Processing Algorithms ◽  
Plastic Optical Fibers

The paper analyzes the feasibility of cost-effective fiber sensors for the measurement of small vibrations, from low to medium-high frequencies, in which the complexity of the measurement is moved from expensive optics to cheap electronics without losing too much performance thanks to signal processing algorithms. Two optical approaches are considered: Bragg gratings in standard telecom fibers, which represent the most common type of commercial fiber sensors, and specifically developed sensors made with plastic optical fibers. In both cases, to keep the overall cost low, vibrations are converted into variations of the light intensity, although this makes the received signal more sensitive to noise. Then, adaptive filters and advanced spectral estimation techniques are used to mitigate noise and improve the sensitivity. Preliminary results have demonstrated that the combined effect of these techniques can yield to a signal-to-noise improvement of about 30 dB, bringing the proposed approaches to the level of the most performing sensors for the measurement of vibrations.

scholarly journals Mechanical and thermal stability of retained austenite in plastically deformed bainite-based TRIP-aided medium-Mn steels

2021 ◽  
Vol 21 (3) ◽  
Author(s):  
Aleksandra Kozłowska ◽  
Adam Grajcar ◽  
Aleksandra Janik ◽  
Krzysztof Radwański ◽  
Ulrich Krupp ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Thermal Stability ◽  
Retained Austenite ◽  
Elevated Temperatures ◽  
Mechanical Performance ◽  
Mechanical Stability ◽  
Electron Backscatter Diffraction ◽  
Cost Effective ◽  
Tensile Tests ◽  
Thermal Stability Of

AbstractAdvanced medium-Mn sheet steels show an opportunity for the development of cost-effective and light-weight automotive parts with improved safety and optimized environmental performance. These steels utilize the strain-induced martensitic transformation of metastable retained austenite to improve the strength–ductility balance. The improvement of mechanical performance is related to the tailored thermal and mechanical stabilities of retained austenite. The mechanical stability of retained austenite was estimated in static tensile tests over a wide temperature range from 20 °C to 200 °C. The thermal stability of retained austenite during heating at elevated temperatures was assessed by means of dilatometry. The phase composition and microstructure evolution were investigated by means of scanning electron microscopy, electron backscatter diffraction, X-ray diffraction and transmission electron microscopy techniques. It was shown that the retained austenite stability shows a pronounced temperature dependence and is also stimulated by the manganese addition in a 3–5% range.

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