Glass Solutions for Packaging and IoT

2017 ◽  
Vol 2017 (1) ◽  
pp. 000473-000476
Author(s):  
Rachel Lu ◽  
Aric Shorey
Keyword(s):  
Technology Development ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
The Past ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Semiconductor Packaging ◽  
Electrical Loss ◽  
Made In

Abstract The interest in glass as a semiconductor packaging material has continually grown over the past several years. Glass, and its material properties, provides many opportunities for application in advanced packaging. As an insulator, glass is well-suited due to its low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives the opportunity to better manage warp in glass core substrates as well as bonded stacks, either in carrier or interposer applications. Forming processes allow the potential to both manufacture in a panel format as well as at thicknesses as low as 100 um. Both of these give real opportunity to provide cost-effective packaging solutions. Via fabrication technology development continues to advance providing via diameters < 20 um in size in a production ready environment. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and both via and surface metallization. Additionally, data showing the ability to achieve electrical and thermo-mechanical reliability is readily available. Here we provide the latest data on reliability and new product applications for glass-based solutions.

Advancements in Through Glass Via (TGV) Technology

2015 ◽  
Vol 2015 (DPC) ◽  
pp. 001343-001363
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Scott Pollard ◽  
Ekatarina Kuksenkova ◽  
Gene Smith
Keyword(s):  
Technology Development ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Mechanical Reliability ◽  
Fabrication Technology ◽  
High Frequencies ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The material properties give many opportunities. As an insulator, glass provides advantages in providing low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks. Forming processes allow the potential to both form in panel format as well as to form at thicknesses as low as 100 um, giving opportunities to provide cost-effective solutions for the industry. Via fabrication technology development continues to advance providing via diameters < 20 um in size in production ready environment. [1–5] As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. There also continues to be increasing amounts of data showing the ability to achieve electrical and thermo-mechanical reliability of substrates with TGV and latest data here will also be provided.

Leveraging Glass Properties for Advanced Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000370-000374
Author(s):  
A.B. Shorey ◽  
Y.J. Lu ◽  
G.A. Smith
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
Glass Substrates ◽  
Glass Forming ◽  
Cost Structures ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust the coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to form both in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.

Advancements in Glass for Packaging Applications

2016 ◽  
Vol 2016 (DPC) ◽  
pp. 001879-001892
Author(s):  
Kevin Adriance ◽  
Gene Smith ◽  
Aric Shorey ◽  
Rachel Lu ◽  
Gene Smith
Keyword(s):  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
High Frequencies ◽  
Glass Substrates ◽  
Glass Forming ◽  
Cost Structures ◽  
Advanced Packaging ◽  
Downstream Processes ◽  
Electrical Loss ◽  
Made In

Glass provides many opportunities for advanced packaging. The most obvious advantage is given by the material properties. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion gives advantages to manage warp in glass core substrates and bonded stacks for both through glass vias (TGV) and carrier applications. Glass also gives advantages for developing cost effective solutions. Glass forming processes allow the potential to both form in panel format as well as to at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. By utilizing the stiffness and adjustable CTE of glass substrates, as well as continuously reducing via size that can be made in a panel format, opportunities to manufacture glass TGV substrates in a panel format increase. We will provide an update on advancements in these areas as well as handling techniques to achieve desired process flows. We will also provide the latest demonstrations of electrical, thermal and mechanical reliability.

Addressing Next Generation Packaging and IoT with Glass Solutions

2017 ◽  
Vol 2017 (DPC) ◽  
pp. 1-19 ◽  
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Gene Smith
Keyword(s):  
Mobile Communications ◽  
Mechanical Performance ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Electronics Packaging ◽  
Next Generation ◽  
High Frequencies ◽  
Glass Forming ◽  
The Internet Of Things ◽  
Electrical Loss

New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) provide interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, bonded stacks leveraging TGV and in carrier applications. Glass forming processes allow the potential to both form in panel format as well as at thicknesses as low as 100 um, giving opportunities to optimize or eliminate current manufacturing methods and address packaging challenges in a cost effective way. We will provide the latest demonstrations of electrical, thermal and mechanical performance and reliability, describe areas where glass is being leveraged to achieve goals of next generation products and how properties of different glass types are leveraged by application.

Addressing Next Generation Packaging and IoT with Glass Solutions

2016 ◽  
Vol 2016 (1) ◽  
pp. 000277-000281 ◽  
Author(s):  
Aric Shorey ◽  
Rachel Lu ◽  
Kevin Adriance ◽  
Gene Smith
Keyword(s):  
Mobile Communications ◽  
Mechanical Performance ◽  
Coefficient Of Thermal Expansion ◽  
Cost Effective ◽  
Next Generation ◽  
Glass Forming ◽  
Cost Structures ◽  
Downstream Processes ◽  
The Internet Of Things ◽  
Made In

Abstract New requirements are emerging in electronics packaging. The ever-growing need for solutions for mobile communications and sensors that address the Internet of Things (IoT) brings about interesting new challenges. RF applications strive to move to higher frequency bands, fan-out technology is being leveraged as an effective way to address interconnect demands, and there is a continuous search for more cost-effective solutions for difficult packaging challenges. Glass provides numerous opportunities to address these needs. As an insulator, glass has low electrical loss, particularly at high frequencies. The relatively high stiffness and ability to adjust coefficient of thermal expansion helps optimize warp in glass core substrates, and manage bonded stacks leveraging TGV and carrier applications. Glass forming processes allow to form in a panel format as well as wafer format at thicknesses as low as 100 μm, giving opportunities to optimize or eliminate current polishing type manufacturing methods and address packaging challenges in a cost effective way. As the industry adopts glass solutions, significant advancements have been made in downstream processes such as glass handling and via/surface metallization. Of particular interest is the ability to leverage tool sets and processes for panel fabrication to enable cost structures desired by the industry. We will provide the latest demonstrations of electrical, thermal and mechanical performance and reliability as well as describe areas where glass is being leveraged to achieve goals of next generation products.

Glass Interposer Substrates: Fabrication, Characterization and Modeling

2013 ◽  
Vol 2013 (1) ◽  
pp. 000625-000630 ◽  
Author(s):  
Aric Shorey ◽  
Satish Chaparala ◽  
Scott Pollard ◽  
Garrett Piech ◽  
John Keech
Keyword(s):  
Economies Of Scale ◽  
Functional Performance ◽  
Positive Impact ◽  
Coefficient Of Thermal Expansion ◽  
Electrical Characterization ◽  
Electrical Performance ◽  
Patterned Wafers ◽  
Downstream Processes ◽  
3D Applications ◽  
Made In

There is growing interest in applying glass as a substrate for 2.5D/3D applications. Glass has many material properties that make it well suited for interposer substrates. Glass based solutions provide significant opportunities for cost reduction by leveraging economies of scale as well as forming substrates at design thickness. A lot of work is being done to validate the value of glass as an interposer substrate. One important area is the electrical performance of glass relative to silicon. Because glass is an insulator, an interposer made with glass should have better electrical performance than one made with silicon. Electrical characterization and electrical models confirm this advantage, and its positive impact on functional performance. Further advantages are anticipated in reliability, driven by the ability to tailor thermal properties such as coefficient of thermal expansion (CTE) of glass. Modeling results will be presented that show how the proper choice of CTE can significantly lower stack warpage. Additionally, significant progress has been made in the demonstration of glass interposer fabrication. Fully patterned wafers and panels with through holes and blind holes are being fabricated today. It is equally important to be able to demonstrate the ability to leverage existing downstream processes for metallization of these substrates. The ability to apply existing downstream processes to make functional glass interposers using both through and blind via technology will be presented.

scholarly journals The thermal expansion of quartz by x-ray measurements

1933 ◽  
Vol 142 (846) ◽  
pp. 237-247 ◽  
Keyword(s):  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Optical Measurements ◽  
Optical Methods ◽  
X Rays ◽  
Atomic Lattice ◽  
X Ray ◽  
The Past ◽  
Theoretical Considerations ◽  
Made In

The study of the coefficients of thermal expansion of substances has in the past, for the most part, been confined to direct measurement by optical methods. At the present time X-rays are being used for determining the expansion of the atomic lattice as distinct from the specimen block. A question has arisen as to tire relation between the coefficient of expansion as measured visually and that measured by X-rays. From theoretical considerations Zwicky* has predicted that the two are not identical. X -ray measurements on the thermal expansion of single crystals of bismuth by Goetz and Hergenrothers have shown that there is a difference between the values obtained by the two methods of measurement. On the other hand Y. Tu finds no evidence in his experiments on rock salt of the secondary structure described by Zwicky. The question to be answered is thus one of great importance. the present paper gives evidence to shown that for silver and quarts there is no difference between the coefficients of expansion as measured by X-rays and those from optical measurements. The work described in this paper was carried out to measure the thermal expansion of quartz by X-rays and by comparing the results with those from optical measurements to test the validity of the assumption, made in previous papers, that the coefficient of thermal expansion of silver is the same whether measured by X-rays or optical methods.

scholarly journals Prospects of Developing Prefabricated Masonry Walling Systems in Australia

Buildings ◽  
2021 ◽  
Vol 11 (7) ◽  
pp. 294
Author(s):  
Julian Thamboo ◽  
Tatheer Zahra ◽  
Satheeskumar Navaratnam ◽  
Mohammad Asad ◽  
Keerthan Poologanathan
Keyword(s):  
Environmental Performance ◽  
Structural Characteristics ◽  
Cost Effective ◽  
Future Research ◽  
Limited Attention ◽  
Effective Solution ◽  
The Past ◽  
Masonry Construction ◽  
Made In

Prefabrication has been shown to be an effective way of construction in the modern-day context. Although much progress has been made in developing reinforced concrete (RC), timber and steel prefabricated elements/structures, prefabrication of masonry walling systems has received limited attention in the past. Conventional masonry construction is labour-intensive and time-consuming; therefore, prefabrication can be an effective solution to accelerate the masonry construction to make it more cost-effective. Therefore, in this paper, an attempt has been made to evaluate the effectiveness of prefabricated masonry systems (PMS) in terms of their structural characteristics and sustainability perspectives in an Australian context. Subsequently, the available studies related to PMS and the prospects of developing prefabricated masonry walling systems were appraised and reported. In order to assess the applicability of PMS, a case study was carried out by designing four types of prospective prefabricated masonry walling systems for a typical housing unit in Australia. It was shown that the reinforced (RM), post-tensioned (PT) and thin layered mortared (TLM) masonry systems are better suited for prefabrication. Later, in order to assess the sustainability of the considered masonry walling systems, life cycle energy analyses were carried using the Environmental Performance in Construction (EPIC) database. It was found that there can be nearly 30% and 15% savings, respectively, in terms of energy saving and CO2 emissions in prefabricated construction than the conventional masonry construction. Finally, the prospects of developing PMS and the need for future research studies on these systems are highlighted.

Regulatory and sustainability initiatives lead to improved polyaminopolyamide epichlorohydrin (PAE) wet-strength resins and paper products

TAPPI Journal ◽  
2018 ◽  
Vol 17 (09) ◽  
pp. 519-532 ◽  
Author(s):  
Mark Crisp ◽  
Richard Riehle
Keyword(s):  
Health And Safety ◽  
Cost Effective ◽  
Worker Safety ◽  
Regulatory Requirements ◽  
Wet Strength ◽  
The Past ◽  
Consumer Safety ◽  
Federal Institute ◽  
Sustainability Initiatives ◽  
The Impact

Polyaminopolyamide-epichlorohydrin (PAE) resins are the predominant commercial products used to manufacture wet-strengthened paper products for grades requiring wet-strength permanence. Since their development in the late 1950s, the first generation (G1) resins have proven to be one of the most cost-effective technologies available to provide wet strength to paper. Throughout the past three decades, regulatory directives and sustainability initiatives from various organizations have driven the development of cleaner and safer PAE resins and paper products. Early efforts in this area focused on improving worker safety and reducing the impact of PAE resins on the environment. These efforts led to the development of resins containing significantly reduced levels of 1,3-dichloro-2-propanol (1,3-DCP) and 3-monochloropropane-1,2-diol (3-MCPD), potentially carcinogenic byproducts formed during the manufacturing process of PAE resins. As the levels of these byproducts decreased, the environmental, health, and safety (EH&S) profile of PAE resins and paper products improved. Recent initiatives from major retailers are focusing on product ingredient transparency and quality, thus encouraging the development of safer product formulations while maintaining performance. PAE resin research over the past 20 years has been directed toward regulatory requirements to improve consumer safety and minimize exposure to potentially carcinogenic materials found in various paper products. One of the best known regulatory requirements is the recommendations of the German Federal Institute for Risk Assessment (BfR), which defines the levels of 1,3-DCP and 3-MCPD that can be extracted by water from various food contact grades of paper. These criteria led to the development of third generation (G3) products that contain very low levels of 1,3-DCP (typically <10 parts per million in the as-received/delivered resin). This paper outlines the PAE resin chemical contributors to adsorbable organic halogens and 3-MCPD in paper and provides recommendations for the use of each PAE resin product generation (G1, G1.5, G2, G2.5, and G3).

South Asian Developmental Crisis (Review Article)

1973 ◽  
Vol 12 (2) ◽  
pp. 181-188
Author(s):  
Rafiq Ahmad
Keyword(s):  
Second World War ◽  
World War ◽  
The Past ◽  
The Great Depression ◽  
Political Independence ◽  
Integrated Theory ◽  
Pass Through ◽  
Developed World ◽  
Second World ◽  
Made In

Like nations and civilizations, sciences also pass through period of crises when established theories are overthrown by the unpredictable behaviour of events. Economics is passing through such a crisis. The challenge thrown by the Great Depression of early 1930s took a decade before Keynes re-established the supremacy of economics. But this supremacy has again been upset by the crisis of poverty in the vast under-developed world which attained political independence after the Second World War. Poverty had always existed but never before had it been of such concern to economists as during the past twenty five years or so. Economic literature dealing with this problem has piled up but so have the agonies of poverty. No plausible and well-integrated theory of economic development or under-development has emerged so far, though brilliant advances have been made in isolated directions.

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