Gold Wirebond on Discolored Bond Pads

2014 ◽  
Vol 2014 (1) ◽  
pp. 000295-000300
Author(s):  
Derek Andrews ◽  
Levi Hill ◽  
Hassan Masood ◽  
Durgasamanth Pidikiti ◽  
Qutaiba Khalid ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Process Window ◽  
Physical Analysis ◽  
Ultrasonic Power ◽  
Test Results ◽  
Two Temperatures ◽  
Wafer Processing ◽  
Bond Pads ◽  
Integrity Analysis ◽  
Normal Bond

An integrated circuit wafer lot having some wafers with discolored bond pads and other wafers with normal bond pads was identified, and wafers with discolored pads were scrapped. The reason for scrap is the expectation of poor bondability or unreliable wirebonds on discolored pads. The cause of discoloration was unknown. We took the opportunity to run a bonding experiment and analysis as a student project, comparing a good wafer with one having the discolored bond pads. Unprobed die from each wafer were wirebonded for mechanical integrity analysis of the bonds. Bonding recipe designed experiments included different ultrasonic generator (USG) current settings within the bonding process window, two bonding forces, and two temperatures, all thermosonic binding 25um gold (Au) wire on AlCu pad metal of 0.7um thickness. 2% non-stick-on pads (NSOP) was found at a higher ultrasonic power settings on the discolored pads, indicating that the discolored pads can indeed be problematic in wirebonding. Analysis of wire pull test and bond shear test results indicate slightly less performance of bonds on the discolored pads. Chemical and physical analysis of the discolored pads reveals the nature of the unknown cause and leads to a hypothesis about what went wrong during the wafer processing.

Exotic Doping for Zno Thin Films: Possibility of Monolithic Optical Integrated Circuit

1999 ◽  
Vol 574 ◽  
Author(s):  
Norifumi Fujimura ◽  
Tamaki Shimura ◽  
Toshifumi Wakano ◽  
Atsushi Ashida ◽  
Taichiro Ito
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Nonlinear Optic ◽  
Integrated Circuit ◽  
Film Surface ◽  
Zno Thin Films ◽  
Process Window ◽  
Electro Optic ◽  
Film Substrate ◽  
Optical Integrated Circuit

AbstractWe propose the application of ZnO:X (X = Li, Mg, N, In, Al, Mn, Gd, Yb etc.) films for a monolithic Optical Integrated Circuit (OIC). Since ZnO exhibits excellent piezoelectric effect and has also electro-optic and nonlinear optic effects and the thin films are easily obtained, it has been studied as one of the important thin film wave guide materials especially for an acoustooptic device[1]. In terms of electro-optic and nonlinear optic effects, however, LiNbO3 or LiTaO3 is superior to ZnO. The most important issue of thin film waveguide using such ferroelectrics is optical losses at the film/substrate interface and the film surface, because the process window to control the surface morphology is very narrow due to their high deposition temperature. Since ZnO can be grown at extremely low temperature, the roughness at the surface and the interface is expected to be minimized. This is the absolute requirement especially for waveguide using a blue or ultraviolet laser. Recently, lasing at the wavelength of ultraviolet, ferroelectric and antiferromagnetic behaviors of ZnO doped with various exotic elements (exotic doping) have been reported. This paper discusses the OIC application of ZnO thin films doped with exotic elements.

scholarly journals PERBANDINGAN IDENTIFIKASI PEMBICARA MENGGUNAKAN MFCC DAN SBC DENGAN CIRI PENCOCOKAN LBG-VQ

2018 ◽  
Author(s):  
Purwono Prasetyawan
Keyword(s):  
Feature Extraction ◽  
Human Behavior ◽  
Vector Quantization ◽  
Speaker Identification ◽  
Extraction Methods ◽  
Behavioral Characteristics ◽  
Physical Analysis ◽  
Test Results ◽  
Voice Signal ◽  
Signal Characteristics

Biometrics is a technology for physical analysis and human behavior used in authentication. One of the behavioral characteristics associated with a person is sound. A person's voice can be identified based on the person's voice signal characteristics. There are several methods in recognizing speaker sound, such as with Mel Frequency Cepstrum Calculation (MFCC) and Subband Based Cepstral (SBC). This study looked for the effectiveness of the use of MFCC and SBC feature extraction with LBG Vector Quantization matching characteristics. Effective feature extraction methods will be tested for realtime speaker identification. The results obtained from this research is the value of MFCC 32 coefficient more effective than the SBC accurately and the speed of the process of identification of both text-dependent and text-independent speaker. The test results of speaker identification in realtime using MFCC is still not satisfactory because the accuracy of recognition is still below 70%.

Effects of Probe Marks on Shear Test of Copper Ball Bonds in Two Pad Aluminum Thicknesses

2016 ◽  
Vol 2016 (1) ◽  
pp. 000219-000226 ◽  
Author(s):  
Priscila Brown ◽  
Rachel Wynder ◽  
Dustin Tenney ◽  
Stevan Hunter
Keyword(s):  
Image Analysis ◽  
Shear Force ◽  
Shear Test ◽  
Physical Factors ◽  
Microscopic Image ◽  
Test Results ◽  
Contact Areas ◽  
Ball Bonds ◽  
Optical Microscopic Image ◽  
Bond Pads

Abstract This paper continues the work of reference [1], evaluating shear test results of Cu ball bonds over a variety of probe marks in two different pad aluminum (Al) thicknesses (0.8μm and 3μm). The presence of invasive probe marks on thick Al bond pads lowers certain shear force results.. Lower values of shear force imply reduced Cu bond reliability. Physical factors are investigated relating to poor intermetallic (IMC) formation in the Cu wirebond and bond shear force. Optical microscopic image analysis of Cu bonds, bond contact areas and Al “splash” are studied for correlation with the shear test results. Percent IMC coverage of bond contact areas decrease when invasive probe marks are present beneath the bond, which in turn may reduce the shear force. Probe mark features are studied to discover the characteristics of greatest influence on % IMC coverage and shear test values in each of the pad metal thicknesses.

Vibration Fatigue Test of Surface Mount Electronic Components

2003 ◽  
Author(s):  
T. E. Wong ◽  
H. S. Fenger
Keyword(s):  
Solder Joint ◽  
Random Vibration ◽  
Flip Chip ◽  
Prediction Models ◽  
Physical Analysis ◽  
Test Results ◽  
Printed Wiring Board ◽  
Joint Stress ◽  
Vibration Fatigue ◽  
Vibration Tests

The objectives of the present studies are to design and test representative commercial off-the-shelf plastic encapsulated microcircuits, including various types of ball grid array (BGA) components, chip scale package, flip chip, lead flat pack, and leadless capacitor, over military random vibration levels. The approach is to demonstrate the solder joint reliability performance of these components through the design of an electrical daisy-chain pattern printed wiring board (PWB) assembly test vehicle (TV), in which the design and manufacturing variables are included. The three variables, including BGA underfilled materials, solder pad sizes on PWB, and BGA rework, with each having either two or three levels of variation are used to address test criteria and to construct 14 different types of TV configurations. All TV configurations are then subjected to random vibration tests while continuously monitoring solder joint integrity. Based on the measured results, a destructive physical analysis is then conducted to further isolate the failure locations and determine the failure mechanisms of the solder joints. Test results indicate that the 352-pin tape BGA and 600-pin super BGA are more susceptible to failure than plastic BGAs under the same conditions, and that the use of underfilled materials appears to improve the life expectancy of all the components. The stiffer packages of tape BGA and super BGA, which have copper heat spreaders, may account for higher BGA solder joint stress/strain during random vibration tests. Test data also shows that only a limited number of electrical opening are observed. This indicates that the test modules are robust enough to survive the random vibration inputs. One possible reason is that the test modules are very stiff, whose 1st mode of natural frequency is about 550 Hz. Therefore, the curvature changes of the test modules are minimal, which resulted in smaller relative motion between the package and the PWB, and less solder joint stresses. All these test results are recommended to be used for calibrating BGA solder joint vibration fatigue life prediction models, which will be presented in other publications.

A Comprehensive Approach to Lifted Bond Balls Package Failure

2013 ◽  
Author(s):  
Dat Nguyen ◽  
Sagar Karki
Keyword(s):  
Cross Section ◽  
Cross Sections ◽  
Integrated Circuit ◽  
Failure Mechanisms ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Back Side ◽  
Ball Bond ◽  
Infra Red ◽  
Bond Pads

Abstract Lifted bond balls in Integrated Circuit (IC) have numerous failure mechanisms. A simple external curve can confirm the open, and with package decapsulation, lifted balls can be readily observed. However, the exact cause can be difficult to identify. Most often, a cross section through the balls was performed, but it is far from being able to reveal the reason for lifted bond balls. A comprehensive FA approach is needed. Performing failure analysis through the back side of the die using Scanning Acoustic Microscopy (C-SAM) and Infra Red (IR) inspection helps to observe the conditions of the bond pads. Pulling the die from the mold compound can provide a pristine view of the bond ball-bond pad interface. This allows the detection of contaminants, both organic and inorganic, which cross sections cannot provide.

Contamination of Chip Surfaces by Particles During Destructive Physical Analysis of Integrated Circuit Devices

1988 ◽  
pp. 69-76
Author(s):  
J. J. Weimer ◽  
J. Kokosinski ◽  
M. R. Cook ◽  
M. Grunze
Keyword(s):  
Integrated Circuit ◽  
Physical Analysis

Intrinsic Point Defects and Their Control in Silicon Crystal Growth and Wafer Processing

MRS Bulletin ◽  
2000 ◽  
Vol 25 (6) ◽  
pp. 28-32 ◽  
Author(s):  
R. Falster ◽  
V. V. Voronkov
Keyword(s):  
Integrated Circuit ◽  
Carrier Lifetime ◽  
Minority Carrier ◽  
Silicon Crystal ◽  
Stacking Faults ◽  
Minority Carrier Lifetime ◽  
Defect Engineering ◽  
Ic Manufacturing ◽  
Microelectronics Industry ◽  
Wafer Processing

Silicon produced for the microelectronics industry is far and away the purest and most perfect crystalline material manufactured today. It is fabricated routinely and in very large volumes. Many of the advances in integrated-circuit (IC) manufacturing achieved in recent years would not have been possible without parallel advances in silicon-crystal quality and defect engineering. Transition-metal contamination is a case in point. Essentially all practical problems (minority carrier lifetime, metal precipitation, stacking faults, etc.) associated with metal contaminants have largely been solved through advances in crystal purity.

Implementation of a Customiazble GUI Software Platform for IC Equipment

2014 ◽  
Vol 568-570 ◽  
pp. 1455-1458
Author(s):  
Chen Xi Wang ◽  
Ming Zhe Liu ◽  
Ai Dong Xu
Keyword(s):  
Control System ◽  
Integrated Circuit ◽  
Semiconductor Industry ◽  
Control Technology ◽  
Data Display ◽  
Software Platform ◽  
Manufacturing Equipment ◽  
Development Method ◽  
Different Types ◽  
Wafer Processing

With the development of semiconductor industry, different types of wafer processing are increasing. According to the different wafer processing models, the need of data display and process is different. In this paper, a customizable software platform is described for the manufacturing equipment of semiconductor integrated circuit (IC equipment). The C# control technology has been used to build the IC equipment customizable control system interface. The development method of customizable control technology based on C# can realize the control of the reuse and codes sharing, in order to improve programming efficiency, avoid the development of two times, cost saving and be easy to debug.

scholarly journals Optimization of Process Parameters for Enhanced Degradation of Methylene Blue by Trough Ultrasonic

2022 ◽  
Vol 2152 (1) ◽  
pp. 012027
Author(s):  
Yong-guang Bi ◽  
Yu-hong Zheng ◽  
Li Tang ◽  
Juan Guo ◽  
Shao-Qi Zhou
Keyword(s):  
Methylene Blue ◽  
Process Conditions ◽  
Ultrasonic Power ◽  
Test Results ◽  
Dyeing Wastewater ◽  
Optimal Process ◽  
Printing And Dyeing Wastewater ◽  
Optimization Of Process Parameters ◽  
Large Discharge ◽  
Enhanced Degradation

Abstract Due to the complex quality and the large discharge of printing and dyeing wastewater, it will pollute the environment and affect human health. Therefore, how to use efficient and inexpensive treatment methods to treat printing and dyeing wastewater has become an urgent problem to be solved. At present, most printing and dyeing wastewater contains methylene blue pollutants. Based on the previous research in this article, the process conditions for the enhanced degradation of methylene blue by trough ultrasound are optimized. Orthogonal test results show that the optimal process parameter for the degradation of methylene blue by trough ultrasonic is pH 12.70, and the initial With a concentration of 10.00mg/L and an ultrasonic power of 200W, under the above optimal process conditions, the degradation rate of methylene blue is 77.95%; Ultrasound improves the rapid degradation of methylene blue through mechanisms such as cavitation, thermal and mechanical effects. This process can be used for the industrial degradation of methylene blue. The application provides a research basis.

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