scholarly journals A parametric investigation of a PCM-based pin fin heat sink

2015 ◽  
Vol 6 (1) ◽  
pp. 65-73 ◽  
Author(s):  
R. Pakrouh ◽  
M. J. Hosseini ◽  
A. A. Ranjbar
Keyword(s):  
Heat Sink ◽  
Phase Change Materials ◽  
Electronic Devices ◽  
Operating Time ◽  
Heat Sinks ◽  
Geometrical Parameters ◽  
Base Temperature ◽  
Pin Fin ◽  
Heat Transfer Calculation ◽  
Acceptable Agreement

Abstract. This paper presents a numerical investigation in which thermal performance characteristics of pin fin heat sinks enhanced with phase-change materials (PCMs) designed for cooling of electronic devices are studied. The paraffin RT44 HC is poured into the aluminum pin fin heat sink container, which is chosen for its high thermal conductivity. The effects of different geometrical parameters, including number, thickness and height of fins, on performance are analyzed. Different aspects for heat transfer calculation, including the volume expansion in phase transition as well as natural convection in a fluid zone, are considered in the study. In order to validate the numerical model, previous experimental data and the present results are compared, and an acceptable agreement between these two is observed. Results show that increasing the number, thickness and height of fins leads to a significant decrease in the base temperature as well as operating time of the heat sink.

Comparison Between Traditional Microchannels Heat Sinks and Microchannels Heat Sinks Based on Biomimical Tendencies

2008 ◽  
Author(s):  
Carlos A. Rubio-Jimenez ◽  
Abel Hernandez-Guerrero ◽  
Cuauhtemoc Rubio-Arana ◽  
Daniela Popescu
Keyword(s):  
Cross Section ◽  
Heat Sink ◽  
Single Phase ◽  
Electronic Devices ◽  
Circular Cross Section ◽  
Heat Sinks ◽  
Channel Cross Section ◽  
Geometrical Parameters ◽  
High Tendency ◽  
Cooling Fluid

In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many of the studies done before had used single-phase water as cooling fluid in laminar flow. Operating within this regimen, and using water as the cooling fluid, the dissipated heat flux is not enough to keep optimal operational conditions in the electronic devices. Therefore, this work presents a thermal and hydraulic numerical analysis for a microchannel heat sink with circular cross section, fabricated in a silicon substrate. The channel cross section is variable, being a function of the heat sink longitudinal position, decreasing as the cooling fluid passes through the channel. The ratio between the inlet and outlet diameters is given as a function of the Biomimic tendency. These theories are based on the behavior that nature has for the mass transport in circular ducts. The cooling fluid used in this study is water in single-phase. These microchannels heat sink arrangements are based in the operational and geometrical parameters of previous works developed by several authors on microchannels heat sinks with constant and conventional cross sections.

Implementations of Deflectors to Improve the Performance of Heat Sinks

2012 ◽  
Author(s):  
J. P. Ramirez-Vazquez ◽  
A. Hernandez-Guerrero ◽  
J. L. Zuñiga-Cerroblanco ◽  
J. C. Rubio-Arana
Keyword(s):  
Heat Sink ◽  
Numerical Study ◽  
Electronic Devices ◽  
Constant Heat Flux ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Hydrodynamic Behavior ◽  
Constant Heat ◽  
Pin Fin ◽  
Global Performance

This work presents a numerical study of the thermal and hydrodynamic behavior of a pin-fin heat sink where deflectors are placed along the flow of the coolant air; the effect of the arrangement of the fins and deflectors in the global performance of the heat sink is investigated. The fin geometry analyzed is rectangular, and the arrangement of the fins is inline. The heat sink is placed in a channel in which air flows, and a constant heat flux is applied at the bottom wall of the heat sink with values equivalent to the heat fluxes generated by current electronic devices. Deflectors are placed in the top of the channel in order to drive the air flow into the front and end of the heat sink. The results for the Nusselt number and for the pressure drop along the heat sink are reported. The best dimension of deflectors and pitch for the arrangement based on the thermal and hydraulic performance is attained.

scholarly journals Experimental study on heat transfer performance of variable area straight fin heat sinks with PCM

2021 ◽  
pp. 299-299
Author(s):  
Rajasekaran Madhaiyan ◽  
Kannan Thannir Pandal Palayam Kandasamy ◽  
Kumaragurubaran Balasubramanian ◽  
Mohan Raman
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Transfer Performance ◽  
Electronics Cooling ◽  
Reynolds Numbers ◽  
Heat Sinks ◽  
Base Temperature ◽  
Pin Fin ◽  
Constant Area

The thermal performance of heat sinks with variable area straight fins with and without PCM is quantitatively explored in this article. The effects of diverse fin geometries (constant area straight fin, variable area straight fin, circular pin fin, hemispherical pin fin, and elliptical pin fin), varying Reynolds numbers, and fin densities on boosting electronics cooling performance were investigated. The goal of this research is to develop the best fin geometry for electronics cooling technologies. This research demonstrates that altering fin density can improve heat sink thermal performance while also reducing heat sink weight. The base temperature of the heat sink is found to be lower in variable area straight fins. In comparison to alternative configurations for heat transfer with PCM, the results show that variable area straight fin heat sinks are the most effective. The thermal resistance of the improved heat sink with variable fin density was reduced by 9%.

Hydoroil-Based Micro Pin Fin Heat Sink

2006 ◽  
Author(s):  
Ali Kosar ◽  
Chih-Jung Kuo ◽  
Yoav Peles
Keyword(s):  
Heat Sink ◽  
Hydraulic Performance ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Transfer Coefficients ◽  
Pin Fin ◽  
Nusselt Numbers ◽  
Friction Factors ◽  
Pin Fins ◽  
Micro Pin Fins

An experimental study on thermal-hydraulic performance of de-ionized water over a bank of shrouded NACA 66-021 hydrofoil micro pin fins with wetted perimeter of 1030-μm and chord thickness of 100 μm has been performed. Average heat transfer coefficients have been obtained over effective heat fluxes ranging from 4.0 to 308 W/cm2 and mass velocities from 134 to 6600 kg/m2s. The experimental data is reduced to the Nusselt numbers, Reynolds numbers, total thermal resistances, and friction factors in order to determine the thermal-hydraulic performance of the heat sink. It has been found that prodigious hydrodynamic improvement can be obtained with the hydrofoil-based micro pin fin heat sink compared to the circular pin fin device. Fluid flow over pin fin heat sinks comprised from hydrofoils yielded radically lower thermal resistances than circular pin fins for a similar pressure drop.

Pin-Fin Heat Sink With Horizontal Base and Blocked Edges

2008 ◽  
Author(s):  
D. Sahray ◽  
H. Shmueli ◽  
N. Segal ◽  
G. Ziskind ◽  
R. Letan
Keyword(s):  
Heat Transfer ◽  
Free Convection ◽  
Contact Resistance ◽  
Cross Section ◽  
Heat Input ◽  
Heat Sink ◽  
Numerical Study ◽  
Heat Sinks ◽  
Transfer Enhancement ◽  
Pin Fin

In the present work, horizontal-base pin fin heat sinks exposed to free convection in air are studied. They are made of aluminum, and there is no contact resistance between the base and the fins. For the same base dimensions the fin height and pitch vary. The fins have a constant square cross-section. The edges of the sink are blocked: the surrounding insulation is flush with the fin tips. The effect of fin height and pitch on the performance of the sink is studied experimentally and numerically. In the experiments, the heat sinks are heated using foil electrical heaters. The heat input is set, and temperatures of the base and fins are measured. In the corresponding numerical study, the sinks and their environment are modeled using the Fluent 6 software. The results show that heat transfer enhancement due to the fins is not monotonic. The differences between sparsely and densely populated sinks are analyzed for various fin heights. Also assessed are effects of the blocked edges as compared to the previously studied cases where the sink edges were exposed to the surroundings.

scholarly journals Cooling Performance of Heat Sinks Used in Electronic Devices

2018 ◽  
Vol 171 ◽  
pp. 02003
Author(s):  
Ibrahim Mjallal ◽  
Hussein Farhat ◽  
Mohammad Hammoud ◽  
Samer Ali ◽  
Ali AL Shaer ◽  
...  
Keyword(s):  
Heat Sink ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Electronic Cooling ◽  
Heat Sinks ◽  
Passive Cooling ◽  
Short Term ◽  
Cooling Systems ◽  
Thermal Output ◽  
Electrical Devices

Existing passive cooling solutions limit the short-term thermal output of systems, thereby either limiting instantaneous performance or requiring active cooling solutions. As the temperature of the electronic devices increases, their failure rate increases. That’s why electrical devices should be cooled. Conventional electronic cooling systems usually consist of a metal heat sink coupled to a fan. This paper compares the heat distribution on a heat sink relative to different heat fluxes produced by electronic chips. The benefit of adding a fan is also investigated when high levels of heat generation are expected.

Study on the Factors Influencing Spreading Resistance of Heat Sinks

2011 ◽  
Vol 301-303 ◽  
pp. 165-169
Author(s):  
Da Yong Gao ◽  
Jian Xin Zhang ◽  
Ping Juan Niu
Keyword(s):  
Heat Source ◽  
Heat Sink ◽  
Electronic Devices ◽  
Great Influence ◽  
Base Plate ◽  
Critical Value ◽  
Area Ratio ◽  
Heat Sinks ◽  
Spreading Resistance ◽  
Factors Influencing

The spreading resistance is a very important parameter in the applications of heat sink. The design of electronic devices will fail without considering the influence of the spreading resistance. In this paper, a simple thermal model was simulated by Computational Fluid Dynamics software. Some factors, which have great influence on the spreading resistance, have been analyzed. The spreading resistance decreases significantly with the increasing of the area ratio between the heat source and the base-plate. While the ratio being 1, the spreading resistance reaches the mix value. The greater the thermal conductivity of heat sink, the lower the spreading resistance. With the increasing of the thickness of base-plate, the spreading resistance reduces. However, if the thickness exceeds the critical value, the spreading resistance will increase. And the spreading resistance reaches the mix value while the centers of heat source and the base-plate are overlapped.

Performance Comparison of Microchannel Heat Sink Using Boron-Based Ceramic Materials

2021 ◽  
Vol 1163 ◽  
pp. 73-88
Author(s):  
Md Tanbir Sarowar
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Sink ◽  
Electronic Devices ◽  
Ceramic Materials ◽  
Substrate Material ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Microchannel Heat Sink ◽  
Small Surface

Microchannel heat sink plays a vital role in removing a considerable amount of heat flux from a small surface area from different electronic devices. In recent times, the rapid development of electronic devices requires the improvement of these heat sinks to a greater extent. In this aspect, the selection of appropriate substrate materials of the heat sinks is of vital importance. In this paper, three boron-based ultra-high temperature ceramic materials (ZrB2, TiB2, and HfB2) are compared as a substrate material for the microchannel heat sink using a numerical approach. The fluid flow and heat transfer are analyzed using the finite volume method. The results showed that the maximum temperature of the heat source didn’t exceed 355K at 3.6MWm-2 for any material. The results also indicated HfB2 and TiB2 to be more useful as a substrate material than ZrB2. By applying 3.6 MWm-2 heat flux at the source, the maximum obtained surface heat transfer coefficient was 175.2 KWm-2K-1 in a heat sink having substrate material HfB2.

Thermally Optimum Natural Convection Cooled Longitudinal-Plate Heat Sinks With Horizontal Base Plates

2001 ◽  
Author(s):  
K. K. Sikka ◽  
C. George
Keyword(s):  
Natural Convection ◽  
Heat Sink ◽  
Base Plate ◽  
Heat Sinks ◽  
Geometrical Parameters ◽  
Plate Heat ◽  
Horizontal Orientation ◽  
Fin Spacing ◽  
Base Plates ◽  
Weakly Dependent

Abstract Longitudinal-plate fin heat sinks are optimized under natural convection conditions for the horizontal orientation of the heat sink base plate. The thermal performance of the heat sinks is numerically modeled. The fin height, thickness and spacing and heat sink width are systematically varied. The numerical results are validated by experimentation. Results show that the thermal resistance of a heat sink minimizes for a certain number of fins on the base plate. The fin spacing-to-length ratio at which the minimum occurs is weakly dependent on the fin height and thickness and heat sink width. The flow fields reveal that the minimum occurs for the heat sink geometry in which the number of fins are maximized such that the flow velocity as the air exits the fins is fully developed. A correlation of the heat transfer with the heat sink geometrical parameters is also developed.

Relating Semiconductor Heat Sink Local and Non-Local Experimental and Simulation Data to Upper Scale Design Goals

2001 ◽  
Author(s):  
V. S. Travkin
Keyword(s):  
Heat Sink ◽  
Solid Phase ◽  
Physical Characteristics ◽  
Heat Sinks ◽  
Maximum Temperature ◽  
Pin Fin ◽  
Three Samples ◽  
Non Local ◽  
Scale Design ◽  
Research And Design

Abstract The primary difficulty in semiconductor heat sink (and many other types of heat exchangers) research and design is not a lack of interest or money, but rather confusion with what being looked for and adequacy of the tools used for the search. As recently shown, there are few meaningful parameters (apart from sizes and weight) or physical characteristics of interest in semiconductor cooler design are local values. Even the maximum temperature of the base Tmax or semiconductor temperature are not local. In this work outlined the description in detail of arguments on how, and for what reasons, the measured data are to be simulated or measured and represented in a way that allows design goals to be formulated primarily with bulk physical characteristics. We demonstrate why studies of only averaged local integrated variables are not enough. Four sample semiconductor heat sinks of two morphologies (three samples of round pin fin and one sample of longitudinal rib fin sinks) were studied by different techniques and models. There were changes in by-pass values, external heat flux and flow rate. The results are depicted with using new parameters that better represent the needs of a design process as well as the usual parameters used in the past. Characteristics reported are the heat transfer rate in solid phase, relative fin effectiveness, and influence of only morphology features among others. Some suggestions for heat sink design are discussed.

Sign in / Sign up

Export Citation Format

Share Document