Extraction of Average Interface Trap Density using Capacitance-Voltage Characteristic at SiGe p-FinFET and Verification using Terman's Method

Author(s):  
Hyunsoo Kim ◽  
Youngsoo Seo ◽  
Hyungcheol Shin
Coatings ◽  
2021 ◽  
Vol 11 (9) ◽  
pp. 1135
Author(s):  
Dong-Ho Lee ◽  
Dae-Hwan Kim ◽  
Hwan-Seok Jeong ◽  
Seong-Hyun Hwang ◽  
Sunhee Lee ◽  
...  

The interface and bulk trap densities were separately extracted from self-aligned top-gate (SA-TG) coplanar indium gallium zinc oxide (IGZO) thin-film transistors (TFTs) using the low-frequency capacitance–voltage (C–V) characteristics and space-charge-limited current (SCLC) under the flat-band condition. In the method based on the C–V curve, the energy distribution of the interface trap density was extracted using the low-frequency C–V characteristics, and that of the bulk trap density was obtained by subtracting the density of interface trap states from the total subgap density of states (DOS) at each energy level. In the SCLC-based method, the energy distribution of the bulk trap density was extracted using the SCLC under the flat-band condition at high drain-to-source voltages, and that of the interface trap density was obtained by subtracting the density of bulk trap components from the total subgap DOS at each energy level. In our experiments, the two characterization techniques provided very similar interface and bulk trap densities and showed that approximately 60% of the subgap states originate from the IGZO/SiO2 interface at the conduction band edge in the fabricated IGZO TFTs, although the two characterization techniques are based on different measurement data. The results of this study confirm the validity of the characterization techniques proposed to separately extract the interface and bulk trap densities in IGZO TFTs. Furthermore, these results show that it is important to reduce the density of interface trap states to improve the electrical performance and stability of fabricated SA-TG coplanar IGZO TFTs.


1987 ◽  
Vol 93 ◽  
Author(s):  
David J. Dumin ◽  
E. R. Fossum ◽  
S. S. Todorov

ABSTRACTA comparison of the current-voltage (I-V) and the capacitance-voltage (C-V) characteristics of thermal and low temperature ion beam grown films of silicon oxide was made. The oxides were in the thickness range between 5 nm and 10 nm. The ion beam oxides were grown at room temperature. The bulk resistivities of the thermal oxides were about 1017 ohm cm and were about 5 orders of magnitude lower for the ion beam oxides. The interface charge densities at the Si-SiO2 interface were about an order of magnitude higher in the case of the ion beam oxides. The oxide properties were also measured after current stressing at constant voltages. The thermal oxides showed an increase in the interface trap density at the Si-SiO2 interface after stressing with a distinct trap appearing above mid-gap. The ion beam oxides showed very little increase in the interface trap density after stressing. The higher conductivity of the ion beam oxides may have lead to discharging of the interface traps generated during stressing.


2020 ◽  
Vol 13 (11) ◽  
pp. 111006
Author(s):  
Li-Chuan Sun ◽  
Chih-Yang Lin ◽  
Po-Hsun Chen ◽  
Tsung-Ming Tsai ◽  
Kuan-Ju Zhou ◽  
...  

2007 ◽  
Vol 28 (3) ◽  
pp. 232-234 ◽  
Author(s):  
G. Kapila ◽  
B. Kaczer ◽  
A. Nackaerts ◽  
N. Collaert ◽  
G. V. Groeseneken

2008 ◽  
Vol 55 (2) ◽  
pp. 547-556 ◽  
Author(s):  
Koen Martens ◽  
Chi On Chui ◽  
Guy Brammertz ◽  
Brice De Jaeger ◽  
Duygu Kuzum ◽  
...  

2014 ◽  
Vol 104 (13) ◽  
pp. 131605 ◽  
Author(s):  
Thenappan Chidambaram ◽  
Dmitry Veksler ◽  
Shailesh Madisetti ◽  
Andrew Greene ◽  
Michael Yakimov ◽  
...  

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