Influence of ZnO nanoparticle addition on interfacial intermetallic compound evolution in Sn-3.0Ag-0.5Cu solder joints

2019 ◽  
Vol 58 (SH) ◽  
pp. SHHA03
Author(s):  
Min Qu ◽  
Tianze Cao ◽  
Yan Cui ◽  
Fengbin Liu
Keyword(s):  
Intermetallic Compound ◽  
Solder Joints ◽  
Zno Nanoparticle ◽  
Interfacial Intermetallic Compound

Effect of Ni concentration on solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu substrates

2019 ◽  
Vol 33 (01) ◽  
pp. 1850425 ◽  
Author(s):  
Hongming Cai ◽  
Yang Liu ◽  
Shengli Li ◽  
Hao Zhang ◽  
Fenglian Sun ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Diffusion Barrier ◽  
Graphene Layer ◽  
Solder Joints ◽  
Cu Substrate ◽  
Ni Content ◽  
Increasing Trend ◽  
Cu Substrates ◽  
Interfacial Intermetallic Compound ◽  
Positive Effect

In this paper, solderability, microstructure and hardness of SAC0705-xNi solder joints on Cu and graphene-coated Cu (G-Cu) substrates were studied. As Ni content increases in the solder, the solderability improves gradually on both the Cu and G-Cu substrates. The solderability of SAC0705-xNi is better on G-Cu substrate than that on Cu substrate. The increasing Ni content in the solder has a positive effect on the microstructure refinement of both the kinds of substrates. Such effect is more significant on G-Cu substrate than that on Cu substrate. With the increase of Ni content, the thickness of the interfacial intermetallic compound (IMC) shows an increasing trend first and then decreasing trend on the two kinds of substrates. Since the graphene layer works as a diffusion barrier, the IMC on G-Cu is thinner than that on Cu substrate. The addition of Ni leads to the strengthening of the microstructure and thus increases the hardness of the solder bulks.

Influence of interfacial intermetallic compound on fracture behavior of solder joints

2003 ◽  
Vol 358 (1-2) ◽  
pp. 134-141 ◽  
Author(s):  
Hwa-Teng Lee ◽  
Ming-Hung Chen ◽  
Huei-Mei Jao ◽  
Tain-Long Liao
Keyword(s):  
Intermetallic Compound ◽  
Fracture Behavior ◽  
Solder Joints ◽  
Interfacial Intermetallic Compound
Sign in / Sign up

Export Citation Format

Share Document