An energy efficient and high speed architecture for convolution computing based on binary resistive random access memory

2018 ◽  
Vol 57 (4S) ◽  
pp. 04FE05
Author(s):  
Chen Liu ◽  
Runze Han ◽  
Zheng Zhou ◽  
Peng Huang ◽  
Lifeng Liu ◽  
...  
2013 ◽  
Vol 685 ◽  
pp. 372-377 ◽  
Author(s):  
Wen Wen Qiu ◽  
Hong Deng ◽  
Mi Li ◽  
Min Wei ◽  
Xue Ran Deng ◽  
...  

Resistive random access memory (RRAM) has attracted comprehensive attention from academia and industry as a new-type of nonvolatile memory. This memory has many advantages, such as high-speed, low power consumption, simple structure, high-density integration, etc. Therefore, it has a strong potential to replace DRAM. This paper summarizes the recent progress of the studies on RRAM. Although the achievement obtained has been summarized, there is still a long way from the real application. We also discuss the principle and related properties of RRAM and forecast the preparation trends of RRAM


2020 ◽  
Vol 12 (2) ◽  
pp. 02008-1-02008-4
Author(s):  
Pramod J. Patil ◽  
◽  
Namita A. Ahir ◽  
Suhas Yadav ◽  
Chetan C. Revadekar ◽  
...  

Nanomaterials ◽  
2021 ◽  
Vol 11 (6) ◽  
pp. 1401
Author(s):  
Te Jui Yen ◽  
Albert Chin ◽  
Vladimir Gritsenko

Large device variation is a fundamental challenge for resistive random access memory (RRAM) array circuit. Improved device-to-device distributions of set and reset voltages in a SiNx RRAM device is realized via arsenic ion (As+) implantation. Besides, the As+-implanted SiNx RRAM device exhibits much tighter cycle-to-cycle distribution than the nonimplanted device. The As+-implanted SiNx device further exhibits excellent performance, which shows high stability and a large 1.73 × 103 resistance window at 85 °C retention for 104 s, and a large 103 resistance window after 105 cycles of the pulsed endurance test. The current–voltage characteristics of high- and low-resistance states were both analyzed as space-charge-limited conduction mechanism. From the simulated defect distribution in the SiNx layer, a microscopic model was established, and the formation and rupture of defect-conductive paths were proposed for the resistance switching behavior. Therefore, the reason for such high device performance can be attributed to the sufficient defects created by As+ implantation that leads to low forming and operation power.


2020 ◽  
Vol 128 (21) ◽  
pp. 215702
Author(s):  
Yuehua Dai ◽  
Jianhua Gao ◽  
Lihua Huang ◽  
Renjie Ding ◽  
Peng Wang ◽  
...  

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