scholarly journals Implementation of Pads Re-layout for QFN Multi-row Breakthrough

2020 ◽  
pp. 20-24
Author(s):  
R. Rodriguez ◽  
F. R. Gomez ◽  
M. G. Maming
Keyword(s):  
Cost Saving ◽  
Input Output ◽  
Alternative Design ◽  
The Wire ◽  
Augmented Design ◽  
Electrical Connections

An alternative design of Quad-Flat No-lead (QFN) leadframe capable with three or more arrays of lead is discussed and presented on this paper. The leadframe design is integrated with connecting bars that can be routed and bonded with wires to decrease the wire span and create a more manufacturable wirebonding structure in densified design of QFN. In addition, the connecting bars produced an inter-connection link between relocated pads and extended input/output (I/O) leads for the 3rd array electrical connections. The implementation of the proposed augmented design would improve the manufacturability of multiple arrays of I/O in QFN, enabling cost-saving initiative and manufacturing solution to devices with multiple arrays requirement.

scholarly journals Analysis of a Fire Case Caused by Heat Generation due to Cu2O Breeding

2020 ◽  
Vol 34 (2) ◽  
pp. 54-63
Author(s):  
Jin-Young Park ◽  
Eui-Pyeong Lee
Keyword(s):  
Heat Generation ◽  
3D Ct ◽  
Fire Statistics ◽  
Eds Analysis ◽  
The Wire ◽  
Electrical Connections ◽  
Fire Origin

Although fires caused by heat generation due to Cu<sub>2</sub>O breeding in wire connections are well-known among fire investigators, there are few papers on the analysis and introduction of fire cases by heat generation due to Cu<sub>2</sub>O breeding. This study analyzed fire statistics caused by heat generation in electrical connections and the phenomena and features of heat generation due to Cu<sub>2</sub>O breeding. Then, a fire which occurred in the wire connection in a university lab by heat generation due to Cu<sub>2</sub>O breeding was analyzed in more detail. This fire case could reach a conclusion that heat generation due to Cu<sub>2</sub>O breeding caused a fire in the wire connection through the fire pattern investigation of fire origin, the visual investigation of wire connection, 3D CT, power-on-test, and stereoscopic microscopy, SEM and EDS analysis.

Sensor Packaging: New Challenges for New Applications

2010 ◽  
Vol 2010 (1) ◽  
pp. 000687-000694
Author(s):  
Caroline Beelen-Hendrikx ◽  
Coen Tak
Keyword(s):  
Flip Chip ◽  
Flexible Substrate ◽  
Electrical Measurement ◽  
Ph Sensing ◽  
Molding Compound ◽  
Wire Bonds ◽  
The Wire ◽  
New Applications ◽  
Silicon Based ◽  
Electrical Connections

Advantages of silicon-based sensors are compatibility with CMOS, improved robustness and reliability, smaller size and reflow compatibility. Biosensors that use an electrical measurement principle need electrical connections and fluidic access to the die. This only works when the electrical interconnects are kept clean of biofluid and when the package is compatible with the biofluids, receptor chemicals and other sensor elements. In addition, the package needs to be very cheap. A simple plastic overmolded package with a hole in the compound at the sensor location is an effective solution. RFID sensors also need direct die access for gass and pH sensing. They require the integration of processor, memory, clock, battery and antenna. The package format depends on the application. For checking the quality of perishables during transport or in a store, a disposable flexible tag is needed whereas for smart building sensors, a plastic module is more appropriate. For the sensor tag, a flexible substrate and flip chip bare dies are used. Direct die access is realized by an opening in the flex. Battery and antenna are printed on the flex. Automotive sensors that are used under the hood need to cope with very high operating temperatures with peak temperatures of up to 200 °C and they need to be delamination free. The critical points in the standard plastic packages used today are the molding compound and the wire-bonds. Standard packages can be used up to 150 °C. For higher temperatures, the molding compound and the wire-bond interconnect are being improved.

scholarly journals Advanced Semiconductor Design through Specialized Printable Conductive Layer

2020 ◽  
pp. 43-47
Author(s):  
Rennier Rodriguez ◽  
Frederick Ray Gomez ◽  
Maiden Grace Maming
Keyword(s):  
Cost Saving ◽  
Semiconductor Manufacturing ◽  
Semiconductor Device ◽  
Manufacturing Industries ◽  
Conductive Layer ◽  
Fabrication Method ◽  
Input Output ◽  
Stencil Printing ◽  
Specific Approach ◽  
Multiple Input

Semiconductor package miniaturization and thinning have become of particular interest among semiconductor manufacturing industries, with each manufacturing company having specific approach and technical directions in providing unique solutions in their products. The paper provides a specialized design of manufacturing flow for semiconductor device through advanced fabrication method using stencil printing. The advanced process would significantly reduce the carrier thickness for the overall package height configuration of the device. The implementation of the specialized design and process would mitigate common assembly barriers and defects related in producing thin devices, hence, enabling cost-saving realization and manufacturing solution to package thinning and miniaturization with multiple input/output (I/O) requirements.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Microstructural Development in Nb-Ti Multifilamentary Superconductors During Processing

1985 ◽  
Vol 43 ◽  
pp. 190-191
Author(s):  
A. W. West
Keyword(s):  
Heat Treatment ◽  
Critical Current Density ◽  
Copper Matrix ◽  
Wire Drawing ◽  
Heat Treatments ◽  
Microstructural Development ◽  
Final Size ◽  
Density Values ◽  
The Wire ◽  
Multifilamentary Superconductors

The influence of the filament microstructure on the critical current density values, Jc, of Nb-Ti multifilamentary superconducting composites has been well documented. However the development of these microstructures during composite processing is still under investigation.During manufacture, the multifilamentary composite is given several heat treatments interspersed in the wire-drawing schedule. Typically, these heat treatments are for 5 to 80 hours at temperatures between 523 and 573K. A short heat treatment of approximately 3 hours at 573K is usually given to the wire at final size. Originally this heat treatment was given to soften the copper matrix, but recent work has shown that it can markedly change both the Jc value and microstructure of the composite.

Input-Output in Personnel Management

1970 ◽  
Vol 15 (2) ◽  
pp. 115, 118
Author(s):  
WILLIAM E. COLEMAN
Keyword(s):  
Personnel Management ◽  
Input Output
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