scholarly journals Analysis of a Fire Case Caused by Heat Generation due to Cu2O Breeding

2020 ◽  
Vol 34 (2) ◽  
pp. 54-63
Author(s):  
Jin-Young Park ◽  
Eui-Pyeong Lee
Keyword(s):  
Heat Generation ◽  
3D Ct ◽  
Fire Statistics ◽  
Eds Analysis ◽  
The Wire ◽  
Electrical Connections ◽  
Fire Origin

Although fires caused by heat generation due to Cu<sub>2</sub>O breeding in wire connections are well-known among fire investigators, there are few papers on the analysis and introduction of fire cases by heat generation due to Cu<sub>2</sub>O breeding. This study analyzed fire statistics caused by heat generation in electrical connections and the phenomena and features of heat generation due to Cu<sub>2</sub>O breeding. Then, a fire which occurred in the wire connection in a university lab by heat generation due to Cu<sub>2</sub>O breeding was analyzed in more detail. This fire case could reach a conclusion that heat generation due to Cu<sub>2</sub>O breeding caused a fire in the wire connection through the fire pattern investigation of fire origin, the visual investigation of wire connection, 3D CT, power-on-test, and stereoscopic microscopy, SEM and EDS analysis.

Sensor Packaging: New Challenges for New Applications

2010 ◽  
Vol 2010 (1) ◽  
pp. 000687-000694
Author(s):  
Caroline Beelen-Hendrikx ◽  
Coen Tak
Keyword(s):  
Flip Chip ◽  
Flexible Substrate ◽  
Electrical Measurement ◽  
Ph Sensing ◽  
Molding Compound ◽  
Wire Bonds ◽  
The Wire ◽  
New Applications ◽  
Silicon Based ◽  
Electrical Connections

Advantages of silicon-based sensors are compatibility with CMOS, improved robustness and reliability, smaller size and reflow compatibility. Biosensors that use an electrical measurement principle need electrical connections and fluidic access to the die. This only works when the electrical interconnects are kept clean of biofluid and when the package is compatible with the biofluids, receptor chemicals and other sensor elements. In addition, the package needs to be very cheap. A simple plastic overmolded package with a hole in the compound at the sensor location is an effective solution. RFID sensors also need direct die access for gass and pH sensing. They require the integration of processor, memory, clock, battery and antenna. The package format depends on the application. For checking the quality of perishables during transport or in a store, a disposable flexible tag is needed whereas for smart building sensors, a plastic module is more appropriate. For the sensor tag, a flexible substrate and flip chip bare dies are used. Direct die access is realized by an opening in the flex. Battery and antenna are printed on the flex. Automotive sensors that are used under the hood need to cope with very high operating temperatures with peak temperatures of up to 200 °C and they need to be delamination free. The critical points in the standard plastic packages used today are the molding compound and the wire-bonds. Standard packages can be used up to 150 °C. For higher temperatures, the molding compound and the wire-bond interconnect are being improved.

scholarly journals Implementation of Pads Re-layout for QFN Multi-row Breakthrough

2020 ◽  
pp. 20-24
Author(s):  
R. Rodriguez ◽  
F. R. Gomez ◽  
M. G. Maming
Keyword(s):  
Cost Saving ◽  
Input Output ◽  
Alternative Design ◽  
The Wire ◽  
Augmented Design ◽  
Electrical Connections

An alternative design of Quad-Flat No-lead (QFN) leadframe capable with three or more arrays of lead is discussed and presented on this paper. The leadframe design is integrated with connecting bars that can be routed and bonded with wires to decrease the wire span and create a more manufacturable wirebonding structure in densified design of QFN. In addition, the connecting bars produced an inter-connection link between relocated pads and extended input/output (I/O) leads for the 3rd array electrical connections. The implementation of the proposed augmented design would improve the manufacturability of multiple arrays of I/O in QFN, enabling cost-saving initiative and manufacturing solution to devices with multiple arrays requirement.

Scanning Electron Microscopy in Hybrid Microelectronics

1976 ◽  
Vol 34 ◽  
pp. 456-457
Author(s):  
S. Khadpe ◽  
R. Faryniak
Keyword(s):  
Integrated Circuits ◽  
Thick Film ◽  
Integrated Circuit ◽  
Failure Modes ◽  
Three Dimensional ◽  
Circuit Components ◽  
Hybrid Microcircuit ◽  
Electrical Connections ◽  
Scanning Electron

The Scanning Electron Microscope (SEM) is an important tool in Thick Film Hybrid Microcircuits Manufacturing because of its large depth of focus and three dimensional capability. This paper discusses some of the important areas in which the SEM is used to monitor process control and component failure modes during the various stages of manufacture of a typical hybrid microcircuit.Figure 1 shows a thick film hybrid microcircuit used in a Motorola Paging Receiver. The circuit consists of thick film resistors and conductors screened and fired on a ceramic (aluminum oxide) substrate. Two integrated circuit dice are bonded to the conductors by means of conductive epoxy and electrical connections from each integrated circuit to the substrate are made by ultrasonically bonding 1 mil aluminum wires from the die pads to appropriate conductor pads on the substrate. In addition to the integrated circuits and the resistors, the circuit includes seven chip capacitors soldered onto the substrate. Some of the important considerations involved in the selection and reliability aspects of the hybrid circuit components are: (a) the quality of the substrate; (b) the surface structure of the thick film conductors; (c) the metallization characteristics of the integrated circuit; and (d) the quality of the wire bond interconnections.

Microstructural Development in Nb-Ti Multifilamentary Superconductors During Processing

1985 ◽  
Vol 43 ◽  
pp. 190-191
Author(s):  
A. W. West
Keyword(s):  
Heat Treatment ◽  
Critical Current Density ◽  
Copper Matrix ◽  
Wire Drawing ◽  
Heat Treatments ◽  
Microstructural Development ◽  
Final Size ◽  
Density Values ◽  
The Wire ◽  
Multifilamentary Superconductors

The influence of the filament microstructure on the critical current density values, Jc, of Nb-Ti multifilamentary superconducting composites has been well documented. However the development of these microstructures during composite processing is still under investigation.During manufacture, the multifilamentary composite is given several heat treatments interspersed in the wire-drawing schedule. Typically, these heat treatments are for 5 to 80 hours at temperatures between 523 and 573K. A short heat treatment of approximately 3 hours at 573K is usually given to the wire at final size. Originally this heat treatment was given to soften the copper matrix, but recent work has shown that it can markedly change both the Jc value and microstructure of the composite.

A correlation of CL emissions from Penrith sandstone with elemental distributions obtained by simultaneous SEM-CL and EDS analysis

1995 ◽  
Vol 53 ◽  
pp. 392-393
Author(s):  
Paul J. Wright
Keyword(s):  
Optical Microscope ◽  
Electron Gun ◽  
High Electron ◽  
Collection System ◽  
Electron Hole ◽  
Depositional Processes ◽  
Eds Analysis ◽  
Distribution Mapping ◽  
Backscattered Electron ◽  
Electron Imaging

Most industrial and academic geologists are familiar with the beautiful red and orange cathodoluminescence colours produced by carbonate minerals in an optical microscope with a cold cathode electron gun attached. The cement stratigraphies interpreted from colour photographs have been widely used to determine the post depositional processes which have modified sedimentary rock textures.However to study quartzose materials high electron densities and kV's are necessary to stimulate sufficient emission. A scanning electron microscope with an optical collection system and monochromator provides an adequate tool and gives the advantage of providing secondary and backscattered electron imaging as well as elemental analysis and distribution mapping via standard EDS/WDS facilities.It has been known that the incorporation of many elements modify the characteristics of the CL emissions from geological materials. They do this by taking up positions between the valence and conduction band thus providing sites to assist in the recombination of electron hole pairs.

Sampling and analysis of the air-water interface with SEM and EDS of microlayers

1989 ◽  
Vol 47 ◽  
pp. 1004-1005
Author(s):  
Randall W. Smith ◽  
John Dash
Keyword(s):  
Heavy Metals ◽  
Surface Microlayer ◽  
Surface Films ◽  
Water Interface ◽  
Physical Processes ◽  
Infrared Spectroscopic Analysis ◽  
Eds Analysis ◽  
Air Water Interface ◽  
Significant Area ◽  
Bulk Chemical

The structure of the air-water interface forms a boundary layer that involves biological ,chemical geological and physical processes in its formation. Freshwater and sea surface microlayers form at the air-water interface and include a diverse assemblage of organic matter, detritus, microorganisms, plankton and heavy metals. The sampling of microlayers and the examination of components is presently a significant area of study because of the input of anthropogenic materials and their accumulation at the air-water interface. The neustonic organisms present in this environment may be sensitive to the toxic components of these inputs. Hardy reports that over 20 different methods have been developed for sampling of microlayers, primarily for bulk chemical analysis. We report here the examination of microlayer films for the documentation of structure and composition.Baier and Gucinski reported the use of Langmuir-Blogett films obtained on germanium prisms for infrared spectroscopic analysis (IR-ATR) of components. The sampling of microlayers has been done by collecting fi1ms on glass plates and teflon drums, We found that microlayers could be collected on 11 mm glass cover slips by pulling a Langmuir-Blogett film from a surface microlayer. Comparative collections were made on methylcel1ulose filter pads. The films could be air-dried or preserved in Lugol's Iodine Several slicks or surface films were sampled in September, 1987 in Chesapeake Bay, Maryland and in August, 1988 in Sequim Bay, Washington, For glass coverslips the films were air-dried, mounted on SEM pegs, ringed with colloidal silver, and sputter coated with Au-Pd, The Langmuir-Blogett film technique maintained the structure of the microlayer intact for examination, SEM observation and EDS analysis were then used to determine organisms and relative concentrations of heavy metals, using a Link AN 10000 EDS system with an ISI SS40 SEM unit. Typical heavy microlayer films are shown in Figure 3.

Electron-Probe Quantitative Energy-Dispersive Analysis of Trace Magnesium Concentrations in Ag-Mg Alloys

1996 ◽  
Vol 54 ◽  
pp. 510-511
Author(s):  
R. B. Marinenko
Keyword(s):  
Electron Probe ◽  
Energy Dispersive Spectrometry ◽  
Mg Alloys ◽  
Energy Dispersive ◽  
Energy Dispersive Analysis ◽  
High Tc ◽  
Alloy Wire ◽  
High Tc Superconductor ◽  
Eds Analysis ◽  
Superior Mechanical Properties

Internally oxidized Ag-Mg alloys are used as sheaths for high Tc superconductor wires because of their superior mechanical properties. The preparation and characteristics of these materials have been reported. Performance of the sheaths depends on the concentration of the magnesium which generally is less than 0.5 wt. percent. The purpose of this work was to determine whether electron probe microanalysis using energy dispersive spectrometry (EDS) could be used to quantitate three different Ag-Mg alloys. Quantitative EDS analysis can be difficult because the AgL escape peak occurs at the same energy (1.25 keV) as the Mg Kα peak. An EDS spectrum of a Ag-Mg alloy wire is compared to a pure Ag spectrum in Fig. 1.

Heat Generation and Transport in the Earth

2010 ◽  
Author(s):  
Claude Jaupart ◽  
Jean-Claude Mareschal
Keyword(s):  
Heat Generation ◽  
The Earth

Modification of MnS inclusion by tellurium in 38MnVS6 micro-alloyed steel

2020 ◽  
Vol 117 (6) ◽  
pp. 615
Author(s):  
Ping Shen ◽  
Lei Zhou ◽  
Qiankun Yang ◽  
Zhiqi Zeng ◽  
Kenan Ai ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Aspect Ratio ◽  
Strong Influence ◽  
Experimental Results ◽  
Alloyed Steel ◽  
Equivalent Diameter ◽  
Small Aspect Ratio ◽  
Steel Quality ◽  
Eds Analysis ◽  
Micro Alloyed Steel

In 38MnVS6 steel, the morphology of sulfide inclusion has a strong influence on the fatigue life and machinability of the steel. In most cases, the MnS inclusions show strip morphology after rolling, which significantly affects the steel quality. Usually, the MnS inclusion with a spherical morphology is the best morphology for the steel quality. In the present work, tellurium was applied to 38MnVS6 micro-alloyed steel to control the MnS inclusion. Trace tellurium was added into 38MnVS6 steel and the effect of Te on the morphology, composition, size and distribution of MnS inclusions were investigated. Experimental results show that with the increase of Te content, the equivalent diameter and the aspect ratio of inclusion decrease strikingly, and the number of inclusions with small aspect ratio increases. The inclusions are dissociated and spherized. The SEM-EDS analysis indicates that the trace Te mainly dissolves in MnS inclusion. Once the MnS is saturated with Te, MnTe starts to generate and wraps MnS. The critical Te/S value for the formation of MnTe in the 38MnV6 steel is determined to be approximately 0.075. With the increase of Te/S ratio, the aspect ratio of MnS inclusion decreases and gradually reaches a constant level. The Te/S value in the 38MnVS6 steel corresponding to the change of aspect ratio from decreasing to constant ranges from 0.096 to 0.255. This is most likely to be caused by the saturation of Te in the MnS inclusion. After adding Te in the steel, rod-like MnS inclusion is modified to small inclusion and the smaller the MnS inclusion, the lower the aspect ratio.

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