Flux Shorting Mitigation on Semiconductor BGA Device through Process Design Enhancement

2020 ◽  
pp. 1-5
Author(s):  
Antonio R. Sumagpang Jr. ◽  
Edwin M. Graycochea Jr. ◽  
Frederick Ray I. Gomez
Keyword(s):  
Process Improvement ◽  
Process Design ◽  
Semiconductor Industry ◽  
Ball Grid Array ◽  
Better Than

With the new and upcoming technologies in semiconductor industry, packages like the ball grid array (BGA) are getting more challenging to process due to inherent issues that come along. Process improvement through modification in the design of indirect material is one key direction to improve the productivity during assembly manufacturing. In this paper, an enhanced design of dipping plate is presented to solve the issue of flux shorting due to out-of-specs dipping plate at ball attach process. The study used a side by side comparison to prove that the new design  is better than that of the out-of-specs indirect material. With the new enhanced design of  dipping plate and the optimized flux depth parameter, flux shorting occurrence was successfully mitigated.

scholarly journals Die Crack Resolution through Pick-up Process Optimization for BGA Package

2021 ◽  
pp. 32-36
Author(s):  
R. Rodriguez ◽  
E. Graycochea Jr. ◽  
F. R. Gomez ◽  
E. Manalo
Keyword(s):  
Process Optimization ◽  
Process Improvement ◽  
Parameter Optimization ◽  
New Technologies ◽  
Semiconductor Industry ◽  
Ball Grid Array ◽  
Main Root ◽  
Root Cause ◽  
Die Attach ◽  
Bga Package

With the new devices and new technologies in the semiconductor industry are getting more challenging to process because issues are unavoidable especially on thin dies. The paper is focused on the improvement done on a ball grid array (BGA) substrate package assembly to address the quantity of rejection of die crack during die picking at the die attach process station. High pick force and high needle top height found out during the pick-up process is the main root cause of die crack. Parameter optimization particularly for die picking with the combination of pick force and needle top height parameter was done to eliminate this type of issue after the die attaches process. With the die attach process improvement, a reduction of 100 percent of die crack occurrence was successfully achieved. For future works, the improvement and learnings could be used for devices with similar constraints.

scholarly journals Wirebond Process Improvement with Enhanced Stand-off Bias Wire Clamp and Top Plate

2020 ◽  
pp. 1-4
Author(s):  
Jonathan C. Pulido ◽  
Frederick Ray I. Gomez ◽  
Edwin M. Graycochea Jr.
Keyword(s):  
Process Improvement ◽  
Semiconductor Industry ◽  
Plate Design ◽  
Standard Configuration ◽  
Ppm Level ◽  
Better Than

New design for a certain issue in semiconductor industry is another way to modify the standard configuration into specified limit or to make a possible solution of the problem.  This paper presents a new modified design for wirebond top plate with a bias platform structure that will maintain a consistent second bond into a leadframe leads with half-etch configuration on quad-flat no-leads (QFN) packages especially in wirebond process. This paper used a side by side comparison to proof that the new design is better than the older design.  With the new specialized wire clamp and top plate design, parts per million (PPM) level performances is improved by almost 90%.

scholarly journals Overall Equipment Efficiency (OEE) Enhancement in Manufacture of Electronic Components & Boards Industry through Total Productive Maintenance Practices

2018 ◽  
Vol 150 ◽  
pp. 05037 ◽  
Author(s):  
Soo-Fen Fam ◽  
Ser Lee Loh ◽  
M. Haslinda ◽  
Heri Yanto ◽  
Linda Mei Sui Khoo ◽  
...  
Keyword(s):  
Semiconductor Industry ◽  
Primary Data ◽  
Global Competition ◽  
Maintenance Strategy ◽  
Electronic Components ◽  
Total Productive Maintenance ◽  
Die Attach ◽  
Effectiveness And Efficiency ◽  
The Impact ◽  
Better Than

In an environment of intense global competition, both creative and proven strategies need to be considered in order to bring about the effectiveness and efficiency in manufacturing operation. Total Productive Maintenance (TPM) is one of the effective maintenance strategy in enhancing the equipment effectiveness and to achieve a significant competitive advantage. This research paper addresses the impact of three TPM pillars namely planned maintenance (PM), autonomous maintenance (AM) and focused maintenance (FM) on overall equipment effectiveness (OEE) of die attach equipment in the production line of semiconductor industry. The effect of TPM on the OEE is also investigated depending on the equipment types, in where die attach process consist of two models-CANON and ESEC. The primary data was collected from an organization's database and was analysed by SPSS V23. The preliminary results of the analysis showed that the performance of OEE in ESEC is better than the CANON after the implementation of TPM. The analysis also showed that out of the three TPM practices deployed, planned maintenance of equipment by production and maintenance team played the biggest role in increasing the equipment effectiveness. In conclusion, this study provides insights the importance of implementing TPM in order to succeed in a highly demanding market arena.

Simulation and Ergonomics Approach for Service & Manufacturing Process Improvement

2012 ◽  
Vol 502 ◽  
pp. 121-125 ◽  
Author(s):  
A. Sánchez-Lite ◽  
M. García-García
Keyword(s):  
Process Improvement ◽  
Process Design ◽  
Human Factor ◽  
Process Development ◽  
3D Design ◽  
Simulation Tools ◽  
Work Related ◽  
Work Related Musculoskeletal Disorders ◽  
And Control ◽  
Detection Evaluation

The human factor is a key variable in the efficiency of the product-process development system. The ability to be able to predict the influence of this factor in the process is a significant challenge in manufacturing engineering, as well as the consequences that the process designed has on this factor. All ergonomic considerations have traditionally been evaluated without using 3D product design. Nowadays, 3D process design technologies and simulation tools allow us the opportunity from the earliest stages of the design process. They can also be used to improve current processes in order to increase human comfort, productivity and safety. This paper describes a methodology using 3D design and simulation tools to improve industrial and service processes. This methodology has as an objective the detection, evaluation and control of work-related musculoskeletal disorders (WMSDs).

Reliability Analysis of Aging in Joint Microstructures for Sn-Ag-Cu Solder Joints During Thermal Cycling

2015 ◽  
Author(s):  
Chaobo Shen ◽  
Zhou Hai ◽  
Cong Zhao ◽  
Jiawei Zhang ◽  
M. J. Bozack ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Test Results ◽  
Continuous Growth ◽  
Relative Fraction ◽  
Fatigue Failures ◽  
Joint Microstructures ◽  
Better Than

This study illustrates test results and comparative literature data on the influence of isothermal aging and thermal cycling associated with Sn-1.0Ag-0.5Cu (SAC105) and Sn-3.0Ag-0.5Cu (SAC305) ball grid array (BGA) solder joints on three board finishes (ImAg, ENIG, ENEPIG). The resulting degradation shows that the characteristic lifetimes for both SAC105 and SAC305 decrease in the order ENIG > ENEPIG > ImAg. SAC305, with a higher relative fraction of Ag3Sn IMC within the solder, performs better than SAC105. SEM and EDX analysis shows continuous growth of Cu-Sn intermetallic compounds (IMC) on SAC/ImAg systems and Cu-Ni-Sn IMC on SAC/ENIG/ENEPIG systems at board side solder joints, which eventually cause fatigue failures.

Selection and design of ionic liquids as solvents in extractive distillation and extraction processes

2015 ◽  
Vol 69 (2) ◽  
Author(s):  
Boelo Schuur
Keyword(s):  
Ionic Liquids ◽  
Process Design ◽  
Extractive Distillation ◽  
Industrial Practice ◽  
The Past ◽  
Aqueous Streams ◽  
Extraction Processes ◽  
Conceptual Process Design ◽  
Industrial Adoption ◽  
Better Than

AbstractSince the late 1990’s there has been a tremendous growth in literature on ionic liquids (ILs) for a broad range of applications, i.e. catalysis, electrolytes for batteries, in solvolysis of biomass, and also in separation technology. ILs can be applied as solvents for absorption (e.g. of CO2), extractive distillation and extraction processes. That ILs are not magic solvents but have their limitations has also become evident during the past years. Especially the high costs associated with ILs and the lack of experience with these materials in the industrial practice are factors limiting industrial adoption of ILs. The often praised versatility of properties that can be achieved through combination of different cations and anions generates a huge amount of options and makes it difficult to decide where to start when selecting/designing a solvent. This paper focuses on solvent selection/design for applications in extractive distillations and liquid-liquid extractions; also, solvent performance in several specific case studies taken from the open literature is discussed. Important recommendations include: a) make a conceptual process design including the recovery step, regeneration of the IL may be a critical parameter; b) if extractions from aqueous streams are studied, the uptake of water by the IL is an important factor because such co-extracted water is evaporated during the regeneration; c) compare the process with conventional processes to check whether it performs better than the state-of-the-art in industry.

Measurement Techniques for Thermally Induced Warpage to Predict Ball-Grid Array Package-on-Package Solder Compatibility

2006 ◽  
Author(s):  
Thomas B. Davis ◽  
Mike Morrison ◽  
Thomas Krawzak ◽  
Jeff Reeder ◽  
Tom Jiang
Keyword(s):  
Semiconductor Industry ◽  
Measurement Techniques ◽  
Numerical Data ◽  
Ball Grid Array ◽  
Element Analysis ◽  
Thermally Induced ◽  
Design Changes ◽  
Ball Grid Array Package ◽  
Collection Methods

Abstract The semiconductor industry is recognizing an increasing need to define the compatibility of various products joined in package-on-package configuration by solder reflow. Within the scope of the application, this paper discusses: sample preparation; warpage data collection methods; extraction of usable images and numerical data from the measurements; creation of visual warpage patterns for the top and bottom components of stacked package sets; mathematical determination of variation or separation of parts at critical locations during reflow; and finite element analysis of parts and processes to understand and predict reactions to design changes.

Sign in / Sign up

Export Citation Format

Share Document