defective area
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2021 ◽  
Vol 2021 ◽  
pp. 1-7
Author(s):  
Jian Li ◽  
Liping Xu ◽  
Xiaowen Yu ◽  
Jianjun Peng ◽  
Lei Huang

The coin-tap method performs nondestructive testing by measuring the width of the tapping response pulse on the surface of the material. Existing studies have shown that defects in the material will cause the width of the tapping response pulse to increase. However, experiments have confirmed that different detection positions in the defective area will show different values of the width of the tapping response pulse, and the physical laws behind it have not been studied yet. To discuss its physical meaning, a mathematical model of the defective area is established, a method for calculating the width of the tapping response pulse is proposed, and a composite honeycomb structure with preset defects is used for data testing. Both the test results and the calculation results show that the pulse width of the tapping response will decrease with the increase of the defect depth and the deviation of the tapping position from the defect center. The consistency between the calculated results and the experimental results shows that the established defect model and pulse width calculation method can better explain the distribution law of the pulse width of the tapping response in the defective area.



2021 ◽  
Vol 7 ◽  
pp. 19-27
Author(s):  
Ю.Л. Николаев ◽  
П.Н. Шкатов ◽  
Э.Ф. Ахметшина ◽  
А.А. Саморуков

Theoretical and experimental researches of vibration-induction transducer (VIT) outlet signal formed during exposure to normal leakage magnetic field intensity component Hn over the defective area were carried out. Theoretical research is based on an assumption that VIT signal is a trigonometric series that is limited by first five harmonics. As initial data for mathematical model creation, well-known conformities for Hn distribution over the defective area were used. Based on acquired mathematical model conformities of VIT signal harmonical composition permutation during its movement over the defective area with varying amplitudes and vibration frequency were found. Theoretical research results were proven experimentally. Moreover, additional possibilities of this way of magnetic testing are shown in comparison with conventional ones.



Author(s):  
Rommel Estores ◽  
Stefaan Verleye

Abstract In this paper the authors will discuss an application of Single Shot Logic (SSL) patterns used for further localizing IDDQ failures using ATPG constraints and targeted faults. This new method provides the analyst a possibility of performing circuit analysis using IDDQ measurement results as a pass/fail criterion rather than logic mismatches. Once a defective area was partially isolated through fault localization, SSL patterns were created to control individual internal node logic states in a deterministic way. IDDQ was measured at each SSL iteration where schematic analysis can further isolate the failure to a specific location. Two case studies will be discussed to show how this technique was used on actual failing units, with detailed explanation of the steps performed that led to a more precise determination of the fault location in the suspect cell.



2019 ◽  
Vol 2 (1) ◽  
pp. 01-03
Author(s):  
Rhys Payne ◽  
Aaron Rudi

Decompressive craniectomy is widely used for treating patients with traumatic brain injury (TBI). Usually patients have dura mater defect due to surgery or injury itself. The defective area may left open or repaired by artificial dura substitutes. A variety of artificial dura substitutes have been used for this purpose.



2018 ◽  
Vol 73 (11) ◽  
pp. 1644-1649 ◽  
Author(s):  
Wang Jiangfei ◽  
Yuan Lihua ◽  
Zhu Zhengguang ◽  
Yuan Mingyuan


2018 ◽  
Author(s):  
Rommel Estores ◽  
Eric Barbian

Abstract ATPG diagnosis is an essential part in failure analysis and is proven to be an effective technique in isolating faults in the digital core. In many single failure cases however, ATPG diagnosis could yield either incorrect candidates or includes a large amount of equivalency which limits diagnostic resolution. While iterative ATPG diagnosis improves diagnostic resolution, there are many cases where the resolution is still insufficient. This paper will discuss a methodology that helps the analyst understand and complement ATPG diagnosis by using an approach called “single shot logic patterns”. New patterns that each target one singular fault in the area of interest provide the failure analyst with simplified analytical data. This process is repeated for each suspect candidate. The number of times a target fault is detected is increased for better resolution. Aggregating this analytical data with the layout and fan out of the net instances could provide greater resolution into the likely defective area. Furthermore, adding constraints can also be used to further simplify the test and/or control the fan out of failures. Only equivalencies where there is observable fan out can achieve greater diagnostic resolution. ATPG tools have been observed to not always maximize this fan out.



2017 ◽  
Vol 270 ◽  
pp. 142-146
Author(s):  
Lucia Hrabčáková ◽  
Alicia Mašlejová

The surface line type defects on the can twist-off lids from lacquered tinplate material have been analyzed. The analyzed defects manifested themselves like the lines bulged above the surrounding surface. They were aligned roughly perpendicular to the lid circumference; they were mostly arranged on the lower part of lid circumference edge. The defects surface was fully covered by lacquer layer. After lacquer layer removal it was visible in the defective area that tin layer was damaged on some defect areas. The defect presented itself like filiform corrosion which occurred in conditions slightly above room temperature and high humidity under the originally continuous covering layer. According to the findings, corrosion occurred on the hidden sheet cut edges and then propagated first perpendicular to the circumference into the sheet. Then sometimes its direction changed into the sheet rolling direction along the lines with less but still suitable tin layer thickness. This defect can be controlled by special protecting of lid cut edge against corrosion or decreasing of the temperature and the humidity conditions in the stores.





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