scholarly journals Interfacial Liquid Film Transfer Printing of Versatile Flexible Electronic Devices with High Yield Ratio

2021 ◽  
pp. 2100287
Author(s):  
Yihao Chen ◽  
Xin Liu ◽  
Yinji Ma ◽  
Ying Chen ◽  
Bingwei Lu ◽  
...  
Author(s):  
Ashante’ Allen ◽  
Andrew Cannon ◽  
William King ◽  
Samuel Graham

The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing [1,2] as well as dry transfer techniques [3–5]. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.


Nanomaterials ◽  
2019 ◽  
Vol 9 (2) ◽  
pp. 283 ◽  
Author(s):  
Honglei Zhou ◽  
Weiyang Qin ◽  
Qingmin Yu ◽  
Huanyu Cheng ◽  
Xudong Yu ◽  
...  

Flexible electronic systems have received increasing attention in the past few decades because of their wide-ranging applications that include the flexible display, eyelike digital camera, skin electronics, and intelligent surgical gloves, among many other health monitoring devices. As one of the most widely used technologies to integrate rigid functional devices with elastomeric substrates for the manufacturing of flexible electronic devices, transfer printing technology has been extensively studied. Though primarily relying on reversible interfacial adhesion, a variety of advanced transfer printing methods have been proposed and demonstrated. In this review, we first summarize the characteristics of a few representative methods of transfer printing. Next, we will introduce successful demonstrations of each method in flexible electronic devices. Moreover, the potential challenges and future development opportunities for transfer printing will then be briefly discussed.


2021 ◽  
pp. 2001662
Author(s):  
Ryo Taguchi ◽  
Norihisa Akamatsu ◽  
Kohei Kuwahara ◽  
Kayoko Tokumitsu ◽  
Yoshiaki Kobayashi ◽  
...  

2018 ◽  
Vol 458 ◽  
pp. 540-545 ◽  
Author(s):  
Chuanlai Ren ◽  
Congbing Tan ◽  
Lunjun Gong ◽  
Mingkai Tang ◽  
Min Liao ◽  
...  

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