Atmospheric Pressure Process for Coating Particles Using Atomic Layer Deposition

2009 ◽  
Vol 15 (7-9) ◽  
pp. 227-233 ◽  
Author(s):  
Renske Beetstra ◽  
Ugo Lafont ◽  
John Nijenhuis ◽  
Erik M. Kelder ◽  
J. Ruud van Ommen
2019 ◽  
Vol 16 (12) ◽  
pp. 1900127 ◽  
Author(s):  
Morteza Aghaee ◽  
Joerie Verheyen ◽  
Alquin A. E. Stevens ◽  
Wilhelmus M. M. Kessels ◽  
Mariadriana Creatore

2020 ◽  
Vol 56 (89) ◽  
pp. 13752-13755
Author(s):  
Nils Boysen ◽  
Bujamin Misimi ◽  
Arbresha Muriqi ◽  
Jan-Lucas Wree ◽  
Tim Hasselmann ◽  
...  

This is the first report on a plasma enhanced spatial atomic layer deposition (APP-ALD) process at atmospheric pressure to grow conducting metallic Cu thin films from a carbene stabilized precursor.


2018 ◽  
Vol 10 (22) ◽  
pp. 19208-19217 ◽  
Author(s):  
Afzal Khan ◽  
Viet Huong Nguyen ◽  
David Muñoz-Rojas ◽  
Sara Aghazadehchors ◽  
Carmen Jiménez ◽  
...  

2016 ◽  
Vol 34 (1) ◽  
pp. 01A114 ◽  
Author(s):  
Lukas Hoffmann ◽  
Detlef Theirich ◽  
Tim Hasselmann ◽  
André Räupke ◽  
Daniel Schlamm ◽  
...  

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