New applications and performance of bioelectrochemical systems

2009 ◽  
Vol 85 (6) ◽  
pp. 1673-1685 ◽  
Author(s):  
Hubertus V. M. Hamelers ◽  
Annemiek Ter Heijne ◽  
Tom H. J. A. Sleutels ◽  
Adriaan W. Jeremiasse ◽  
David P. B. T. B. Strik ◽  
...  
Keyword(s):  
Bioelectrochemical Systems ◽  
And Performance ◽  
New Applications

New Developments in the Plasma Transferred Arc Process

1997 ◽  
Author(s):  
R.J. DuMola ◽  
G.R. Heath
Keyword(s):  
High Performance ◽  
Power Utility ◽  
Small Areas ◽  
Powder Alloys ◽  
Plasma Transferred Arc ◽  
Transferred Arc ◽  
Recent Developments ◽  
Coating Method ◽  
And Performance ◽  
New Applications

Abstract The plasma transferred arc process continues to be the coating method of choice for the application of cobalt base alloys onto valve and valve trim. Although new applications have been developed over the years, the process remains largely associated with the application of high performance, highly alloyed powders for relatively small parts or small areas of large parts. The use of the plasma transferred arc process for large volume application has been limited by the robustness and performance characteristics of the equipment and the use of cobalt. A new plasma transferred arc system (power source, torch and process controller) has been developed which allows the application of powder metal alloys at deposition rates of up to 40 pounds per hour. In addition, there has been a development of new non-cobalt powder alloys with excellent mixed corrosion and wear resistance properties. These capabilities have rendered the process technically and economically viable for large and demanding applications in the mining, power utility and steel industries. The new PTA system and the recent developments in powder alloys will be discussed. Reference will be made to specific applications in target industries.

Thick Film Pastes for Power Applications

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000155-000161
Author(s):  
Christina Modes ◽  
Melanie Bawohl ◽  
Jochen Langer ◽  
Jessica Reitz ◽  
Anja Eisert ◽  
...  
Keyword(s):  
Thick Film ◽  
Electric Vehicles ◽  
Hybrid Electric Vehicles ◽  
Thermal Dissipation ◽  
Automotive Applications ◽  
Electrical Systems ◽  
Electronic Circuitry ◽  
And Performance ◽  
New Applications ◽  
Thick Film Technology

Electronic circuits made by thick film technology are commonly used today in electronic circuitry for automotive applications. Densely packed multi-layer hybrid circuits are very well established for motor and transmission management in standard gasoline fuelled vehicles. As automotive technology shifts from mechanical systems to electrical systems and toward more electrically driven vehicles, such as hybrid electric vehicles and full electric vehicles, thick film systems need to be adapted to fit the challenges and needs of these new applications. The following is a description of a new set of thick film pastes, both precious and base metal, which have attributes and performance suitable for power electronics in automotive applications. The materials provide a means to use common thick film technology to build power circuits to meet the new needs, such as high current carrying capacity and thermal dissipation.

scholarly journals Analysis of co-authorship patterns at the individual level

2014 ◽  
Vol 26 (3) ◽  
pp. 229-238 ◽  
Author(s):  
Wolfgang Glänzel
Keyword(s):  
Research Collaboration ◽  
Citation Impact ◽  
Career Mobility ◽  
Individual Level ◽  
Utmost Care ◽  
Performance Profiles ◽  
And Performance ◽  
The Individual ◽  
New Applications

Publication activity, citation impact and communication patterns, in general, change in the course of a scientist's career. Mobility and radical changes in a scientist's research environment or profile are among the most spectacular factors that have effect on individual collaboration patterns. Although bibliometrics at this level should be applied with the utmost care, characteristic patterns of an individual scientist's research collaboration and changes in these in the course of a career can be well depicted using bibliometric methods. A wide variety of indicators and network tools are chosen to follow up the evolution and to visualise and to quantify collaboration and performance profiles of individual researchers. These methods are, however, designed to supplement expert-opinion based assessment and other qualitative assessments, and should not be used as stand-alone evaluation tools. This study presents part of the results published in an earlier study by Zhang and Glänzel (2012)4 as well as new applications of these methods.

3D Packages and Assembly Methodologies

2011 ◽  
Vol 2011 (1) ◽  
pp. 001074-001078
Author(s):  
Bernd K Appelt
Keyword(s):  
Coming Of Age ◽  
Organic Substrate ◽  
Electrical Performance ◽  
3D Packaging ◽  
Advanced Packaging ◽  
Cte Mismatch ◽  
And Performance ◽  
Application Processor ◽  
Silicon Vias ◽  
New Applications

3D packaging is coming of age. Initially it was conceived to provide more memory in the same space. Memory die were stacked after thinning the die and bonding them on top of each other using conventional, thin die bond adhesive. The interconnect method remained wire bonding. While at first same die were stacked, the functionality was soon expanded by stacking different type of memory and or controllers in the same package. The explosive growth in mobile products and new applications while shrinking the form factor demanded a new packaging concept: the stacking of packages. The bottom package contains typically the application processor while top package holds memory, often stacked as well. Here, interconnects between packages are solder joints. As the demand for functionality and performance continues to grow relentlessly, bandwidth and electrical performance increase again demand more advanced packaging. It appears that silicon interposers, also called 2.5 D, will be the next type of packaging. The silicon interposer acts as a very high density substrate interconnecting die of different functionality. The interposer still requires an organic substrate as a CTE mismatch mitigator to connect to the motherboard. The ultimate step of the packaging technology evolution will be the real 3D package based on die to die interconnects based through silicon vias (TSV) providing the densest levels of interconnects between heterogeneous die and components.

scholarly journals An Approach to Build e-Health IoT Reactive Multi-Services Based on Technologies around Cloud Computing for Elderly Care in Smart City Homes

2021 ◽  
Vol 11 (11) ◽  
pp. 5172
Author(s):  
Luis Jurado Pérez ◽  
Joaquín Salvachúa
Keyword(s):  
Cloud Computing ◽  
Health Services ◽  
Elderly People ◽  
Architectural Design ◽  
Smart Cities ◽  
Elderly Care ◽  
Architectural Patterns ◽  
And Performance ◽  
Care Of Elderly ◽  
New Applications

Although there are e-health systems for the care of elderly people, the reactive characteristics to enhance scalability and extensibility, and the use of this type of system in smart cities, have been little explored. To date, some studies have presented healthcare systems for specific purposes without an explicit approach for the development of health services. Moreover, software engineering is hindered by agile management challenges regarding development and deployment processes of new applications. This paper presents an approach to develop health Internet of Things (IoT) reactive applications that can be widely used in smart cities for the care of elderly individuals. The proposed approach is based on the Rozanski and Woods’s iterative architectural design process, the use of architectural patterns, and the Reactive Manifesto Principles. Furthermore, domain-driven design and the characteristics of the emerging fast data architecture are used to adapt the functionalities of services around the IoT, big data, and cloud computing paradigms. In addition, development and deployment processes are proposed as a set of tasks through DevOps techniques. The approach validation was carried out through the implementation of several e-health services, and various workload experiments were performed to measure scalability and performance in certain parts of the architecture. The system obtained is flexible, scalable, and capable of handling the data flow in near real time. Such features are useful for users who work collaboratively in the care of elderly people. With the accomplishment of these results, one can envision using this approach for building other e-health services.

The Use of Hydrostatic Thrust Bearing in Flow and Temperature Measurements

1975 ◽  
Vol 97 (1) ◽  
pp. 116-120
Author(s):  
S. A. Morsi
Keyword(s):  
Temperature Sensor ◽  
Thrust Bearing ◽  
Temperature Measurements ◽  
Flow Rates ◽  
Pressure Drops ◽  
Small Pressure ◽  
Constant Resistance ◽  
And Performance ◽  
New Applications ◽  
Large Flow

This paper describes two new applications for the hydrostatic thrust bearing. The first application is the use of the bearing, when the gap is fixed, as a linear constant resistance. Several bearings have been connected together in parallel to obtain large flow rates at small pressure drops for use as a flowmeter. The second application is the use of a bearing, when modified, as a temperature sensor. Description and performance of this modified design when used as a temperature sensor are given.

scholarly journals Refining Atmosphere Profiles for Aerial Target Detection Models

Sensors ◽  
2021 ◽  
Vol 21 (21) ◽  
pp. 7067
Author(s):  
Robert Grimming ◽  
Patrick Leslie ◽  
Derek Burrell ◽  
Gerald Holst ◽  
Brian Davis ◽  
...  
Keyword(s):  
System Performance ◽  
High Performance ◽  
Geographic Location ◽  
Weather Conditions ◽  
Atmospheric Composition ◽  
Quality Data ◽  
Average System ◽  
Atmospheric Path ◽  
And Performance ◽  
New Applications

Atmospheric path radiance in the infrared is an extremely important quantity in calculating system performance in certain infrared detection systems. For infrared search and track (IRST) system performance calculations, the path radiance competes with the target for precious detector well electrons. In addition, the radiance differential between the target and the path radiance defines the signal level that must be detected. Long-range, high-performance, offensive IRST system design depends on accurate path radiance predictions. In addition, in new applications such as drone detection where a dim unresolved target is embedded into a path radiance background, sensor design and performance are highly dependent on atmospheric path radiance. Being able to predict the performance of these systems under particular weather conditions and locations has long been an important topic. MODTRAN has been a critical tool in the analysis of systems and prediction of electro-optical system performance. The authors have used MODTRAN over many years for an average system performance using the typical “pull-down” conditions in the software. This article considers the level of refinement required for a custom MODTRAN atmosphere profile to satisfactorily model an infrared camera’s performance for a specific geographic location, date, and time. The average difference between a measured sky brightness temperature and a MODTRAN predicted value is less than 0.5 °C with sufficient atmosphere profile updates. The agreement between experimental results and MODTRAN predictions indicates the effectiveness of including updated atmospheric composition, radiosonde, and air quality data from readily available Internet sources to generate custom atmosphere profiles.

scholarly journals Tailoring Carbon Nanostructure for High Frequency Supercapacitor Operation

2014 ◽  
Vol 2014 ◽  
pp. 1-7 ◽  
Author(s):  
Pritesh Hiralal ◽  
Gemma Rius ◽  
Piers Andrew ◽  
Masamichi Yoshimura ◽  
Gehan A. J. Amaratunga
Keyword(s):  
Electrical Contact ◽  
Electrochemical Capacitors ◽  
Electrochemical Capacitor ◽  
Current Collector ◽  
Electrolytic Capacitor ◽  
Carbon Nanostructure ◽  
Metal Foils ◽  
Physical Volume ◽  
And Performance ◽  
New Applications

The possibility of enhancing the frequency performance of electrochemical capacitors by tailoring the nanostructure of the carbon electrode to increase electrolyte permeability is demonstrated. Highly porous, vertically oriented carbon electrodes which are in direct electrical contact with the metallic current collector are produced via MPECVD growth on metal foils. The resulting structure has a capacitance and frequency performance between that of an electrolytic capacitor and an electrochemical capacitor. Fully packaged devices are produced on Ni and Cu current collectors and performance compared to state-of-the-art electrochemical capacitors and electrolytic capacitors. The extension of capacitive behavior to the AC regime (~100 Hz) opens up an avenue for a number of new applications where physical volume of the capacitor may be significantly reduced.

scholarly journals Utilizing Steering Entropy as a Measure of Performance in Head-mounted Augmented Reality

2019 ◽  
Vol 63 (1) ◽  
pp. 63-67
Author(s):  
Kelly A. Sprehn ◽  
Tristan C. Endsley ◽  
Kimberly J. Ryan
Keyword(s):  
Augmented Reality ◽  
Human Performance ◽  
Measurement Theory ◽  
Display Type ◽  
Movement Data ◽  
Entropy Measurement ◽  
And Performance ◽  
Microsoft Hololens ◽  
Measure Of Performance ◽  
New Applications

The next phase of augmented reality (AR) technologies suggest that as both the hardware and software continue to improve, we can expect that AR will become more commonly used as a tool for a variety of applications in complex operational contexts (i.e. training, manufacturing, mission planning). As new applications are designed and developed within these contexts, there is a necessity to be able to measure the effectiveness of these systems and to understand their impact on human performance and workload, so that only the most appropriate designs are selected for use, growing the technology in usefulness, not novel hindrances. A unique opportunity presented by the Microsoft HoloLens platform, as an example of head-worn AR systems, is the ability to collect positional and movement data, which lends itself to the computation of behavioral (or steering) entropy data, which can be related to human workload and performance within the system environment. However, little reference exists to be able to verify the accuracy of tracking of the device with regards to the output data available for collection. Within this practitioner-oriented paper, we extend current entropy measurement theory typically used in control settings within a heads-up display type ‘controls' environment. Our findings indicate that in-situ measurements of entropy utilizing the onboard sensors within the AR platform are more accurate to those collected within a Motion Capture Facility. Extending this work, these measurements can be used as a correlate of performance.

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