A universal approach for irreversible bonding of rigid substrate-based microfluidic devices at room temperature

2018 ◽  
Vol 22 (2) ◽  
Author(s):  
Xiaoyong Ku ◽  
Guisheng Zhuang ◽  
Gang Li
Keyword(s):  
Room Temperature ◽  
Microfluidic Devices ◽  
Rigid Substrate ◽  
Universal Approach

scholarly journals Approach to Fabricate Rigid Substrate for 2.4 GHz Inverted-F Antenna Using a Room Temperature Curable Dielectric Ink on Photo and Nanopaper

2018 ◽  
Vol 47 (7) ◽  
pp. 3957-3962 ◽  
Author(s):  
A. K. Sowpati ◽  
M. Nelo ◽  
J. Varghese ◽  
H. Liimatainen ◽  
M. Visanko ◽  
...  
Keyword(s):  
Room Temperature ◽  
Rigid Substrate

Organic Solvent Fumigation Bonding for Multi-Layer Poly(methyl Methacrylate) Microfluidic Device

2014 ◽  
Vol 609-610 ◽  
pp. 654-659 ◽  
Author(s):  
He Zhang ◽  
Xiao Wei Liu ◽  
Li Tian ◽  
Xiao Wei Han ◽  
Yao Liu
Keyword(s):  
Low Temperature ◽  
Organic Solvent ◽  
Methyl Methacrylate ◽  
Room Temperature ◽  
Microfluidic Devices ◽  
Saturated Steam ◽  
Silicone Adhesive ◽  
Cover Sheet ◽  
Temperature And Pressure ◽  
Bonding Method

In this paper, a novel bonding method for microfluidic devices was presented. The organic solvent fumigation bonding method can be used to produce multi-layer PMMA microfluidic devices under the condition of room temperature and low pressure. During the bonding, we choose chloroform as bonding solvents, the polyimide tape was used to protect no-need-bonding side of the cover sheet and the sealant silicone adhesive was used to protect the microstructure in the bonding side. The substrate was fumigated for 5minutes in the saturated steam conditions, then remove the polyimide tape as well as the sealant silicone adhesive. Assemble the fumigation cover sheet to the substrate with microchannel by using fixtures, soon after put the fixture and the substrates into the oven, dried at 50 °C for 10 minutes. Finally, remove the fixture, the bonding complete. Because of the bonding was accomplished under conditions of low temperature and pressure, the deformation of microchannel is very small. When the method was used for multilayer chip bonding, it also achieved good results.

Room-temperature intermediate layer bonding for microfluidic devices

Lab on a Chip ◽  
2009 ◽  
Vol 9 (24) ◽  
pp. 3481 ◽  
Author(s):  
Jacob Bart ◽  
Roald Tiggelaar ◽  
Menglong Yang ◽  
Stefan Schlautmann ◽  
Han Zuilhof ◽  
...  
Keyword(s):  
Intermediate Layer ◽  
Room Temperature ◽  
Microfluidic Devices

scholarly journals Heat and pressure-resistant room temperature irreversible sealing of hybrid PDMS–thermoplastic microfluidic devices via carbon–nitrogen covalent bonding and its application in a continuous-flow polymerase chain reaction

RSC Advances ◽  
2020 ◽  
Vol 10 (28) ◽  
pp. 16502-16509 ◽  
Author(s):  
Rajamanickam Sivakumar ◽  
Kieu The Loan Trinh ◽  
Nae Yoon Lee
Keyword(s):  
Polymerase Chain Reaction ◽  
Continuous Flow ◽  
Room Temperature ◽  
Microfluidic Devices ◽  
Covalent Bonding ◽  
Chain Reaction ◽  
Polymerase Chain

In this study, we have introduced a facile room-temperature strategy for irreversibly sealing polydimethylsiloxane to various thermoplastics using (3-aminopropyl)triethoxysilane (APTES) and [2-(3,4-epoxycyclohexyl)ethyl]trimethoxysilane (ECTMS).

Microfluidic device fabrication mediated by surface chemical bonding

The Analyst ◽  
2020 ◽  
Vol 145 (12) ◽  
pp. 4096-4110 ◽  
Author(s):  
Rajamanickam Sivakumar ◽  
Nae Yoon Lee
Keyword(s):  
Microfluidic Device ◽  
Chemical Bonding ◽  
Atmospheric Pressure ◽  
Room Temperature ◽  
Microfluidic Devices ◽  
Device Fabrication ◽  
Surface Chemical

This review discusses on various bonding techniques for fabricating microdevices with a special emphasis on the modification of surface assisted by the use of chemicals to assemble microfluidic devices at room temperature under atmospheric pressure.

A room-temperature bonding technique for the packaging of hydrogel-based hybrid microfluidic devices

2015 ◽  
Vol 19 (1) ◽  
pp. 31-41 ◽  
Author(s):  
Tommaso Santaniello ◽  
Yunsong Yan ◽  
Alessandro Tocchio ◽  
Federico Martello ◽  
Paolo Milani ◽  
...  
Keyword(s):  
Room Temperature ◽  
Microfluidic Devices ◽  
Bonding Technique

scholarly journals A Recent Approach towards Fluidic Microstrip Devices and Gas Sensors: A Review

Electronics ◽  
2022 ◽  
Vol 11 (2) ◽  
pp. 229
Author(s):  
Suleiman Aliyu Babale ◽  
Kashif Nisar Paracha ◽  
Sarosh Ahmad ◽  
Sharul Kamal Abdul Rahim ◽  
Zainab Yunusa ◽  
...  
Keyword(s):  
Gas Sensors ◽  
Liquid Metals ◽  
Microfluidic Devices ◽  
Rigid Substrate ◽  
Conducting Path ◽  
Recent Approach ◽  
Microwave Component ◽  
Fluidic Devices ◽  
Communication Devices ◽  
Key Features

This paper aims to review some of the available tunable devices with emphasis on the techniques employed, fabrications, merits, and demerits of each technique. In the era of fluidic microstrip communication devices, versatility and stability have become key features of microfluidic devices. These fluidic devices allow advanced fabrication techniques such as 3D printing, spraying, or injecting the conductive fluid on the flexible/rigid substrate. Fluidic techniques are used either in the form of loading components, switching, or as the radiating/conducting path of a microwave component such as liquid metals. The major benefits and drawbacks of each technology are also emphasized. In this review, there is a brief discussion of the most widely used microfluidic materials, their novel fabrication/patterning methods.

Compact and Thermosensitive Micropump Inspired by Plant Leaf

2017 ◽  
Author(s):  
Hyejeong Kim ◽  
Kiwoong Kim ◽  
Sang Joon Lee
Keyword(s):  
Drug Delivery ◽  
Flow Rate ◽  
Room Temperature ◽  
Microfluidic Devices ◽  
Power Source ◽  
Temperature Changes ◽  
Responsive Polymer ◽  
Response To Temperature ◽  
Essential Prerequisite ◽  
Drug Delivery Devices

Liquid transportation without employing a bulky power source, often observed in nature, has been an essential prerequisite for smart applications of microfluidic devices. In this report, a leaf-inspired micropump (LIM) which is composed of thermo-responsive stomata inspired membrane (SIM) and mesophyll-inspired agarose cryogel (MAC) is proposed. The LIM provides a durable flow rate of 30 μl/ḣcm2 for more than 30 h at room temperature without external mechanical power source. By adapting a thermo-responsive polymer, the LIM can smartly adjust the delivery rate of a therapeutic liquid in response to temperature changes. In addition, as the LIM is compact, portable, and easily integrated into any liquid, it might be utilized as an essential component in advanced hand-held drug delivery devices.

Chemically robust succinimide-group-assisted irreversible bonding of poly(dimethylsiloxane)–thermoplastic microfluidic devices at room temperature

The Analyst ◽  
2020 ◽  
Vol 145 (21) ◽  
pp. 6887-6894
Author(s):  
Rajamanickam Sivakumar ◽  
Nae Yoon Lee
Keyword(s):  
Chemical Modification ◽  
Room Temperature ◽  
Microfluidic Devices ◽  
Surface Chemical ◽  
Amino Silane ◽  
Silicon Based ◽  
Surface Chemical Modification

This study investigates surface chemical modification using anhydride silane and amino silane reagents at room temperature (RT) to realize bonding between silicon-based PDMS and non-silicon thermoplastics.

Dependence of Intergranular Fracture on Boundary Topography and Cohesion

1973 ◽  
Vol 31 ◽  
pp. 150-151
Author(s):  
J. E. Doherty ◽  
A. F. Giamei ◽  
B. H. Kear ◽  
C. W. Steinke
Keyword(s):  
Grain Boundary ◽  
Room Temperature ◽  
Nickel Base Superalloy ◽  
Boundary Shear ◽  
Room Temperature Ductility ◽  
Solid Solution Matrix ◽  
Nickel Base ◽  
Solution Matrix ◽  
Different Levels ◽  
Base Superalloy

Recently we have been investigating a class of nickel-base superalloys which possess substantial room temperature ductility. This improvement in ductility is directly related to improvements in grain boundary strength due to increased boundary cohesion through control of detrimental impurities and improved boundary shear strength by controlled grain boundary micros true tures.For these investigations an experimental nickel-base superalloy was doped with different levels of sulphur impurity. The micros tructure after a heat treatment of 1360°C for 2 hr, 1200°C for 16 hr consists of coherent precipitates of γ’ Ni3(Al,X) in a nickel solid solution matrix.

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