Effect of nickel (Ni) on the growth rate of Cu6Sn5 intermetallic compounds between Sn–Cu–Bi solder and Cu substrate

2018 ◽  
Vol 30 (3) ◽  
pp. 2186-2191 ◽  
Author(s):  
He Gao ◽  
Fuxiang Wei ◽  
Yanwei Sui ◽  
Jiqiu Qi ◽  
Yezeng He ◽  
...  
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Cu Substrate

Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Ousama M. Abdelhadi ◽  
Leila Ladani
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Rate Constants ◽  
Solder Joints ◽  
Intermetallic Layer ◽  
Cu Substrate ◽  
Soldering Time ◽  
Diffusion Controlled ◽  
Solid Liquid ◽  
Intermetallic Layers

The effect of joint size on the interfacial reaction in the Sn3.5Ag/Cu-substrate soldering system was examined. An experiment was conducted in which parameters such as bonding time, temperature, and pressure were varied at multiple levels. The morphology and thickness of all intermetallic compounds (IMC) were analyzed using the scanning electron microscopy (SEM) and energy-dispersive X-ray spectroscopy (EDX) techniques. An examination of the microstructures of solder joints of different sizes revealed that the size of the solder joint has no effect on the type of IMCs formed during the process. It was found that the joint size significantly affected the thickness of the intermetallic layers. The Cu3Sn intermetallic layers formed in the smaller sized solder joints were found to be thicker than those in the larger sized solder joints. In all specimen sizes, the increase in the thickness of Cu3Sn intermetallic layers with soldering time was found to obey a parabolic relationship. Additionally, for the cases when eutectic solder is available in the joints, a similar soldering time and temperature dependency were found for the Cu6Sn5 IMC phase. The intermetallic growth of the Cu3Sn phase was under a volume-diffusion controlled mechanism. The growth rate constants and activation energies of intermetallic layers were also reported for different joint thicknesses. Furthermore, the growth rate constants of the Cu3Sn intermetallic layer were found to depend upon the size of the joints.

Enhanced Growth Kinetics of Intermetallic Compounds between Bi-Containing Sn-3.5Ag Solders and Cu Substrate during Aging

2005 ◽  
Vol 475-479 ◽  
pp. 2627-2630
Author(s):  
Soon Tae Kim ◽  
Joo Youl Huh
Keyword(s):  
Growth Rate ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Interfacial Reaction ◽  
Growth Kinetics ◽  
Cu Substrate ◽  
Reaction Barrier ◽  
Cu3sn Layer ◽  
Cu6sn5 Layer ◽  
Kinetics Of

The effect of adding Bi to a eutectic Sn-3.5Ag solder alloy on the growth kinetics of the intermetallic compounds (IMCs) in solder/Cu joints was examined at the aging temperatures of 130°C, 150°C and 180°C. At 150°C and 180°C, the growth rate of the Cu6Sn5 layer was significantly enhanced, but that of the Cu3Sn layer was rather reduced with increasing Bi content up to 12 wt.%. At 130°C, however, both the η and ε layers appeared to grow faster as the Bi content in the solder was increased to 12 wt.%. These results suggest that the accumulation of Bi ahead of the Cu6Sn5 layers can affect not only the interfacial reaction barrier but also the local thermodynamics at the interface between the Cu6Sn5 layer and the solder.

Intermetallic compounds formed in Sn droplet on Cu substrate under the impact of electric currents

2021 ◽  
Author(s):  
Yueying Su ◽  
Rui Zhu ◽  
Tianqing Zheng ◽  
Yanping Shen ◽  
Yanyi Xu ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Electric Currents ◽  
Cu Substrate ◽  
The Impact

Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

2005 ◽  
Vol 392 (1-2) ◽  
pp. 192-199 ◽  
Author(s):  
D.Q. Yu ◽  
C.M.L. Wu ◽  
C.M.T. Law ◽  
L. Wang ◽  
J.K.L. Lai
Keyword(s):  
Intermetallic Compounds ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Free Solder

scholarly journals Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Materials ◽  
2020 ◽  
Vol 13 (4) ◽  
pp. 831 ◽  
Author(s):  
Di Zhao ◽  
Keke Zhang ◽  
Ning Ma ◽  
Shijie Li ◽  
Chenxiang Yin ◽  
...  
Keyword(s):  
Growth Rate ◽  
Fracture Mechanism ◽  
Isothermal Aging ◽  
Solder Joints ◽  
Diffusion Mechanism ◽  
Bulk Diffusion ◽  
Cu Substrate ◽  
Dynamic Observation ◽  
Free Solder ◽  
The Relationship

Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original single scallop-type Cu6Sn5 IMC gradually evolved into a planar double-layer IMC consisting of Cu6Sn5 and Cu3Sn IMCs with isothermal aging. In particular, the Cu3Sn IMC grew towards the Cu substrate and the solder seam sides; growth toward the Cu substrate side was dominant during the isothermal aging process. The growth of Cu3Sn IMC depended on the accumulated time at a certain temperature, where the growth rate of Cu3Sn was higher than that of Cu6Sn5. Additionally, the growth of the interfacial IMC was mainly controlled by bulk diffusion mechanism, where the activation energies of Cu6Sn5 and Cu3Sn were 74.7 and 86.6 kJ/mol, respectively. The growth rate of Cu3Sn was slightly faster than that of Cu6Sn5 during isothermal aging. With increasing isothermal aging time, the shear strength of the solder joints decreased and showed a linear relationship with the thickness of Cu3Sn. The fracture mechanism of the solder joints changed from ductile fracture to brittle fracture, and the fracture pathway transferred from the solder seam to the interfacial IMC layer.

Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C

2004 ◽  
Vol 19 (12) ◽  
pp. 3560-3568 ◽  
Author(s):  
Chia-Wei Huang ◽  
Kwang-Lung Lin
Keyword(s):  
Intermetallic Compounds ◽  
Aging Time ◽  
Weight Percent ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Lead Free ◽  
Cu Substrate ◽  
Electroless Ni

The interfacial reactions of Sn–Zn based solder on Cu and Cu/Ni–P/Cu–plating substrates under aging at 150 °C were investigated in this study. The compositions of solders investigated were Sn–9Zn, Sn–8.55Zn–0.45Al, and Sn–8.55Zn–0.45Al–0.5Ag solders in weight percent. The experimental results indicated that the Cu substrate formed Cu5Zn8 with the Sn–9Zn solder and Al–Cu–Zn compound with Al–containing solders. However, it was detected that Cu6Sn5 formed at the Sn–9Zn/Cu interface and Cu5Zn8 formed at the Al–containing solders/Cu interface after aging for 1000 h. When it contacted with the Cu/Ni–P/Au substrate, the Sn–9Zn solder formed Au–Zn compound, and the Al–containing solders formed Al–Cu–Zn compound at the interface. After a long aging time, the intermetallic compounds existing between solders and the Cu/Ni–P/Au metallization layers almost did not grow. It was found that the interdiffusion between solders and Cu/Ni–P/Au was slower than that with Cu under aging. Furthermore, the addition of Ag to Sn–Zn solder resulted in the formation of AgZn3 particles at the interface.

Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate

2015 ◽  
Vol 815 ◽  
pp. 129-134 ◽  
Author(s):  
Xiao Chen Xie ◽  
Xiu Chen Zhao ◽  
Ying Liu ◽  
Jing Wei Cheng ◽  
Bing Zheng ◽  
...  
Keyword(s):  
Growth Rate ◽  
Intermetallic Compound ◽  
Rate Constant ◽  
Growth Rate Constant ◽  
Solder Joint Reliability ◽  
Ag Addition ◽  
Cu Substrate ◽  
Joint Reliability ◽  
Aging Properties ◽  
Interfacial Intermetallic Compounds

The effect of Ag content on the morphology of the intermetallic compound (IMC) layer at the interface between Sn-xAg-0.7Cu (x=0.0 wt.%, 0.3 wt.%, 0.8 wt.%, 3.0 wt.%) and Cu substrate has been investigated. After reflow, the slight addition of Ag element can suppress the growth of IMC. However, as the Ag content increases, the thickness of IMC is enhanced. After aging at 150°C, the IMC growth rate constant decreases with the addition of Ag. The IMC growth rate constant of Sn-3.0Ag-0.7Cu is 0.94864×10-5μm2/s, which is the lowest among these solders. As the Ag addition is 0.8wt% and 3.0wt%, the Cu3Sn growth rate constant is 0.16641×10-5μm2/s and 0.18496×10-5μm2/s, compared to the Sn-0.7Cu solder decreased 54% and 49%, respectively. As a result, the addition of Ag element improves the anti-aging properties and suppresses the growth of Cu3Sn layer, which leads to the improvement of solder joint reliability.

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