Mass Transport, Creep and Zero-Stress-Point Shifting in a Nano-silver Die-Attach Material During Thermal Cycling

2020 ◽  
Vol 49 (6) ◽  
pp. 3982-3989
Author(s):  
J. R. McCoppin ◽  
D. Young
Keyword(s):  
Mass Transport ◽  
Thermal Cycling ◽  
Nano Silver ◽  
Die Attach ◽  
Stress Point

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

2021 ◽  
Author(s):  
Fei Qin ◽  
Shuai Zhao ◽  
Yanwei Dai ◽  
Lingyun Liu ◽  
Tong An ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Young’S Modulus ◽  
Mechanical Performance ◽  
Young's Modulus ◽  
Silver Layer ◽  
Thermal Cycles ◽  
Nano Indentation ◽  
Die Attach ◽  
Indentation Tests ◽  
Sintered Silver

Abstract Thermo-mechanical reliability assessment for sintered silver is a crucial issue as sintered silver is a promising candidate of die-attachment materials for power devices. In this paper, the nano-indentation tests are performed for sintered silver in typical die-attach interconnection under different thermal cycles. Based on thermal cycling test, the Young's modulus and hardness of sintered silver layer have been presented. It is found that the Young's modulus and hardness of sintered silver layer changes slightly although the microstructure of sintered silver also presents some variations. The stress and strain curves for different thermal cycling tests for sintered silver based on reverse analysis of nano-indentation are also given. The results show that the elastoplastic constitutive equations change significantly after thermal cycling tests, and the yielding stress decreases remarkably after 70 thermal cycles. The experimental investigation also show that the cracking behaviors of sintered silver depends on its geometry characteristics, which implies that the possible optimization of sintered silver layer could enhance its thermo-mechanical performance.

scholarly journals Prediction of mechanical properties and fatigue life of nano silver paste in chip interconnection

2020 ◽  
Author(s):  
Hui YANG ◽  
Jihui Wu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Stress And Strain ◽  
Nano Silver ◽  
Finite Element Software ◽  
Flip Chips ◽  
Empirical Correction ◽  
Prediction Of Mechanical Properties

Abstract The simulation of nano-silver solder joints in flip-chips is performed by the finite element software ANSYS, and the stress-strain distribution results of the solder joints are displayed. In this simulation, the solder joints use Anand viscoplastic constitutive model, which can reasonably simulate the stress and strain of solder joints under thermal cycling load. At the same time this model has been embedded in ANSYS software, so it is more convenient to use. The final simulation results show that the areas where the maximum stresses and strains occur at the solder joints are mostly distributed in the contact areas between the solder joints and the copper pillars and at the solder joints. During the entire thermal cycling load process, the area where the maximum change in stress and strain occurs is always at the solder joint, and when the temperature changes, the temperature at the solder joint changes significantly. Based on comprehensive analysis, the relevant empirical correction calculation equation is used to calculate and predict the thermal fatigue life of nano-silver solder joints. The analysis results provide a reference for the application of nano-silver solder in the electronic packaging industry.

scholarly journals Thermal Assessment and In-Situ Monitoring of Insulated Gate Bipolar Transistors in Power Electronic Modules

2019 ◽  
Author(s):  
Erick Gutierrez ◽  
Kevin Lin ◽  
Douglas DeVoto ◽  
Patrick McCluskey
Keyword(s):  
Thermal Cycling ◽  
Failure Modes ◽  
Rapid Determination ◽  
Degradation Process ◽  
In Situ Monitoring ◽  
Power Module ◽  
Insulated Gate Bipolar Transistor ◽  
Die Attach ◽  
Power Modules

Abstract Insulated gate bipolar transistor (IGBT) power modules are devices commonly used for high-power applications. Operation and environmental stresses can cause these power modules to progressively degrade over time, potentially leading to catastrophic failure of the device. This degradation process may cause some early performance symptoms related to the state of health of the power module, making it possible to detect reliability degradation of the IGBT module. Testing can be used to accelerate this process, permitting a rapid determination of whether specific declines in device reliability can be characterized. In this study, thermal cycling was conducted on multiple power modules simultaneously in order to assess the effect of thermal cycling on the degradation of the power module. In-situ monitoring of temperature was performed from inside each power module using high temperature thermocouples. Device imaging and characterization were performed along with temperature data analysis, to assess failure modes and mechanisms within the power modules. While the experiment aimed to assess the potential damage effects of thermal cycling on the die attach, results indicated that wire bond degradation was the life-limiting failure mechanism.

Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technology

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000172-000177
Author(s):  
Koji Sasaki ◽  
Noritsuka Mizumura
Keyword(s):  
Shear Strength ◽  
Low Temperature ◽  
Thermal Cycling ◽  
Thick Film ◽  
Thermal Performance ◽  
Low Temperature Sintering ◽  
Thermal Cycling Test ◽  
Nano Silver ◽  
Cycling Test ◽  
Thick Film Technology

Traditional thick film technology is widely used in various electronics products. There are two type of paste based on thick film technology. Typically, over 400°C is required for high temperature sintering type which contains glass for adhesion function. It shows high electrical and thermal performance. On the other hand, 150–300°C range process is used for low temperature process type as silver epoxy. In last decade, nano silver technology shows amazing progress to address low temperature operation by low temperature sintering. This paper will discuss the results on fundamental study of newly developed nano silver pastes with unique approach which uses MO (Metallo-organic) technology and resin reinforcing technology. Nano silver pastes contain several types of dispersant as surface coating to prevent agglomeration of the particles. Various coating technique has been reported to optimize sintering performance and stability. MO technology provides low temperature sintering capability by minimizing the coating material. The nano silver pastes show high electrical and thermal performance. However, degradation of die shear strength has been found by thermal cycling test due to the fragility of porous sintered structure. To improve the mechanical property, resin reinforcing technology has been developed. By adding special resin to the pastes, the porous area is filled with the resin and the sintered structure is reinforced. Degradation of die shear strength was not found by thermal cycling test to 1000 cycles. Nano silver pastes using MO technology and resin reinforcing technology will meet lots of requirement on various thick film applications.

High Temperature Reliability of High-power LED Module Using Die Attach Material of Nano-silver Paste

2016 ◽  
Vol 37 (9) ◽  
pp. 1159-1165
Author(s):  
陈佳 CHEN Jia ◽  
李欣 LI Xin ◽  
孔亚飞 KONG Ya-fei ◽  
梅云辉 MEI Yun-hui ◽  
陆国权 LU Guo-quan
Keyword(s):  
High Temperature ◽  
High Power ◽  
Silver Paste ◽  
Nano Silver ◽  
Die Attach ◽  
High Power Led

scholarly journals Formation Mechanisms of Thermal Fatigue Crack Networks in Sn-Ag-Cu Die-attach Joint in High Speed Thermal Cycling

2020 ◽  
Vol 9 (5) ◽  
pp. 224-231 ◽  
Author(s):  
Hiroshige SUGIMOTO ◽  
Yoshiharu KARIYA ◽  
Yoshiki ABE ◽  
Ryuichiro HANADA ◽  
Yoshinori YOKOYAMA ◽  
...  
Keyword(s):  
Fatigue Crack ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
High Speed ◽  
Formation Mechanisms ◽  
Thermal Fatigue Crack ◽  
Die Attach

Development of BiAgX® HT Solder Paste for 200°C Application

2016 ◽  
Vol 2016 (HiTEC) ◽  
pp. 000128-000133 ◽  
Author(s):  
Hongwen Zhang ◽  
Jonathan Minter ◽  
Ning-Cheng Lee
Keyword(s):  
Shear Strength ◽  
Thermal Cycling ◽  
Melting Temperature ◽  
Thermal Aging ◽  
Joint Strength ◽  
Solder Paste ◽  
Thermal Cycling Test ◽  
Cycling Test ◽  
Die Attach ◽  
Board Level

Abstract BiAgX® paste with the remelting temperature around 262°C has been tested and adopted successfully for die attach applications [1–5]. BiAgX® HT pastes with the enhanced remelting temperature above 265°C have been designed for the application of 200°C or even higher. The joint strength has been well maintained for most of the tested pastes after thermal aging @ 200°C for 1000hrs. The thermal cycling test (from −55°C to 200°C) degrades the bond shear strength but some of the tested pastes can still keep the joint strength well above IEC standard (IEC 60749-19) required. The melting temperature and the reliability have been observed to closely associate with the alloying elements Z%wt. The BiAgX® pastes have also been modified for board level assembly application. BiAgX® solder wire is under development too.

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