Thermal Management Strategies for Three-Dimensional ICs

2017 ◽  
pp. 333-379
Author(s):  
Vasilis F. Pavlidis ◽  
Ioannis Savidis ◽  
Eby G. Friedman
Keyword(s):  
Thermal Management ◽  
Management Strategies ◽  
Three Dimensional

scholarly journals THERMAL MODEL FOR ELECTROMAGNETIC LAUNCHERS

2008 ◽  
Vol 7 (2) ◽  
pp. 60
Author(s):  
H. Zhao ◽  
J. A. Souza ◽  
J. C. Ordonez
Keyword(s):  
Thermal Management ◽  
Body Movement ◽  
Management Strategies ◽  
Three Dimensional ◽  
Temperature Response ◽  
Heat Diffusion ◽  
Transient Temperature ◽  
Three Dimensional Model ◽  
Electromagnetic Launchers ◽  
Electromagnetic Launcher

This paper presents a 3D model for the determination of the temperature field in an electromagnetic launcher. The large amounts of energy that are dissipated into the structure of an electromagnetic launcher during short periods of time lead to a complicated thermal management situation. Effective thermal management strategies are necessary in order to maintain temperatures under acceptable limits. This paper constitutes an attempt to determine the temperature response of the launcher. A complete three-dimensional model has been developed. It combines rigid body movement, electromagnetic effects and heat diffusion together. The launcher consists of two parallel rectangular rails and an armature moving between them. Preliminary results show the current distribution on the rail cross-section, the localized resistive heating, and the rail transient temperature response. The simulation results are compared to prior work presented for a 2D geometry by Powell and Zielinski (2008).

A Review of Recent Advances in Thermal Management in Three Dimensional Chip Stacks in Electronic Systems

2011 ◽  
Vol 133 (4) ◽  
Author(s):  
Vikram Venkatadri ◽  
Bahgat Sammakia ◽  
Krishnaswami Srihari ◽  
Daryl Santos
Keyword(s):  
Thermal Analysis ◽  
Integrated Circuits ◽  
Thermal Management ◽  
Management Strategies ◽  
Research Work ◽  
Experimental Studies ◽  
Three Dimensional ◽  
3D Integration ◽  
The Past ◽  
Planar Circuits

Three dimensional (3D) integration offers numerous electrical advantages like shorter interconnection distances between different dies in the stack, reduced signal delay, reduced interconnect power and design flexibilities. The main enabler of 3D integration is through-silicon-vias (TSVs) and stacking of multiple dies. Irrespective of these advantages, thermal management in 3D stacks poses significant challenges for the implementation of 3D integrated circuits. Even though extensive research work has been done in understanding the thermal management in two dimensional (2D) planar circuits for the past several decades, 3D integration offers a new set of challenges in terms of thermal management, which makes it difficult to readily apply the thermal management strategies available for 2D planar circuits. Over the past decade, some work has been done in thermal analysis and management of 3D stacks but still, knowledge is scattered and a comprehensive understanding is lacking. This research work focuses on bringing together the limited work on thermal analysis and thermal management in 3D vertically integrated circuits available in the literature. A compilation and analysis of the results from investigations on thermal management in 3D stacks is presented in this review with special emphasis on experimental studies conducted on different thermal management strategies. Furthermore, 3D integration technologies, thermal management challenges, and advanced 2D thermal management solutions are discussed.

scholarly journals Thermal management strategies for gallium oxide vertical trench-fin MOSFETs

2021 ◽  
Vol 129 (8) ◽  
pp. 085301
Author(s):  
Robert H. Montgomery ◽  
Yuewei Zhang ◽  
Chao Yuan ◽  
Samuel Kim ◽  
Jingjing Shi ◽  
...  
Keyword(s):  
Thermal Management ◽  
Gallium Oxide ◽  
Management Strategies

Thermal Characterization of Interlayer Microfluidic Cooling of Three-Dimensional Integrated Circuits With Nonuniform Heat Flux

2010 ◽  
Vol 132 (4) ◽  
Author(s):  
Yoon Jo Kim ◽  
Yogendra K. Joshi ◽  
Andrei G. Fedorov ◽  
Young-Joon Lee ◽  
Sung-Kyu Lim
Keyword(s):  
Integrated Circuits ◽  
Mass Flow Rate ◽  
Thermal Management ◽  
Mass Flow ◽  
Flow Rate ◽  
Single Phase ◽  
Hot Spot ◽  
Three Dimensional ◽  
Two Phase ◽  
Two Phase Cooling

It is now widely recognized that the three-dimensional (3D) system integration is a key enabling technology to achieve the performance needs of future microprocessor integrated circuits (ICs). To provide modular thermal management in 3D-stacked ICs, the interlayer microfluidic cooling scheme is adopted and analyzed in this study focusing on a single cooling layer performance. The effects of cooling mode (single-phase versus phase-change) and stack/layer geometry on thermal management performance are quantitatively analyzed, and implications on the through-silicon-via scaling and electrical interconnect congestion are discussed. Also, the thermal and hydraulic performance of several two-phase refrigerants is discussed in comparison with single-phase cooling. The results show that the large internal pressure and the pumping pressure drop are significant limiting factors, along with significant mass flow rate maldistribution due to the presence of hot-spots. Nevertheless, two-phase cooling using R123 and R245ca refrigerants yields superior performance to single-phase cooling for the hot-spot fluxes approaching ∼300 W/cm2. In general, a hybrid cooling scheme with a dedicated approach to the hot-spot thermal management should greatly improve the two-phase cooling system performance and reliability by enabling a cooling-load-matched thermal design and by suppressing the mass flow rate maldistribution within the cooling layer.

Electrochemical-Thermal Modeling to Evaluate Battery Thermal Management Strategies

2014 ◽  
Vol 162 (1) ◽  
pp. A137-A148 ◽  
Author(s):  
Todd Bandhauer ◽  
Srinivas Garimella ◽  
Thomas F. Fuller
Keyword(s):  
Thermal Management ◽  
Thermal Modeling ◽  
Management Strategies ◽  
Battery Thermal Management

Enhancing Mimetic Three-Dimensional Modeling and Printing for Presurgical Planning Applications: Improved Soft Tissue Assesments, Analyses and Consolidation Strategies

2020 ◽  
Author(s):  
Jorge A. Vergen ◽  
Tinen L. Iles ◽  
Paul A. Iaizzo
Keyword(s):  
Soft Tissue ◽  
3D Printing ◽  
Soft Tissues ◽  
Management Strategies ◽  
Three Dimensional ◽  
University Of Minnesota ◽  
Biaxial Testing ◽  
Presurgical Planning ◽  
Three Dimensional Modeling ◽  
Planning Models

Abstract Mimetic three-dimensional (3D) printing has been shown to enhance presurgical planning and improve patient outcomes. However, data inconsistencies and non-optimized soft tissue data management strategies have impaired efforts to characterize soft tissues and translate biophysical values to 3D printing media durometers and shore values. As a result, finished models are inconsistent and exhibit reduced mimetic qualities. Improving biophysical characterizations of soft tissues, analysis strategies, and consolidation infrastructures are important factors that will improve 3D modeling in a presurgical planning setting. In our ongoing associated studies, both physiologically viable and formalin fixed large mammalian tissues (including human) were assessed using uniaxial and biaxial testing strategies. Biophysical datasets were analyzed using a gated analysis strategy, tailored to data acquisition methods developed within the University of Minnesota Visible Heart® Labs (VHL). A SQL database was then constructed to consolidate analyzed data for future retrieval. This strong preliminary data is a foundation for further development and refinement of future studies. It is our long-term goal that these strategies be improved and adopted to enhance the mimetic qualities of 3D presurgical planning models.

Thermal Management of Air-Cooling Lithium-Ion Battery Pack

2021 ◽  
Vol 38 (11) ◽  
pp. 118201
Author(s):  
Jianglong Du ◽  
Haolan Tao ◽  
Yuxin Chen ◽  
Xiaodong Yuan ◽  
Cheng Lian ◽  
...  
Keyword(s):  
Lithium Ion Battery ◽  
Thermal Management ◽  
Thermal Performance ◽  
Three Dimensional ◽  
Lithium Ion ◽  
Battery Pack ◽  
Cooling Effect ◽  
Air Cooling ◽  
Safety Issues ◽  
Battery Packs

Lithium-ion battery packs are made by many batteries, and the difficulty in heat transfer can cause many safety issues. It is important to evaluate thermal performance of a battery pack in designing process. Here, a multiscale method combining a pseudo-two-dimensional model of individual battery and three-dimensional computational fluid dynamics is employed to describe heat generation and transfer in a battery pack. The effect of battery arrangement on the thermal performance of battery packs is investigated. We discuss the air-cooling effect of the pack with four battery arrangements which include one square arrangement, one stagger arrangement and two trapezoid arrangements. In addition, the air-cooling strategy is studied by observing temperature distribution of the battery pack. It is found that the square arrangement is the structure with the best air-cooling effect, and the cooling effect is best when the cold air inlet is at the top of the battery pack. We hope that this work can provide theoretical guidance for thermal management of lithium-ion battery packs.

Assessment of Some Integrated Cooling Mechanisms for an Active IPEM

2004 ◽  
Author(s):  
Y. Pang ◽  
E. Scott ◽  
J. D. van Wyk ◽  
Z. Liang
Keyword(s):  
Power Electronics ◽  
Thermal Management ◽  
Three Dimensional ◽  
The Other ◽  
Other Hand ◽  
3D Packaging ◽  
3D Package

With the growing demands on the performance, cost, and advances in packaging and interconnection technology, three-dimensional (3D) packaging provides higher density packaging. On the other hand, thermal management of the 3D package becomes a very important issue. This paper assesses the various possibilities of integrated thermal management for integrated power electronics modules (IPEMs).

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