Temperature-dependent interface characteristic of silicon wafer bonding based on an amorphous germanium layer deposited by DC-magnetron sputtering
2018 ◽
Vol 434
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pp. 433-439
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1991 ◽
Vol 30
(Part 1, No. 4)
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pp. 615-622
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2010 ◽
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pp. 731-734
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Vol 27
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pp. 1112-1116
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2017 ◽
Vol 9
(5)
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pp. 05035-1-05035-6
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2005 ◽
Vol 200
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pp. 862-866
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Vol 4
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pp. 6311-6316
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