Profit and performance boost of straight, wavy, and combined minichannel heat sinks by counter-current pattern

2021 ◽  
Vol 43 ◽  
pp. 103220
Author(s):  
Morteza Khoshvaght-Aliabadi ◽  
Amir Feizabadi
Keyword(s):  
Heat Sinks ◽  
Current Pattern ◽  
And Performance ◽  
Counter Current

Design of Optimum Plate-Fin Natural Convective Heat Sinks

2003 ◽  
Vol 125 (2) ◽  
pp. 208-216 ◽  
Author(s):  
Avram Bar-Cohen ◽  
Madhusudan Iyengar ◽  
Allan D. Kraus
Keyword(s):  
Nusselt Number ◽  
Specific Heat ◽  
Rectangular Plate ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Thermal Design ◽  
Heat Sinks ◽  
And Performance ◽  
Nusselt Number Correlation ◽  
The Impact

The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.

Thermal Management of Downhole Oil and Gas Logging Sensors for HTHP Applications Using Nanoporous Materials

2007 ◽  
Author(s):  
Saeed Rafie
Keyword(s):  
Oil And Gas ◽  
Electrical Response ◽  
Heat Sinks ◽  
Transient Temperature ◽  
Nanoporous Material ◽  
Electronic Components ◽  
Thermal Shield ◽  
One Dimensional ◽  
And Performance ◽  
Downhole Temperature

One of the main challenges in designing oil & gas downhole wireline logging tools for high temperature and high pressure (HTHP) environments is to put together the most efficient thermal packaging to enhance the tool’s temperature survival time. In general, not all electronic components and sensors can withstand severe downhole temperature (max 500 degrees Fahrenheit). For those heat sensitive components, their electrical response and performance either decay or in some cases they completely fail when their temperature exceeds 300° F. In oil & gas wireline logging applications, the heat sensitive components can be thermally protected inside a Dewar vacuum flask that includes one or two thermal isolators and heat sinks. Cooler electronic components results in longer logging times that lead to a much higher performance and profitability. This paper first discusses the development of a one-dimensional analytical model to determine the transient temperature of heat sensitive sensors and electronic components in wireline logging tools. Second, it introduces a new and improved thermal packaging scheme based on a newly developed and commercially available nanoporous material. This material has a very low thermal conductivity and is used as a thermal shield between the outside environment and the electronics inside the flask. The new packaging scheme also includes a new design for the heat sink which is made of several solid disks separated by this nanoporous material. Results from this new design have shown roughly a 30% improvement compared with the conventional design. Results from both analytical and laboratory tests are discussed in this paper.

scholarly journals Cooling Ability/Capacity and Exergy Penalty Analysis of Each Heat Sink of Modern Supersonic Aircraft

Entropy ◽  
2019 ◽  
Vol 21 (3) ◽  
pp. 223 ◽  
Author(s):  
Yu-Feng Mao ◽  
Yun-Ze Li ◽  
Ji-Xiang Wang ◽  
Kai Xiong ◽  
Jia-Xin Li
Keyword(s):  
Heat Sink ◽  
Control Algorithm ◽  
Heat Sinks ◽  
Supersonic Aircraft ◽  
Thermal Management System ◽  
Performance Penalty ◽  
And Performance ◽  
Extra Weight ◽  
Heat Loads ◽  
Cooling Ability

The aerospace-based heat sink is defined as a substance used for dissipating heat generated by onboard heat loads. They are becoming increasingly scarce in the thermal management system (TMS) of advanced aircraft, especially for supersonic aircraft. In the modern aircraft there are many types of heat sinks whose cooling abilities and performance penalties are usually obviously different from each other. Besides, the cooling ability and performance penalty of a single heat sink is even different under different flight conditions—flight altitude, Mach number, etc. In this study, the typical heat sinks which are the fuel mass, ram air, engine fan air, skin heat exchanger, and expendable heat sink will be studied. Their cooling abilities/capacities, and exergy penalties under different flight conditions have been systematically estimated and compared with each other. The exergy penalty presented in this paper refers to the exergy loss of aircraft caused by the extra weight, drag and energy extraction of various heat sinks. The estimation models, as well as the results and discussion have been elaborated in this paper, which can be can be used to further optimize the TMS of modern advanced aircraft, for example, the layout design of various heat sinks and the improvement the control algorithm.

Heat Sink Fin Number Variation Analysis on Single Chip High Power LED

2014 ◽  
Vol 487 ◽  
pp. 149-152 ◽  
Author(s):  
Zaliman Sauli ◽  
Rajendaran Vairavan ◽  
Vithyacharan Retnasamy
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Photon Emission ◽  
Heat Sinks ◽  
Junction Temperature ◽  
Single Chip ◽  
High Power Led ◽  
Number Variation ◽  
And Performance ◽  
Work Done

Thermal management of high power LED is crucial the reliability and performance of the LED affected by the heat produced during photon emission. Heat sinks are utilized to dissipate the heat and to lower the operating junction temperature of LED. This paper demonstrates a simulation work done to evaluate the influence heat sink fin number on the junction temperature and stress of single chip LED package using Ansys version 11. The heat sink with fin number of 4 fins, 6 fins and 8 fins were used and compared. Results showed that increase in heat sink fin number significantly reduces the junction temperature of the LED package.

Heat Sink Capabilities and Limitations: A Hierarchical Evaluation of Leading Thermal Technologies

2005 ◽  
Author(s):  
Scott D. Garner
Keyword(s):  
Heat Pipe ◽  
Heat Sink ◽  
Technical Conference ◽  
Appropriate Technology ◽  
Heat Sinks ◽  
Conductive Heat ◽  
Transition Points ◽  
And Performance ◽  
Commercial Applications ◽  
Hierarchical Evaluation

This paper discusses the pros, cons and performance capabilities of a variety of thermal solutions including: conductive heat sinks, heat pipe assisted heat sinks, and pumped single solutions. The goal of the paper is to map performance regimes for various thermal solutions that will quickly allow thermal designers to select the appropriate technology for their requirements. The paper presents current technologies in a progressive manner discussing performance capabilities and limitations. Although innovative designs exist in every class of sink that push the capabilities of the technology there are basic limitations that define the overall performance envelops, and thus the need to move up the performance heirarchy to the next performance level. The limitations to conductive heat sinks are addressed and correlated to the industries transition to heat pipe assisted heat sinks starting with notebooks and currently progressing into the desktop segment. A brief section addresses solid metal conductive heat sinks with discussions focused on the physical limitation set by conduction which limits overall heat sink volume which in turn can be correlated to a maximum power that can be dissipated in standard commercial applications. The analysis presented and conclusions will be correlated to CPU power and the markets adoption of heat pipe assisted heat sinks. A more extensive section is devoted to heat pipe assisted heat sinks their pros, cons and physical limitations. A similar analysis as discussed in the first section of the paper outlines the anticipated transition points for pumped single phase solutions.   This paper was also originally published as part of the Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems.

Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks

1994 ◽  
Vol 116 (3) ◽  
pp. 206-211 ◽  
Author(s):  
R. A. Wirtz ◽  
Weiming Chen ◽  
Ronghua Zhou
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Thermal Performance ◽  
Heat Sink ◽  
Design Guidelines ◽  
Heat Sinks ◽  
Air Cooling ◽  
Regular Array ◽  
Electronic Package ◽  
And Performance

Heat transfer experiments are reported on the thermal performance of longitudinal fin heat sinks attached to an electronic package which is part of a regular array of packages undergoing forced convection air cooling. The effect of coolant bypass on the performance of the heat sink is assessed and performance correlations for reduced heat transfer due to this effect are developed. These correlations are used to develop design guidelines for optimal performance.

Sign in / Sign up

Export Citation Format

Share Document